公开(公告)号：US08997524B2

公开(公告)日：2015-04-07

申请号：US13464488

申请日：2012-05-04

Applicant: Bo Yun Jang ,  Jin Seok Lee ,  Joon Soo Kim ,  Young Soo Ahn

Inventor： Bo Yun Jang ,  Jin Seok Lee ,  Joon Soo Kim ,  Young Soo Ahn

IPC: C01B33/037 ,  C30B13/22

CPC classification number: C01B33/037 ,  B01J6/007 ,  B01J19/085 ,  B01J2219/00135 ,  C30B13/22

Abstract: Methods and apparatus for manufacturing high purity polysilicon. The apparatus includes a vacuum chamber; first and second electron guns disposed at an upper side of the vacuum chamber to irradiate electron beams into the vacuum chamber; a silicon melting unit which is placed on a first electron beam-irradiating region corresponding to the first electron gun and to which powdery raw silicon is fed and melted by the first electron beam; and a unidirectional solidification unit placed on a second electron beam-irradiating region corresponding to the second electron gun. The unidirectional solidification unit is provided therein with a start block driven in a downward direction to transfer molten silicon in the downward direction and is formed at a lower side thereof with a cooling channel. The start block includes a dummy bar having a silicon button joined to an upper portion of the dummy bar.

Abstract translation: 制造高纯度多晶硅的方法和装置。 该装置包括真空室; 第一和第二电子枪设置在真空室的上侧以将电子束照射到真空室中; 硅熔融单元，其放置在对应于第一电子枪的第一电子束照射区域上，并且通过第一电子束将粉末原料硅熔化; 以及放置在对应于第二电子枪的第二电子束照射区域上的单向凝固单元。 单向凝固单元在其中设置有向下驱动的起始块，以沿向下方向转移熔融硅，并在其下侧形成有冷却通道。 起始块包括具有连接到虚拟棒的上部的硅按钮的虚拟棒。

公开(公告)号：US08794035B2

公开(公告)日：2014-08-05

申请号：US13464416

申请日：2012-05-04

Applicant: Bo Yun Jang ,  Jin Seok Lee ,  Joon Soo Kim ,  Young Soo Ahn

Inventor： Bo Yun Jang ,  Jin Seok Lee ,  Joon Soo Kim ,  Young Soo Ahn

IPC: C01B33/037 ,  C30B13/22

CPC classification number: C01B33/037 ,  C30B11/003 ,  C30B13/22 ,  C30B29/06

Abstract: Apparatus and method for manufacturing high purity polysilicon. The apparatus includes a vacuum chamber maintaining a vacuum atmosphere; first and second electron guns disposed at an upper side of the vacuum chamber to irradiate electron beams into the vacuum chamber; a silicon melting unit placed on a first electron beam-irradiating region corresponding to the first electron gun and in which powdery raw silicon is placed and melted by the first electron beam; and a unidirectional solidification unit placed on a second electron beam-irradiating region corresponding to the second electron gun and connected to the silicon melting unit via a runner. The unidirectional solidification unit is formed at a lower part thereof with a cooling channel and is provided therein with a start block driven in a downward direction.

Abstract translation: 用于制造高纯度多晶硅的装置和方法。 该装置包括保持真空气氛的真空室; 第一和第二电子枪设置在真空室的上侧以将电子束照射到真空室中; 放置在对应于第一电子枪的第一电子束照射区域上的硅熔融单元，其中粉状原料硅由第一电子束放置和熔化; 以及放置在与第二电子枪相对应的第二电子束照射区域上的单向凝固单元，并且经由流道连接到硅熔融单元。 单向凝固单元在其下部形成有冷却通道，并且在其中设置有向下驱动的起始块。

