公开(公告)号：US20230318211A1

公开(公告)日：2023-10-05

申请号：US18130404

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Xiang Li ,  Shaohua Li ,  Jingbo Li ,  Mo Liu ,  Kai Xiao ,  Kai Wang

IPC: H01R12/72 ,  H01R13/52 ,  H01R4/02

CPC classification number: H01R12/721 ,  H01R13/5219 ,  H01R13/5216 ,  H01R4/023 ,  H05K7/20236

Abstract: Methods and apparatus relating to liquid-proof edge connector solutions for immersion cooling are described. In one embodiment, a seal prevents a cooling liquid to cause electrical contact with a pin of an edge card to be inserted in a connector. And, an adhesive prevents the cooling liquid to cause electrical contact with a terminal of the connector. Other embodiments are also claimed and disclosed.

公开(公告)号：US20220336986A1

公开(公告)日：2022-10-20

申请号：US17855077

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Xiang Li ,  Howard Heck ,  Jingbo Li

IPC: H01R13/03 ,  H01R12/72 ,  H01R13/11

Abstract: Methods and apparatus relating to a gold finger design for differential edge cards are described. In one embodiment, a signal finger comprises a first portion to communicate electrical signals between a signal pin of a card connector and a card; and a second portion to provide a mechanical wiping surface for the signal pin. Other embodiments are also claimed and disclosed.

公开(公告)号：US11276911B2

公开(公告)日：2022-03-15

申请号：US16164352

申请日：2018-10-18

Applicant: Intel Corporation

Inventor： Jingbo Li ,  Kai Xiao ,  Howard Heck ,  Kai Wang

IPC: H01P5/02 ,  H01B7/04 ,  H01P3/02 ,  H01R12/73 ,  H01P5/08 ,  H01R24/60

Abstract: In accordance with embodiments disclosed herein, there is provided a high-density low-loss cable and connector assembly. A cable assembly includes a first cable connector, a bulk cable section, and a first cable transition section. The bulk cable section includes a first plurality of conductive wires of a first wire thickness. The first cable transition section includes a second plurality of conductive wires that has a first distal end connected to the bulk cable section and a second distal end connected to the first cable connector. Each of the second plurality of conductive wires transitions from the first wire thickness at the first distal end to a second wire thickness that is less than the first wire thickness at the second distal end. Each of the second plurality of conductive wires in the first distal end is connected to a corresponding conductive wire of the first plurality of conductive wires.

公开(公告)号：US20210203094A1

公开(公告)日：2021-07-01

申请号：US17202961

申请日：2021-03-16

Applicant: Intel Corporation

Inventor： Xiang Li ,  Mo Liu ,  Shaohua Li ,  Jingbo Li ,  Kai Xiao

IPC: H01R12/73 ,  H01R12/57 ,  H01R12/72 ,  H01R13/26 ,  H05K1/18

Abstract: In one embodiment, a card edge connector includes: a housing having an opening into which a first circuit board is to be inserted; a plurality of pins each having a first end and a second end, the plurality of pins extending from within the opening through a bottom surface of the housing, the first end of the first plurality of pins to mate with a corresponding contact of the first circuit board; and a plurality of ball grid array (BGA) solder balls each adapted at the second end of a corresponding one of the plurality of pins, the plurality of pins to mate with a corresponding conductive area of a second circuit board to which the card edge connector mates via the plurality of BGA solder balls. Other embodiments are described and claimed.