公开(公告)号：US10304621B2

公开(公告)日：2019-05-28

申请号：US15413640

申请日：2017-01-24

Applicant: Lear Corporation

Inventor： Ajmal Imran Ansari ,  David A. Hein ,  Steven Cong ,  Allen Leo Mott

IPC: H01F27/22 ,  H01F27/32 ,  H01F27/28 ,  H01F27/36

Abstract: An assembly includes a metallic housing, an electromagnetic (EM) device, and a bobbin in which the EM device is supported. The bobbin has a non-metallic, inner bobbin body, a non-metallic, outer bobbin body, and a metallic shield sandwiched between the inner and outer bobbin bodies. The EM device and the bobbin are mounted in the housing with the bobbin being between the EM device and the housing for heat from the EM device to thermally conduct through the inner and outer bobbin bodies and the shield to the housing while the shield shields noise of the EM device from the housing.

公开(公告)号：US10245963B2

公开(公告)日：2019-04-02

申请号：US15368767

申请日：2016-12-05

Applicant: Lear Corporation

Inventor： Ajmal Imran Ansari ,  Richard J. Hampo ,  David A. Hein

IPC: H02J7/04 ,  B60L11/18 ,  H02J7/02 ,  B60L3/00 ,  H01F38/14 ,  H01F27/02 ,  H01F27/26

Abstract: A charging pad includes a housing, an interface layer, a magnetics assembly, and an electronics assembly. The housing has a magnetics assembly housing part and an electronics assembly housing part. The interface layer is within the housing. The magnetics assembly is arranged below the interface layer within the magnetics assembly housing part and the electronics assembly is arranged above the interface layer within the electronics assembly housing part.

公开(公告)号：US20180211766A1

公开(公告)日：2018-07-26

申请号：US15413640

申请日：2017-01-24

Applicant: Lear Corporation

Inventor： Ajmal Imran Ansari ,  David A. Hein ,  Steven Cong ,  Allen Leo Mott

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/08 ,  H01F27/02

CPC classification number: H01F27/325 ,  H01F27/22 ,  H01F27/2876 ,  H01F27/2885 ,  H01F27/362

Abstract: An assembly includes a metallic housing, an electromagnetic (EM) device, and a bobbin in which the EM device is supported. The bobbin has a non-metallic, inner bobbin body, a non-metallic, outer bobbin body, and a metallic shield sandwiched between the inner and outer bobbin bodies. The EM device and the bobbin are mounted in the housing with the bobbin being between the EM device and the housing for heat from the EM device to thermally conduct through the inner and outer bobbin bodies and the shield to the housing while the shield shields noise of the EM device from the housing.