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    Spacer block for rebuilt electrically operated automatic transmission controller assembly
    11.
    发明申请
    Spacer block for rebuilt electrically operated automatic transmission controller assembly 审中-公开
    用于重建电动自动变速器控制器组件的间隔块

    公开(公告)号：US20080089044A1

    公开(公告)日：2008-04-17

    申请号：US11581706

    申请日：2006-10-16

    Applicant: Paul Fathauer ,  Darrell Bates ,  Terry Fuller ,  Jimmy Fuller

    Inventor： Paul Fathauer ,  Darrell Bates ,  Terry Fuller ,  Jimmy Fuller

    IPC: H05K7/10

    CPC classification number: H05K7/142

    Abstract: A spacer block that provides for a method of rebuilding an electrically operated automatic transmission controller assembly is disclosed. The block allows for offsetting and stabilizing or securing a printed circuit (PC) board to a manifold block, in which several solenoid assemblies reside within the span of the spacer block. The spacer block includes a first means for connecting to the manifold block and a second means for connecting to the PC board. The rebuilt solenoid module preferably includes at least one new solenoid.

    Abstract translation: 公开了一种间隔块，其提供重建电动自动变速器控制器组件的方法。 该块允许将印刷电路板（PC）板偏移并稳定或固定到歧管块，其中多个螺线管组件位于间隔块的跨度内。 间隔块包括用于连接到歧管块的第一装置和用于连接到PC板的第二装置。 重建的电磁阀模块优选地包括至少一个新的螺线管。

    Retaining ring with wear pad for use in chemical mechanical planarization
    12.
    发明授权
    Retaining ring with wear pad for use in chemical mechanical planarization 失效
    带磨损垫的保持环，用于化学机械平面化

    公开(公告)号：US06979256B2

    公开(公告)日：2005-12-27

    申请号：US10924715

    申请日：2004-08-24

    Applicant: Richard D. Cooper ,  Paul Fathauer ,  Angela Mroczek-Petroski ,  David Perry ,  James P. Macey

    Inventor： Richard D. Cooper ,  Paul Fathauer ,  Angela Mroczek-Petroski ,  David Perry ,  James P. Macey

    IPC: B24B37/32 ,  B24B5/00

    CPC classification number: B24B37/32

    Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.

    Abstract translation: 一种新颖的保持环，其具有这种结构，设计和材料的耐磨垫，使得与用于半导体晶片和类似材料的化学机械平坦化（CMP）的当前可用产品相比，其提供改善的耐磨性和/或劣化性。 具有本发明的耐磨垫的保持环能够以比目前使用的材料和设计通常遇到的更少的磨损来承受在晶片的抛光表面处的增加的操作温度和压力。 在升高的温度和压力下操作的能力可以在某些过程中加速从半导体晶片去除材料的速率。 制造商在CMP工艺中使用扩展的温度和压力范围的灵活性以及消耗品成本的显着降低，为生产多层，集成电路器件等的最终成本提供了显着的优势 生产中使用CMP的产品。 此外，本发明的带有耐磨垫的保持装置也可以改装为先前使用和磨损的现有技术设计的保持环，从而回收CMP处理装置的主要结构部件，从而降低成本。 也是本发明的组成部分，使得新设计的可消耗部件可以更换，以便在最终确实需要时更换成本更低的成本。

    Retaining ring with wear pad for use in chemical mechanical planarization
    14.
    发明申请
    Retaining ring with wear pad for use in chemical mechanical planarization 失效

    公开(公告)号：US20050026554A1

    公开(公告)日：2005-02-03

    申请号：US10924715

    申请日：2004-08-24

    Applicant: Richard Cooper ,  Paul Fathauer ,  Angela Mroczek-Petroski ,  David Perry ,  James Macey

    Inventor： Richard Cooper ,  Paul Fathauer ,  Angela Mroczek-Petroski ,  David Perry ,  James Macey

    IPC: B24B37/32 ,  B24B49/00 ,  B24B1/00

    CPC classification number: B24B37/32

    Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes. The flexibility of a manufacturer to use an expanded range of temperature and pressure in CMP processes, combined with a significant reduction in the cost of consumables, provides a significant advantage in the final cost of ownership in the production of multilayer, integrated circuit devices and other products where CMP is utilized in manufacture. Moreover, the retaining with wear pad of the present invention may also retrofitted to previously used and worn retaining rings of the prior-art design, thus salvaging the major structural component of the CMP processing apparatus, thereby reducing costs. It is also an integral part of this invention to make the consumable component of the new design replaceable, so as to make replacement of this part less costly when such replacement finally does become necessary.

