公开(公告)号：US12100691B2

公开(公告)日：2024-09-24

申请号：US17438776

申请日：2020-05-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62

Abstract: The invention relates to a light-emitting component comprising a light-emitting semiconductor chip, a transparent conductive layer, and at least two electrical connection points, wherein the transparent conductive layer covers the light-emitting semiconductor chip at least in places, and the electrical connection points are arranged on a side of the light-emitting semiconductor chip facing away from the transparent conductive layer.

公开(公告)号：US11271140B2

公开(公告)日：2022-03-08

申请号：US16498291

申请日：2018-03-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/58 ,  H01L33/62

Abstract: A method for manufacturing a plurality of surface mounted optoelectronic devices and a surface mounted optoelectronic device are disclosed. In an embodiment, a surface mounted optoelectronic device includes a transparent base body having a mounting rear side, a radiation exit side opposite the mounting rear side, and mounting side surfaces which are each disposed transversely to the radiation exit side, a semiconductor layer sequence disposed laterally to at least one mounting side surface and a terminal contact extending from the at least one mounting side surface to the mounting rear side, wherein the semiconductor layer sequence includes an active region configured to emit radiation so that the radiation decouples from the surface mounted optoelectronic device via the radiation exit side of the base body.

公开(公告)号：US11164850B2

公开(公告)日：2021-11-02

申请号：US16622669

申请日：2018-06-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Dominik Scholz ,  Siegfried Herrmann

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

Abstract: An arrangement having a plurality of lighting modules and a method for producing an arrangement having a plurality of lighting modules are disclosed. In an embodiment an arrangement includes a plurality of lighting modules held by a carrier, each lighting module having a plurality of optoelectronic components arranged in a first number of rows and a second number of columns, wherein the lighting modules include a respective first number of first electrodes and a respective second number of second electrodes, wherein the optoelectronic components of a respective row of the rows are electrically connected to one of the first electrodes of the respective lighting module, wherein the optoelectronic components of a respective column of the columns are electrically connected to one of the second electrodes of the respective lighting module, and wherein the carrier includes one third electrode per row and one fourth electrode per column, the electrodes being electrically contactable in each case from outside the carrier.

公开(公告)号：US11107945B2

公开(公告)日：2021-08-31

申请号：US15820930

申请日：2017-11-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Linkov ,  Frank Singer ,  Matthias Bruckschloegl ,  Siegfried Herrmann ,  Jürgen Moosburger ,  Thomas Schwarz

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/38 ,  H01L33/62

Abstract: A component includes a light emitting semiconductor chip, wherein the semiconductor chip includes a layer arrangement including a plurality of layers, the p-conducting layer and the n-conducting layer adjoin one another in an active zone, a first electrical contact is configured on the p-conducting side of the layer arrangement at a first side of the semiconductor chip, a second electrical contact is configured on the n-conducting side of the layer arrangement at a second side of the semiconductor chip, the second side being situated opposite the first side of the semiconductor chip, the first side of the semiconductor chip transitions into the second side via an end side, the semiconductor chip is secured by the end side on a substrate, the substrate includes a first and second further electrical contact, and the further electrical contacts electrically conductively connect to the electrical contacts of the semiconductor chip.

公开(公告)号：US10957813B2

公开(公告)日：2021-03-23

申请号：US16309995

申请日：2017-05-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann

IPC: H01L21/00 ,  H01L33/00 ,  H01L33/54 ,  H01L33/50 ,  H01L33/52

Abstract: In an embodiment, a method for producing a plurality of optoelectronic semiconductor components is disclosed, wherein the method includes inserting a plurality of optoelectronic semiconductor chips with a suitable orientation into a linear feeding device, conveying the optoelectronic semiconductor chips to an injection device having an outlet opening, encapsulating the optoelectronic semiconductor chips with at least one cladding layer in the injection device and pressing the encapsulated optoelectronic semiconductor chips out of the outlet opening, wherein a compound of optoelectronic semiconductor chips is formed in which the optoelectronic semiconductor chips are connected to one another by the at least one cladding layer and separating the compound into a plurality of optoelectronic semiconductor components each component having an optoelectronic semiconductor chip which is at least partially encapsulated by the at least one cladding layer.

