公开(公告)号：US20220173490A1

公开(公告)日：2022-06-02

申请号：US17106269

申请日：2020-11-30

Applicant: NXP B.V

Inventor： Adrianus Buijsman ,  Abdellatif Zanati ,  Giorgio Carluccio

IPC: H01P5/107 ,  H01P3/12 ,  H01P11/00 ,  H05K3/46 ,  H01Q1/32 ,  H01Q1/38 ,  H01L23/66

Abstract: A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.

公开(公告)号：US20210075081A1

公开(公告)日：2021-03-11

申请号：US16563292

申请日：2019-09-06

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Antonius Johannes Matheus de Graauw ,  Adrianus Buijsman ,  Michael B. Vincent

IPC: H01P5/107 ,  H01L23/66

Abstract: A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.