公开(公告)号：US20170306197A1

公开(公告)日：2017-10-26

申请号：US15492415

申请日：2017-04-20

Applicant: NITTO DENKO CORPORATION

Inventor： Kayo SHIMOKAWA ,  Ryoko ASAI ,  Taiki SHIMOKURI ,  Yoshiaki ITO ,  Tatsuya YAMASAKI

IPC: C09J135/02 ,  B32B27/30 ,  G02B5/30 ,  C09J5/06 ,  G02B1/14 ,  B32B7/12 ,  B32B37/14

Abstract: A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1): wherein X represents a functional group containing a reactive group, and R1 and R2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): −10≦HSP (A)−HSP (B)≦10 and formula (Y): −10≦HSP (C)−HSP (B)≦10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).