公开(公告)号：US08758513B2

公开(公告)日：2014-06-24

申请号：US11639224

申请日：2006-12-15

Applicant: Jin Seok Lee ,  Hyuk Sang Yoon ,  Hwan Kyu Yoo ,  Byeong Eok Hwang

Inventor： Jin Seok Lee ,  Hyuk Sang Yoon ,  Hwan Kyu Yoo ,  Byeong Eok Hwang

IPC: C23F1/00 ,  C23C16/00

CPC classification number: H01L21/67173 ,  C23C14/50 ,  C23C14/568

Abstract: A processing apparatus includes a loading chamber; a buffer chamber connected to the loading chamber; a first process chamber connected to the buffer chamber; and an unloading chamber connected to the first process chamber, wherein a processing path through the processing apparatus is a forward in-line path in a direction through the loading chamber, the buffer chamber, the first process chamber, and the unloading chamber.

Abstract translation: 一种处理装置，包括装载室; 连接到所述装载室的缓冲室; 连接到缓冲室的第一处理室; 以及连接到所述第一处理室的卸载室，其中通过所述处理装置的处理路径是沿着穿过所述装载室，所述缓冲室，所述第一处理室和所述卸载室的方向的前向一线路径。

公开(公告)号：US20130291596A1

公开(公告)日：2013-11-07

申请号：US13464488

申请日：2012-05-04

Applicant: Bo Yun Jang ,  Jin Seok Lee ,  Joon Soo Kim ,  Young Soo Ahn

Inventor： Bo Yun Jang ,  Jin Seok Lee ,  Joon Soo Kim ,  Young Soo Ahn

IPC: C01B33/02 ,  B01J19/08 ,  C01B33/037

CPC classification number: C01B33/037 ,  B01J6/007 ,  B01J19/085 ,  B01J2219/00135 ,  C30B13/22

Abstract: Methods and apparatus for manufacturing high purity polysilicon. The apparatus includes a vacuum chamber; first and second electron guns disposed at an upper side of the vacuum chamber to irradiate electron beams into the vacuum chamber; a silicon melting unit which is placed on a first electron beam-irradiating region corresponding to the first electron gun and to which powdery raw silicon is fed and melted by the first electron beam; and a unidirectional solidification unit placed on a second electron beam-irradiating region corresponding to the second electron gun. The unidirectional solidification unit is provided therein with a start block driven in a downward direction to transfer molten silicon in the downward direction and is formed at a lower side thereof with a cooling channel. The start block includes a dummy bar having a silicon button joined to an upper portion of the dummy bar.

Abstract translation: 制造高纯度多晶硅的方法和装置。 该装置包括真空室; 第一和第二电子枪设置在真空室的上侧以将电子束照射到真空室中; 硅熔融单元，其放置在对应于第一电子枪的第一电子束照射区域上，并且通过第一电子束将粉末原料硅熔化; 以及放置在对应于第二电子枪的第二电子束照射区域上的单向凝固单元。 单向凝固单元在其中设置有向下驱动的起始块，以沿向下方向转移熔融硅，并在其下侧形成有冷却通道。 起始块包括具有连接到虚拟棒的上部的硅按钮的虚拟棒。

公开(公告)号：US20130263777A1

公开(公告)日：2013-10-10

申请号：US13459109

申请日：2012-04-28

Applicant: Jin Seok Lee ,  Bo Yun Jang ,  Joon Soo Kim ,  Young Soo Ahn

Inventor： Jin Seok Lee ,  Bo Yun Jang ,  Joon Soo Kim ,  Young Soo Ahn

IPC: C30B15/06 ,  C30B15/30 ,  C30B15/10

CPC classification number: C30B15/06 ,  C30B28/10 ,  C30B29/06 ,  C30B35/002 ,  Y10T117/1048

Abstract: There is disclosed an apparatus for manufacturing a silicon substrate including a crucible part, a molding part extended from an outlet of the crucible part, the molding part comprising a molding space where a silicon substrate is formed, and a dummy bar inserted in the molding space from a predetermined portion of the molding part, wherein the dummy bar is formed of a single-crystalline material.