公开(公告)号：US10270019B2

公开(公告)日：2019-04-23

申请号：US15561161

申请日：2016-03-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann

IPC: H01L33/62 ,  H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/20 ,  H01L33/46 ,  H01L33/50 ,  H01L21/56 ,  H01L33/06 ,  H01L33/30

Abstract: An optoelectronic semiconductor chip, an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment the chip includes a main body including a carrier having a top, a bottom opposite the top and side faces connecting the bottom with the top and a semiconductor layer sequence arranged on the top of the carrier, wherein the semiconductor layer sequence is configured to emit or absorb electromagnetic radiation and two contact faces arranged on the semiconductor layer sequence. The chip further includes two contact elements contacting the contact faces, wherein the contact elements include conductor tracks which are guided from the contact faces over edges of the main body on the side faces of the carrier.

公开(公告)号：US20190115510A1

公开(公告)日：2019-04-18

申请号：US16091080

申请日：2017-04-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann ,  Michael Völkl

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

Abstract: A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a substrate having a top surface, a bottom surface opposite the top surface and a first side surface extending transversely or perpendicularly to the bottom surface, a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light and a contacting comprising a first current distribution structure and a second current distribution structure, which is formed to supply current to the active region, wherein the semiconductor chip is free of any connection point on a side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, and wherein the connection point is a connection point for electrically contacting the first and second current distribution structures.

公开(公告)号：US10178722B2

公开(公告)日：2019-01-08

申请号：US15863766

申请日：2018-01-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ulrich Streppel ,  Siegfried Herrmann

IPC: H01L33/00 ,  H05B33/08 ,  H01L25/075 ,  H01L33/10 ,  G02B27/09

Abstract: A lighting device (1) and an operating method for the lighting device (1), which comprises at least one base chip (21) and a plurality of cover emitter regions (22). The base chip or chips (21) and the cover emitter regions (22) are realized by light-emitting diode chips and are electrically controlled independently of one another. Main emission directions (M) of these light-emitting diode chips are oriented parallel to one another. The cover emitter regions (22) are partially overlapping with the at least one base chip (21), so that an overlap region (3, B) is formed and the at least one base chip (21) radiates through the cover emitter regions (22) during operation. The cover emitter regions (22) are arranged in a common plane perpendicular to the main emission directions (M).

公开(公告)号：US20180309030A1

公开(公告)日：2018-10-25

申请号：US15737999

申请日：2016-06-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

Abstract: A light-emitting diode includes an optoelectronic semiconductor chip that emits electromagnetic radiation through a radiation side along a main direction of emission running transversely to the radiation side during operation, the semiconductor chip is embedded in a solid body, wherein side surfaces and the radiation side are covered by the solid body in a form-fit manner, the solid body widens along the main direction of emission, a cover element is arranged downstream of the solid body in the main direction of emission and is applied directly onto the solid body, a side of a cover element facing away from the solid body is formed as a radiation exit surface of the light-emitting diode, and a first contact element is exposed in an unmounted and/or non-contacted state of the light-emitting diode.

公开(公告)号：US10062813B2

公开(公告)日：2018-08-28

申请号：US15306441

申请日：2015-04-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Siegfried Herrmann ,  Matthias Sperl

IPC: H01L33/48 ,  F21V8/00 ,  H01L33/58 ,  H01L33/60 ,  H01L27/02 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/0352 ,  H01L31/18 ,  H01L33/00 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/486 ,  G02B6/0006 ,  G02B6/0028 ,  G02B6/0073 ,  H01L27/0248 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/03046 ,  H01L31/03048 ,  H01L31/035236 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/30 ,  H01L33/32 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: An optoelectronic component (100) comprises an optoelectronic semiconductor chip (10), a first contact area (31) and a second contact area (32), which is laterally offset with respect to the first contact area and is electrically insulated therefrom, and a housing element (40). The first contact area (31) is electrically conductively connected to the first semiconductor layer (21) and the second contact area (32) is electrically conductively connected to the second semiconductor layer (22) of the optoelectronic semiconductor chip. The first contact area (31) and the second contact area (32) project beyond the optoelectronic semiconductor chip laterally in each case. The housing element (40) is fixed to the first contact area (31) and the second contact area (32) in regions in which the first contact area (31) and the second contact area (32) project beyond the optoelectronic semiconductor chip laterally in each case. The housing element surrounds the optoelectronic semiconductor chip at least partly. A surface of the housing element that faces the optoelectronic semiconductor chip is embodied as reflective at least in partial regions. A wall of the housing element has a cutout (61).