公开(公告)号：US11410864B2

公开(公告)日：2022-08-09

申请号：US16842347

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/32

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.