Abstract translation: 公开了一种用于制造硅基板的装置，其包括坩埚部分，从坩埚部分的出口延伸的模制部分，模制部分包括形成硅基板的模制空间和插入模制空间中的虚拟棒 从模制部件的预定部分，其中虚拟棒由单晶材料形成。

公开(公告)号：US08432443B2

公开(公告)日：2013-04-30

申请号：US12918535

申请日：2008-04-03

Applicant: Yun Young Nam ,  Kyoung Su Park ,  Jin Seok Lee ,  Sang Jin Hong ,  We Duke Cho

Inventor： Yun Young Nam ,  Kyoung Su Park ,  Jin Seok Lee ,  Sang Jin Hong ,  We Duke Cho

IPC: H04N7/18

CPC classification number: G06T7/285 ,  G06T7/246 ,  G06T7/73 ,  G06T2207/10021 ,  G06T2207/30204

Abstract: There is provided a method of localizing an object comprising projecting an object located on an object plane and a reference point corresponding thereto on a virtual viewable plane and an actual camera plane; estimating coordinates of the reference point; and prescribing a relationship between a location of the object and the coordinates of the reference point.

Abstract translation: 提供了一种定位对象的方法，包括将虚拟可视平面和实际相机平面上的物体平面上的对象和与其对应的参考点投影; 估计参考点的坐标; 并且规定对象的位置与参考点的坐标之间的关系。

公开(公告)号：US20110095421A1

公开(公告)日：2011-04-28

申请号：US12926137

申请日：2010-10-27

Applicant: Ey Yong Kim ,  Young Hwan Shin ,  Soon Jin Cho ,  Jong Yong Kim ,  Jin Seok Lee

Inventor： Ey Yong Kim ,  Young Hwan Shin ,  Soon Jin Cho ,  Jong Yong Kim ,  Jin Seok Lee

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.

Abstract translation: 提供了一种倒装芯片封装，包括电子器件，包括设置在其上安装有电子器件的板的安装区域内的导电焊盘的基板和设置在安装区域外部的连接焊盘，形成在其上的树脂层 并且包括通过去除树脂层的一部分而形成的沟槽，以及设置在沟槽上的防止构件，并防止在安装区域和连接衬垫之间的底部填充物的泄漏。 由于形成在加工树脂层上的阻挡部件能够防止底部填充物的泄漏，因此能够降低包装缺陷率，可以提高连接可靠性。

公开(公告)号：US08771639B2

公开(公告)日：2014-07-08

申请号：US12311486

申请日：2008-01-04

Applicant: Kyung Byung Yoon ,  Jin Seok Lee ,  Jae Hyun Kim ,  Young Ju Lee ,  Nak Cheon Jeong

Inventor： Kyung Byung Yoon ,  Jin Seok Lee ,  Jae Hyun Kim ,  Young Ju Lee ,  Nak Cheon Jeong

IPC: C01B33/36 ,  C01B39/00 ,  C01F7/00

CPC classification number: C01B39/02

Abstract: The present invention relates to a method for preparing composites of substrate-molecular sieve, in particular, to a method for preparing a composite of substrate-molecular sieve, which comprises applying a physical pressure to molecular sieve crystals against a substrate to form a chemical bond between the molecular sieve crystal and the substrate. The present invention requiring no solvents, reactors and other equipments enables molecular sieve crystals to be stably attached to the surface of substrates through various chemical bonds, particularly ionic present invention ensures the synthesis of substrate-molecular sieve composites with enhanced attachment rate, degree of lateral close packing (DCP) and attachment strength in more time-saving and energy-saving manners. The present method works well for molecular sieve crystals with lager sizes (e.g., more than 3 μm) with no generation of parasitic crystals. Furthermore, the present invention shows excellent applicability to large substrates, enabling the mass production of substrate-molecular sieve composites.

