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公开(公告)号：US09525463B2
公开(公告)日：2016-12-20
申请号：US14885263
申请日：2015-10-16
Applicant: KEYSSA, INC.
Inventor： Gary D. McCormack , Ian A. Kyles
CPC classification number: H04B5/0031 , G06F13/00 , H04B5/0037 , H04B5/0075 , H04L29/06068 , H04L69/08
Abstract: A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.
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公开(公告)号：US20160241347A1
公开(公告)日：2016-08-18
申请号：US15139145
申请日：2016-04-26
Applicant: Keyssa, Inc.
Inventor： Gary D. McCormack , Roger D. Isaac
CPC classification number: H04B15/00 , H01L24/73 , H01L2223/6677 , H01L2224/16225 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H04B5/0031 , H04W4/80 , H04W12/06 , H01L2924/00012 , H01L2924/00014
Abstract: Shielded extremely high frequency (EHF) connector assemblies are disclosed herein. In some embodiments, a first extremely high frequency (EHF) shielded connector assembly configured to be coupled with a second EHF shielded connector assembly. The first EHF connector assembly can include a first EHF communication unit operative to contactlessly communicate EHF signals with a second EHF communication unit included in the second EHF shielded connector assembly. The first connector can include a connector interface that includes a configuration to interface with a respective connector interface of the second EHF shield connector assembly, and several different material compositions that, in conjunction with the configuration, provide shielding to prevent or substantially reduce EHF signal leakage when the first EHF assembly connector is coupled to the second EHF assembly connector and the first EHF communication unit is contactlessly communicating EHF signals with the second EHF communication unit.
Abstract translation: 本文公开了屏蔽的极高频（EHF）连接器组件。 在一些实施例中，被配置为与第二EHF屏蔽连接器组件耦合的第一极高频（EHF）屏蔽连接器组件。 第一EHF连接器组件可以包括第一EHF通信单元，其用于与包括在第二EHF屏蔽连接器组件中的第二EHF通信单元非接触地通信EHF信号。 第一连接器可以包括连接器接口，该连接器接口包括与第二EHF屏蔽连接器组件的相应连接器接口接口的配置以及结合该配置提供屏蔽以防止或基本上减少EHF信号泄漏的几种不同的材料组成 当第一EHF组件连接器耦合到第二EHF组件连接器并且第一EHF通信单元与第二EHF通信单元非接触地通信EHF信号时。
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公开(公告)号：US20150126047A1
公开(公告)日：2015-05-07
申请号：US14596172
申请日：2015-01-13
Applicant: Keyssa, Inc.
Inventor： Gary D. McCormack
IPC: H01R13/62
CPC classification number: H01R13/6205 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A first connector may include a housing defining a first connector face to be positioned in a first position or a second position proximate to a second connector face of a second connector. A first extremely high frequency (EHF) communication unit may be disposed in the housing for communicating with a second EHF communication unit of the second connector when the first connector face is positioned in first or second position relative to the second connector face. A first magnet may be disposed in the housing. The first magnet may align with and repel a second magnet disposed relative to the second connector face when the first connector face is positioned in the second position. The first magnet may be configured not to align with and not to repel the second magnet when first connector face is positioned in the first position relative to the second connector face.
Abstract translation: 第一连接器可以包括壳体，其限定要定位在第一位置的第一连接器面或靠近第二连接器的第二连接器面的第二位置。 当第一连接器面相对于第二连接器面定位在第一或第二位置时，第一极高频（EHF）通信单元可以设置在壳体中，用于与第二连接器的第二EHF通信单元通信。 第一磁体可以设置在壳体中。 当第一连接器面定位在第二位置时，第一磁体可以对准并排斥相对于第二连接器面设置的第二磁体。 当第一连接器面相对于第二连接器面定位在第一位置时，第一磁体可以被配置为不与第二磁体对准并且不排斥第二磁体。
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14.发明授权公开(公告)号：US08929834B2
公开(公告)日：2015-01-06
申请号：US13787789
申请日：2013-03-06
Applicant: Keyssa, Inc.
Inventor： Ian A. Kyles , Gary D. McCormack
IPC: H04B17/00
CPC classification number: H04B1/40 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H04B17/102 , H04B17/13 , H04B17/21 , H04B2001/0416 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: An EHF communication system including an EHF communication chip. The EHF communication chip may include an EHF communication circuit having at least one controllable parameter-based module having a testable and controllable operating parameter The EHF communication chip may further include a test and trim circuit coupled to the EHF communication circuit, where the test and trim circuit includes a logic circuit having one or more memory elements, where the logic circuit is coupled to the controllable parameter-based module.
