公开(公告)号：US09483673B2

公开(公告)日：2016-11-01

申请号：US14527213

申请日：2014-10-29

Applicant: NIDEC SANKYO CORPORATION

Inventor： Junro Takeuchi

IPC: G06K19/06 ,  G06K7/10 ,  H01Q1/22 ,  H01Q7/00

CPC classification number: G06K7/10336 ,  G06K7/10316 ,  H01Q1/2216 ,  H01Q7/00

Abstract: A non-contact communication module may include a substrate including an antenna including an antenna coil placed annularly in the substrate, and a ground pattern for grounding formed in the substrate; an antenna-side land that is formed on an external surface of the substrate, and is electrically connected to the antenna; and a ground-side land that is formed on the external surface of the substrate, and is electrically connected to the ground pattern. A distance between the antenna-side land and the ground-side land may be such that the antenna-side land and the ground-side land can be connected by use of a solder bridge.

Abstract translation: 非接触通信模块可以包括：衬底，其包括天线，天线包括环形地放置在衬底中的天线线圈;以及接地图案，用于形成在衬底中; 形成在所述基板的外表面上并且与所述天线电连接的天线侧平台; 以及形成在所述基板的外表面上并与所述接地图形电连接的接地侧的焊盘。 天线侧焊盘和接地侧焊盘之间的距离可以使得可以通过使用焊接桥连接天线侧焊盘和接地侧焊盘。