Abstract translation: 本发明涉及一种制备底物分子筛复合材料的方法，特别涉及一种制备底物 - 分子筛复合材料的方法，该方法包括向分子筛晶体施加物理压力以抵抗基质以形成化学键 在分子筛晶体和基底之间。 不需要溶剂，反应器等设备的本发明使得分子筛晶体能够通过各种化学键稳定地附着于基底表面，特别是离子本发明确保了底物分子筛复合物的合成，具有增强的附着率， 紧密包装（DCP）和附件强度更节省时间和节能的方式。 本发明的方法适用于具有较大尺寸（例如大于3μm）的分子筛晶体，而不产生寄生晶体。 此外，本发明对大基材显示出优异的适用性，能够批量生产基质分子筛复合材料。

公开(公告)号：US08213265B2

公开(公告)日：2012-07-03

申请号：US12918607

申请日：2008-04-04

Applicant: Yun Young Nam ,  Jin Seok Lee ,  Sang Jin Hong ,  We Duck Cho

Inventor： Yun Young Nam ,  Jin Seok Lee ,  Sang Jin Hong ,  We Duck Cho

IPC: G01S3/80

CPC classification number: G01S3/8006

Abstract: There is provided a method of tracking an object in a three-dimensional (3-D) space by using particle filter-based acoustic sensors, the method comprising selecting two planes in the 3-D space; executing two-dimensional (2-D) particle filtering on the two selected planes, respectively; and associating results of the 2-D particle filtering on the respective planes.

Abstract translation: 提供了一种通过使用基于粒子滤波器的声学传感器来跟踪三维（3-D）空间中的对象的方法，该方法包括在3-D空间中选择两个平面; 分别在两个选定的平面上执行二维（2-D）粒子滤波; 并且将各个平面上的二维粒子滤波的结果相关联。

公开(公告)号：US20110182395A1

公开(公告)日：2011-07-28

申请号：US12748369

申请日：2010-03-26

Applicant: JOON KYOO PARK ,  Jin Seok Lee ,  Kyeong Lak Jeon ,  Jung Min Suh ,  Gi-Jun Gwon ,  Nam Gyu Park ,  Kyong Bo Eom ,  Jin Sun Kim ,  Dong Geun Ha ,  Kyoung Joo Kim

Inventor： JOON KYOO PARK ,  Jin Seok Lee ,  Kyeong Lak Jeon ,  Jung Min Suh ,  Gi-Jun Gwon ,  Nam Gyu Park ,  Kyong Bo Eom ,  Jin Sun Kim ,  Dong Geun Ha ,  Kyoung Joo Kim

IPC: G21C3/02

CPC classification number: G21C3/331 ,  G21C3/3315 ,  Y02E30/40

Abstract: Disclosed herein is a hold-down spring unit for a top nozzle of a nuclear fuel assembly. The hold-down spring unit is coupled to the upper end of the top nozzle of the nuclear fuel assembly. The hold-down spring unit includes a first spring which acts against a hold-down force with respect to the nuclear fuel assembly under start-up conditions or hot full power conditions of a nuclear reactor, and a second spring which acts against a hold-down force with respect to the nuclear fuel assembly under start-up conditions of the nuclear reactor. The present invention reduces the hold-down margin under start-up conditions or hot full power conditions, thus enhancing the mechanical and structural stability of the nuclear fuel assembly.

Abstract translation: 本文公开了一种用于核燃料组件的顶部喷嘴的压紧弹簧单元。 压紧弹簧单元联接到核燃料组件的顶部喷嘴的上端。 压紧弹簧单元包括第一弹簧，其在核反应堆的启动条件或热全功率条件下抵抗相对于核燃料组件的压紧力，以及第二弹簧， 在核反应堆的启动条件下对核燃料组件的下降力。 本发明在启动条件或热全功率条件下降低了压紧余量，从而提高了核燃料组件的机械和结构稳定性。