Abstract translation: 包括EHF通信芯片的EHF通信系统。 EHF通信芯片可以包括具有至少一个可控参数的模块的EHF通信电路，其具有可测试和可控的操作参数.EHF通信芯片还可以包括耦合到EHF通信电路的测试和微调电路，其中测试和修剪 电路包括具有一个或多个存储器元件的逻辑电路，其中逻辑电路耦合到基于可控参数的模块。
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公开(公告)号：US20140355700A1
公开(公告)日：2014-12-04
申请号：US14462560
申请日：2014-08-18
Applicant: Keyssa, Inc.
Inventor： Gary D. McCormack , Ian A. Kyles
IPC: H04L25/40
CPC classification number: H04L25/40 , H01L23/3128 , H01L23/49816 , H01L23/49861 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/32225 , H01L2224/48227 , H01L2224/49 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/30111 , H01Q1/2283 , H01Q7/00 , H01Q9/26 , H04L7/0087 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: A system for communicating modulated EHF signals may include a modulation circuit responsive to a bi-level transmit information signal for generating a transmit output signal. The transmit output signal may have an EHF frequency when the transmit information signal is at a first information state and may be suppressed when the transmit information signal is at a second information state. A transmit transducer operatively coupled to the modulation circuit may be responsive to the transmit output signal for converting the transmit output signal into an electromagnetic signal.
Abstract translation: 用于传送调制的EHF信号的系统可以包括响应于双电平发射信息信号的调制电路，用于产生发射输出信号。 当发送信息信号处于第一信息状态时，发送输出信号可以具有EHF频率，并且当发送信息信号处于第二信息状态时可以抑制发送输出信号。 可操作地耦合到调制电路的发射传感器可以响应于发射输出信号，以将发射输出信号转换成电磁信号。
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Patent Agency Ranking
公开(公告)号：US10419075B2
公开(公告)日：2019-09-17
申请号：US15653943
申请日：2017-07-19
Applicant: Keyssa, Inc.
Inventor： Gary D. McCormack , Ian A. Kyles , Roger D. Isaac
Abstract: A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.
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公开(公告)号：US10349465B2
公开(公告)日：2019-07-09
申请号：US16134476
申请日：2018-09-18
Applicant: Keyssa, Inc.
Inventor： Ian A. Kyles , Kenneth R. Kveton , Michael A. Bourdess , John Wolcott , Steve Novak , Roger D. Isaac , Gary D. McCormack
Abstract: Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.
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公开(公告)号：US10243621B2
公开(公告)日：2019-03-26
申请号：US15679125
申请日：2017-08-16
Applicant: Keyssa, Inc.
Inventor： Gary D. McCormack
Abstract: Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.
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公开(公告)号：US10236938B2
公开(公告)日：2019-03-19
申请号：US15811051
申请日：2017-11-13
Applicant: KEYSSA, INC.
Inventor： Gary D. McCormack , Ian A. Kyles
Abstract: A contactless, electromagnetic (EM) replacement (substitute, alternative) for cabled (electric) Standards-based interfaces (such as, but not limited to USB) which effectively handles the data transfer requirements (such as bandwidth, speed, latency) associated with the Standard, and which is also capable of measuring and replicating relevant physical conditions (such as voltage levels) on data lines so as to function compatibly and transparently with the Standard. A contactless link may be provided between devices having transceivers. A non-conducting housing may enclose the devices. Some applications for the contactless (EM) interface are disclosed. A dielectric coupler facilitating communication between communications chips which are several meters apart. Conductive paths may provide power and ground for bus-powered devices.
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公开(公告)号：US20190021132A1
公开(公告)日：2019-01-17
申请号：US16134476
申请日：2018-09-18
Applicant: Keyssa, Inc.
Inventor： Ian A. Kyles , Kenneth R. Kveton , Michael A. Bourdess , John Wolcott , Steve Novak , Roger D. Isaac , Gary D. McCormack
CPC classification number: H04W76/28 , H01L23/3128 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H04B1/401 , H04B5/02 , H04W76/14 , H01L2924/00012
Abstract: Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.
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