公开(公告)号：US20230328886A1

公开(公告)日：2023-10-12

申请号：US18026917

申请日：2021-09-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/111 ,  H05K1/185 ,  H05K1/183 ,  H05K3/4697

Abstract: A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity, wherein an upper surface of the first insulating layer includes a first region that does not vertically overlap the cavity; a second region vertically overlapping the cavity; and a boundary region between the first region and the second region, the first circuit pattern includes a first-first circuit pattern disposed on the boundary region of the first insulating layer, the first-first circuit pattern includes a first portion that does not vertically overlap the cavity; and a second portion connected to the first portion and vertically overlapping the cavity, and a thickness of the first portion of the first-first circuit pattern is different from a thickness of the second portion of the first-first circuit pattern.

公开(公告)号：US20240138077A1

公开(公告)日：2024-04-25

申请号：US18271544

申请日：2021-04-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

公开(公告)号：US20230290716A1

公开(公告)日：2023-09-14

申请号：US18013624

申请日：2021-06-29

Applicant: LG INNOTEK CO., LTD

Inventor： Jae Hun JEONG ,  Jong Bae SHIN ,  Soo Min LEE

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/46 ,  H01L21/48 ,  H05K3/00 ,  H05K1/03 ,  H01L23/13

CPC classification number: H01L23/49838 ,  H05K1/0298 ,  H05K3/4688 ,  H01L21/4857 ,  H05K3/0032 ,  H05K1/036 ,  H01L23/49894 ,  H01L23/49822 ,  H05K3/4697 ,  H01L23/13 ,  H05K1/186

Abstract: A printed circuit board according to an embodiment comprises: a first insulation layer; a first circuit pattern disposed on one surface of the first insulation layer and including a pad; and a second insulation layer disposed on one surface of the first insulation layer and including a cavity exposing the pad, wherein the first circuit pattern includes a 1-1 metal layer disposed on one surface of the first insulation layer, and a 1-2 metal layer disposed on one surface of the 1-1 metal layer, wherein the area of the 1-1 metal layer is greater than the area of the 1-2 metal layer, and at least a portion of a side surface of the 1-1 metal layer is exposed through the cavity.

公开(公告)号：US20220377902A1

公开(公告)日：2022-11-24

申请号：US17770757

申请日：2020-10-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K1/18 ,  H05K1/11

Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

公开(公告)号：US20130320393A1

公开(公告)日：2013-12-05

申请号：US13905899

申请日：2013-05-30

Applicant: KUKDO CHEMICAL CO., LTD. ,  LG INNOTEK CO., LTD.

Inventor： Sung Bae MOON ,  Sang In YOON ,  Jae Hun JEONG ,  Min Young KIM

IPC: H01L33/56 ,  C08L63/00

CPC classification number: H01L33/56 ,  C08G59/306 ,  C08G59/3245 ,  C08G59/38 ,  C08G77/14 ,  C08L63/00 ,  C08L83/06 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and a silicon-containing alicyclic epoxy resin

Abstract translation: 公开了环氧树脂组合物和发光装置。 环氧树脂组合物包括三嗪衍生物环氧树脂和含硅脂环族环氧树脂