    METHOD OF REBUILDING SOLENOIDS FOR AUTOMATIC TRANSMISSIONS
    15.
    发明申请
    METHOD OF REBUILDING SOLENOIDS FOR AUTOMATIC TRANSMISSIONS 有权
    自动变速器电磁阀的改造方法

    公开(公告)号：US20110088236A1

    公开(公告)日：2011-04-21

    申请号：US12905409

    申请日：2010-10-15

    Applicant: Paul Fathauer

    Inventor： Paul Fathauer

    IPC: B23P6/00

    CPC classification number: B23P6/00 ,  B23P15/001 ,  F15B13/0402 ,  F16K27/041 ,  F16K27/048 ,  F16K31/0603 ,  Y10T29/49407 ,  Y10T29/49718 ,  Y10T29/49726 ,  Y10T29/4973 ,  Y10T29/49821

    Abstract: A method of rebuilding a solenoid for use in automatic transmissions is disclosed. In one embodiment, an improvement over the original equipment design allows for increased durability of the solenoid. In another embodiment, a lower cost method is disclosed for reusing an expensive component. In either case, various components within the solenoid are reused, reconditioned or replaced. A preferred process for disassembling the solenoid is also disclosed.

    Abstract translation: 公开了一种重建用于自动变速器的螺线管的方法。 在一个实施例中，对原始设备设计的改进允许提高螺线管的耐久性。 在另一个实施例中，公开了一种用于重新使用昂贵部件的较低成本的方法。 在这两种情况下，螺线管内的各种部件被重新使用，修理或更换。 还公开了拆卸螺线管的优选方法。

    Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
    16.
    发明授权
    Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same 失效
    用于半导体晶片的化学机械平面化的抛光垫及其制造方法

    公开(公告)号：US07037184B2

    公开(公告)日：2006-05-02

    申请号：US10349200

    申请日：2003-01-22

    Applicant: Angela Petroski ,  Richard D. Cooper ,  Paul Fathauer ,  Marc Andrew Yesnik

    Inventor： Angela Petroski ,  Richard D. Cooper ,  Paul Fathauer ,  Marc Andrew Yesnik

    IPC: B24D11/00

    CPC classification number: B24B37/26 ,  B24B37/24 ,  B24D3/32

    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.

    Abstract translation: 一种抛光垫，用于对由多孔结构制成的基材进行化学机械抛光的抛光垫，该抛光垫包括由诸如酚醛树脂的热固性树脂结合的纤维等纤维构成的基质。 抛光垫表面具有在衬底的化学机械抛光期间抛光浆料流动的空隙，并且其中在衬底的化学机械抛光期间形成的碎屑被暂时储存以供随后的漂洗。 研磨垫的抛光表面以形成有助于浆料输送和抛光的凹凸，以及打开垫的多孔结构。 多孔垫包含纳米尺寸的填料颗粒，其加强了结构，与现有技术的垫相比，增加了耐磨性。 还公开了制造抛光垫的方法。

    Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
    18.
    发明授权
    Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making 失效
    用于具有用于终点确定的透明窗口和制造方法的半导体晶片的化学/机械平面化的抛光垫

    公开(公告)号：US06945846B1

    公开(公告)日：2005-09-20

    申请号：US11091965

    申请日：2005-03-28

    Applicant: Angela Petroski ,  Richard D. Copper ,  Paul Fathauer ,  David Perry

    Inventor： Angela Petroski ,  Richard D. Copper ,  Paul Fathauer ,  David Perry

    IPC: B24B37/04 ,  B24D3/32 ,  B24D11/00 ,  B24B1/00

    CPC classification number: B24B37/205 ,  B24B37/24 ,  B24B37/26 ,  B24D3/32

    Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.

    Abstract translation: 用于半导体晶片的化学/机械平面化的多孔抛光垫具有通过将聚合物材料直接注入到垫的修改部分中而形成在多孔抛光垫的一部分中的透明部分。 修改的部分可以是低密度区域，或者可以通过去除衬垫的完整垂直部分来创建。 注入的聚合物通过在垫/窗口界面处流入垫的矩阵而与垫形成整体窗口。 不需要额外的钢筋来固定窗户; 然而，粘合剂和/或另一不透水层可以附着在窗户的后面用于额外的支撑。 在替代实施例中，将单独和不同的窗口插入到垫的切口部分中，并且通过衬垫的背面非工作表面上的一个或多个粘合膜层粘合到垫上。

    Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same
    19.
    发明申请
    Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same 审中-公开
    用于半导体晶片的化学机械界面的抛光垫及其制造方法

    公开(公告)号：US20050085169A1

    公开(公告)日：2005-04-21

    申请号：US10964603

    申请日：2004-10-14

    Applicant: Richard Cooper ,  Paul Fathauer ,  Angela Mroczek - Petroski ,  David Perry

    Inventor： Richard Cooper ,  Paul Fathauer ,  Angela Mroczek - Petroski ,  David Perry

    IPC: B24B37/24 ,  B24D3/32 ,  B24D13/14 ,  B24B1/00

    CPC classification number: B24B37/24 ,  B24D3/32

    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.

    Abstract translation: 一种抛光垫，用于由诸如酚醛树脂的热固性树脂材料组成的粘合剂由诸如纤维素的纤维基质制成的基材的化学机械抛光。 抛光表面被研磨以形成凹凸。 抛光垫提供多孔结构，通过该多孔结构储存用于基板的化学机械抛光期间的抛光浆料和抛光碎屑以便随后的漂洗以及用于增强抛光浆料的流动分布。 还公开了制造抛光垫的方法。

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