中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

49 records (took 0.022 seconds)

    Method for making tunable multi-LED emitter module
    11.
    发明授权
    Method for making tunable multi-LED emitter module 有权

    公开(公告)号：US10149363B2

    公开(公告)日：2018-12-04

    申请号：US15144747

    申请日：2016-05-02

    Applicant: LedEngin, Inc.

    Inventor： Xiantao Yan ,  Kachun Lee ,  David Tahmassebi

    IPC: G01R31/18 ,  H05B33/08 ,  H05B33/10

    Abstract: A method for making a light-emitting diode (LED) emitter module includes providing a substrate and providing two or more groups of LED dies disposed on the substrate. Each group has one or more LED dies, and each of the LED dies is coupled to an electrical contact and electrical paths are configured for feeding separate electrical currents to the groups of LED dies. The method also includes determining information associating a plurality output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying a plurality of electrical current values, each electrical current value being associated with an LED die from one of the two or more groups of LED dies. The method also includes storing the information in the memory device, and providing a circuit for accessing the information in the memory device.

    Ceramic LED package
    13.
    发明授权
    Ceramic LED package 有权

    公开(公告)号：US09653663B2

    公开(公告)日：2017-05-16

    申请号：US14229550

    申请日：2014-03-28

    Applicant: LedEngin, Inc.

    Inventor： Xiantao Yan

    IPC: H01L33/58 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/52

    CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

    Abstract: A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface. The thermal conduction layer includes a thermally conducting ceramic material disposed between the floor and the bottom surface. The package also includes a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's and a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.

    Compact emitter for warm dimming and color tunable lamp
    14.
    发明授权
    Compact emitter for warm dimming and color tunable lamp 有权

    公开(公告)号：US09642206B2

    公开(公告)日：2017-05-02

    申请号：US14952648

    申请日：2015-11-25

    Applicant: LedEngin, Inc.

    Inventor： Xiantao Yan ,  Kachun Lee

    IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H05B33/08

    CPC classification number: H05B33/0857 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05B33/0869 ,  H01L2924/00

    Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

    Package for high-power LED devices
    16.
    发明授权
    Package for high-power LED devices 有权
    大功率LED器件封装

    公开(公告)号：US09406654B2

    公开(公告)日：2016-08-02

    申请号：US14165372

    申请日：2014-01-27

    Applicant: LedEngin, Inc.

    Inventor： Xiantao Yan

    IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Packages for LED-based light devices include interface structures that can facilitate heat transfer from the package to a heat sink. The package can include multiple LEDs mounted on a ceramic substrate that provides electrically conductive pathways between the LEDs and metal contact pads at a peripheral region of a top surface of the substrate. A bottom surface of the substrate can be patterned with a plate, such as a thick supporting plate, made of metal and/or other materials with high thermal conductivity, that can be attached to an external heat sink.

    Abstract translation: 基于LED的光器件的封装包括可以促进从封装到散热器的热传递的界面结构。 封装可以包括安装在陶瓷衬底上的多个LED，其在衬底的顶表面的周边区域处提供LED和金属接触焊盘之间的导电通路。 可以用诸如可由金属和/或具有高导热性的其他材料制成的厚度支撑板的板（其可以附接到外部散热器）来对基板的底表面进行图案化。

    TUNING OF EMITTER WITH MULTIPLE LEDS TO A SINGLE COLOR BIN
    17.
    发明申请
    TUNING OF EMITTER WITH MULTIPLE LEDS TO A SINGLE COLOR BIN 有权
    具有多个LED的发射器调谐到单个颜色的BIN

    公开(公告)号：US20140084796A1

    公开(公告)日：2014-03-27

    申请号：US14091914

    申请日：2013-11-27

    Applicant: LedEngin, Inc.

    Inventor： Xiantao Yan ,  Kachun Lee ,  Zequn Mei

    IPC: H05B33/08

    CPC classification number: H05B33/0869 ,  H05B33/0827 ,  H05B33/086 ,  H05B33/0863

    Abstract: The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature.

    Abstract translation: 基于LED的灯的颜色可以调节到所需的颜色或色温。 灯可以包括与不同颜色或色温相关联的两个或更多个可独立寻址的LED组，以及全内反射（TIR）混色透镜，以通过混合来自不同组的LED的光来产生均匀颜色的光 。 通过可控地划分LED组中的输入电流来调节输出光的颜色。 调谐可以执行一次，例如在制造期间，并且灯不需要用于维持色温的主动反馈部件。

    COMPACT EMITTER FOR WARM DIMMING AND COLOR TUNABLE LAMP
    19.
    发明申请
    COMPACT EMITTER FOR WARM DIMMING AND COLOR TUNABLE LAMP 审中-公开

    公开(公告)号：US20180007759A1

    公开(公告)日：2018-01-04

    申请号：US15487317

    申请日：2017-04-13

    Applicant: LedEngin, Inc.

    Inventor： Xiantao Yan ,  Kachun Lee

    IPC: H05B33/08 ,  H01L25/075 ,  H01L33/62

    CPC classification number: H05B33/0857 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05B33/0869 ,  H01L2924/00

    Abstract: A substrate for an LED emitter includes a body with a recess region formed therein. Bonding pads are disposed within the recess region, including LED bonding pads for LEDs and supporting chip bonding pads for one or more semiconductor chips that provide supporting circuitry (e.g., driver and/or controller circuitry) to support operation of the LEDs. External electrical contacts can be disposed outside the recess region. Electrical paths, disposed at least partially within the body of the substrate, connect the external electrical contacts to a first subset of the supporting chip bonding pads and connect a second subset of the supporting chip bonding pads to the plurality of LED bonding pads such that one or more supporting chips connected to the controller pads can be operated to deliver different operating currents to different ones of the LEDs.

Patent Agency Ranking