公开(公告)号：US20190088818A1

公开(公告)日：2019-03-21

申请号：US16196997

申请日：2018-11-20

Applicant: NIKKISO CO., LTD.

Inventor： Shoichi NIIZEKI ,  Hiroyasu ICHINOKURA

IPC: H01L33/00 ,  H01L33/32 ,  H01L33/64 ,  H01L33/52

CPC classification number: H01L33/0075 ,  H01L23/02 ,  H01L33/32 ,  H01L33/48 ,  H01L33/52 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01S5/022

Abstract: A method of manufacturing an optical semiconductor apparatus includes: placing a light transmissive lid body on a package substrate adapted to house an optical semiconductor device in an atmosphere of a first gas containing oxygen (O2), sandwiching a bonding member containing gold-tin (AuSn); exchanging an atmosphere gas for a second gas so as to reduce an oxygen concentration in the atmosphere while a load is exerted from above the lid body placed on the package substrate for temporary sealing; and heating and melting the bonding member after an exchange for the second gas is started so as to bond the package substrate and the lid body.