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公开(公告)号:US08491163B2
公开(公告)日:2013-07-23
申请号:US12885030
申请日:2010-09-17
Applicant: Kazunari Higuchi , Takayoshi Moriyama , Yutaka Honda , Kenji Nezu , Shinichi Kumashiro
Inventor: Kazunari Higuchi , Takayoshi Moriyama , Yutaka Honda , Kenji Nezu , Shinichi Kumashiro
IPC: F21V29/00
CPC classification number: F21S8/026 , F21V17/162 , F21V21/04 , F21Y2105/10 , F21Y2115/10
Abstract: According to one embodiment, a lighting apparatus includes a main body including a flat thermal conduction surface. The thermal conduction surface contacts a back surface of a board. Light-emitting devices are mounted on a front surface of the board. An optical member is opposed to a peripheral part of the board on the front surface side of the board. The optical member is fastened to the main body by fastening members, to push the peripheral part of the board against the heat conduction surface of the main body.
Abstract translation: 根据一个实施例,照明装置包括主体,其包括平坦的热传导表面。 导热表面接触板的背面。 发光装置安装在板的前表面上。 光学构件与板的前表面侧上的板的周边部分相对。 光学构件通过紧固构件紧固到主体,以将板的周边部分推靠在主体的导热表面上。
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公开(公告)号:US20130170233A1
公开(公告)日:2013-07-04
申请号:US13496869
申请日:2011-07-15
Applicant: Kenji Nezu , Shigeru Osawa , Yuichiro Takahara , Takeshi Osada , Toshifumi Masuda , Hiromichi Nakajima
Inventor: Kenji Nezu , Shigeru Osawa , Yuichiro Takahara , Takeshi Osada , Toshifumi Masuda , Hiromichi Nakajima
IPC: F21V15/01
CPC classification number: F21V15/01 , F21K9/20 , F21S8/02 , F21V23/004 , F21V23/006 , F21V29/74 , F21Y2115/10 , H01R33/465
Abstract: A lamp device 14 includes a light-emitting portion 34 in which a semiconductor light-emitting element is used. The light-emitting portion 34 is arranged on the side of one of surfaces of the housing 16. Provided on the side of the other surface of the housing 16 is a metallic cap portion 44 and a lamp pin 46 projecting from the other surface side of the housing 16. The lighting circuit 21 is stored in the housing 16. Then, the lamp device 14 includes lamp pin mounting portions 73 where the lamp pins are to be mounted and the insulating member 47 having an insulating portion 75 interposed between the inner surface of the cap portion 44 and the lighting circuit 21.
Abstract translation: 灯装置14包括使用半导体发光元件的发光部34。 发光部分34布置在壳体16的一个表面的侧面上。在壳体16的另一个表面侧设置有金属盖部分44和从另一个表面侧突出的灯销46 照明电路21存储在壳体16中。然后,灯装置14包括灯销安装部分73,其中灯销将被安装,并且绝缘部件47具有插入在内表面之间的绝缘部分 盖部44和点亮电路21。
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公开(公告)号:USD663049S1
公开(公告)日:2012-07-03
申请号:US29386109
申请日:2011-02-24
Applicant: Asuka Wada , Kenji Nezu
Designer: Asuka Wada , Kenji Nezu
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公开(公告)号:US20110075427A1
公开(公告)日:2011-03-31
申请号:US12885030
申请日:2010-09-17
Applicant: Kazunari Higuchi , Takayoshi Moriyama , Yutaka Honda , Kenji Nezu , Shinichi Kumashiro
Inventor: Kazunari Higuchi , Takayoshi Moriyama , Yutaka Honda , Kenji Nezu , Shinichi Kumashiro
IPC: F21V29/00
CPC classification number: F21S8/026 , F21V17/162 , F21V21/04 , F21Y2105/10 , F21Y2115/10
Abstract: According to one embodiment, a lighting apparatus includes a main body including a flat thermal conduction surface. The thermal conduction surface contacts a back surface of a board. Light-emitting devices are mounted on a front surface of the board. An optical member is opposed to a peripheral part of the board on the front surface side of the board. The optical member is fastened to the main body by fastening members, to push the peripheral part of the board against the heat conduction surface of the main body.
Abstract translation: 根据一个实施例,照明装置包括主体,其包括平坦的热传导表面。 导热表面接触板的背面。 发光装置安装在板的前表面上。 光学构件与板的前表面侧上的板的周边部分相对。 光学构件通过紧固构件紧固到主体,以将板的周边部分推靠在主体的导热表面上。
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公开(公告)号:US20100038657A1
公开(公告)日:2010-02-18
申请号:US12582721
申请日:2009-10-21
Applicant: Kazunari HIGUCHI , Takayoshi Moriyama , Sumio Hashimoto , Shinichi Kumashiro , Yutaka Honda , Kenji Nezu
Inventor: Kazunari HIGUCHI , Takayoshi Moriyama , Sumio Hashimoto , Shinichi Kumashiro , Yutaka Honda , Kenji Nezu
IPC: H01L33/00
CPC classification number: F21S8/02 , F21S8/026 , F21V7/0083 , F21V21/04 , F21V23/026 , F21V29/507 , F21V29/75 , F21V29/76 , F21V29/77 , F21Y2115/10
Abstract: A lighting apparatus is provided with a plurality of light-emitting devices, a substrate, a blind member, and a reflector. The reflector is formed with a plurality of reflective surfaces corresponding to the light-emitting devices, individually. The shielding angle at which light emitted from that one of the light-emitting devices which is located on the outermost periphery is intercepted by the reflective surface corresponding to the outermost light-emitting device is greater than shielding angles at which light emitted from the light-emitting devices located inside the outermost light-emitting device is intercepted by the reflective surfaces corresponding to the inside light-emitting devices.
Abstract translation: 照明装置设置有多个发光装置,基板,遮光部件和反射板。 反射器分别形成有与发光装置对应的多个反射面。 从位于最外侧的发光装置的一个发光装置发出的光被与最外侧的发光装置对应的反射面截取的遮蔽角度大于从发光装置发出的光的遮蔽角度, 位于最外侧的发光装置内的发光装置被对应于内部发光装置的反射面截取。
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