公开(公告)号：US12050741B1

公开(公告)日：2024-07-30

申请号：US18119036

申请日：2023-03-08

Applicant: Primax Electronics Ltd.

Inventor： Wei-Chiang Huang ,  Hung-Wei Kuo ,  Chao-Wei Lee ,  Ying-Yen Huang

IPC: G06F3/0354 ,  G06F1/16

CPC classification number: G06F3/03547 ,  G06F1/169

Abstract: A touchpad module for a computing device is provided. A fixing frame is concavely formed in a casing of the computing device. The fixing frame includes a supporting part. The touchpad module is installed within the fixing frame. The touchpad module includes a touch member and a pressure sensing element. The touch member includes a covering plate and a circuit board. An edge part of covering plate is supported on the supporting part. The pressure sensing element is installed on the touch member and electrically connected with the circuit board. While the touch member is pressed, the touch member is bent downwardly. Consequently, the touch member has a deformation amount. According to the deformation amount, a magnitude of a pressing force exerted on the touch member is sensed, and a pressure sensing signal is generated.

公开(公告)号：US20240028076A1

公开(公告)日：2024-01-25

申请号：US17884332

申请日：2022-08-09

Applicant: Primax Electronics Ltd.

Inventor： Chuan-Tai Hsiao ,  Chun-Han Huang ,  Tse-Ping Kuan ,  Hung-Wei Kuo

IPC: G06F1/16

CPC classification number: G06F1/1632

Abstract: An electronic system with an expansion system is provided. The electronic system includes plural electronic devices. Each electronic device includes plural connecting interfaces. The plural electronic devices are combined together through the plural connecting interfaces.

公开(公告)号：US11754769B1

公开(公告)日：2023-09-12

申请号：US18125284

申请日：2023-03-23

Applicant: Primax Electronics Ltd.

Inventor： Wei-Ping Chan ,  Ruey-Piin Wang ,  Chia-Ming Li ,  Hung-Wei Kuo

IPC: F21V8/00

CPC classification number: G02B6/0046 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0088

Abstract: A backlight kit includes a base member, a covering member, a slim-type light guide element and an illumination module. The covering member is combined with the base member. The slim-type light guide element and the illumination module are arranged between the base member and the covering member. After the illumination module emits a light beam to the slim-type light guide element, the light beam is transferred through the slim-type light guide element. Consequently, a luminance gradient region is formed on the surface of the covering member.

公开(公告)号：US20200251628A1

公开(公告)日：2020-08-06

申请号：US16394358

申请日：2019-04-25

Applicant: Primax Electronics Ltd.

Inventor： Ya-Chin Tu ,  Hung-Wei Kuo ,  Yu-Zeng Yang

IPC: H01L33/52 ,  H01L33/00 ,  H01L33/02

Abstract: A semiconductor light emitting unit and a packaging method of the semiconductor light emitting unit are provided. The packaging method includes the following steps. In a step (a), a transparent substrate is provided. In a step (b), a transparent membrane circuit layer is formed on a surface of the transparent substrate. In a step (c), a semiconductor light emitting chip is formed on the transparent membrane circuit layer by a flip-chip mounting process, so that the semiconductor light emitting chip and the transparent membrane circuit layer are electrically connected with each other. In a step (d), an encapsulant is formed over the semiconductor light emitting chip to cover the semiconductor light emitting chip and a portion of the transparent membrane circuit layer. In a step (e), the encapsulant is baked.

公开(公告)号：US11870336B1

公开(公告)日：2024-01-09

申请号：US17884196

申请日：2022-08-09

Applicant: Primax Electronics Ltd.

Inventor： Chuan-Tai Hsiao ,  Chun-Han Huang ,  Tse-Ping Kuan ,  Hung-Wei Kuo

IPC: G06F13/38 ,  G06F13/40 ,  H02M1/088 ,  H02M3/335

CPC classification number: H02M1/088 ,  H02M3/33569

Abstract: An input system includes a first input device and a second input device. Each of the first input device and the second input device includes a main body, a first connecting port, at least two second connecting ports, a power switching circuit and a control unit. When the first connecting port of the first input device is connected with an external power source, the power switching circuit of the first input device receives a first voltage from the external power source. When one of the second connecting ports of the first input device is connected with one of the second connecting ports of the second input device, the first voltage is converted into a second voltage by the power switching circuit of the first input device and the second voltage is transmitted to the second input device.

公开(公告)号：US20230409503A1

公开(公告)日：2023-12-21

申请号：US17884196

申请日：2022-08-09

Applicant: Primax Electronics Ltd.

Inventor： Chuan-Tai Hsiao ,  Chun-Han Huang ,  Tse-Ping Kuan ,  Hung-Wei Kuo

IPC: H02M1/088 ,  H02M3/335

CPC classification number: H02M1/088 ,  H02M3/33569

Abstract: An input system includes a first input device and a second input device. Each of the first input device and the second input device includes a main body, a first connecting port, at least two second connecting ports, a power switching circuit and a control unit. When the first connecting port of the first input device is connected with an external power source, the power switching circuit of the first input device receives a first voltage from the external power source. When one of the second connecting ports of the first input device is connected with one of the second connecting ports of the second input device, the first voltage is converted into a second voltage by the power switching circuit of the first input device and the second voltage is transmitted to the second input device.

公开(公告)号：US20220069179A1

公开(公告)日：2022-03-03

申请号：US17108857

申请日：2020-12-01

Applicant: Primax Electronics Ltd.

Inventor： Ya-Chin Tu ,  Hung-Wei Kuo

IPC: H01L33/56 ,  H01L25/075

Abstract: A light source module includes a substrate, plural light-emitting elements and an encapsulation structure. The plural light-emitting elements are installed on the substrate. The encapsulation structure is installed on the substrate to cover the plural light-emitting elements. The encapsulation structure is made of a composition containing a polymeric glue material, a white powder material and a black powder material. In the composition, a content of the polymeric glue material is 65%˜99.8% by weight, a content of the white powder material is 0.1%˜20% by weight, and a content of the black powder material is 0.1%˜25% by weight.

公开(公告)号：US10964860B2

公开(公告)日：2021-03-30

申请号：US16422800

申请日：2019-05-24

Applicant: Primax Electronics Ltd.

Inventor： Hung-Wei Kuo ,  Ya-Chin Tu ,  Chung-Yuan Chen

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/56 ,  H01L33/00

Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

公开(公告)号：US20200295243A1

公开(公告)日：2020-09-17

申请号：US16422800

申请日：2019-05-24

Applicant: Primax Electronics Ltd.

Inventor： Hung-Wei Kuo ,  Ya-Chin Tu ,  Chung-Yuan Chen

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/62

Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.

公开(公告)号：US20190229229A1

公开(公告)日：2019-07-25

申请号：US16192119

申请日：2018-11-15

Applicant: Primax Electronics Ltd.

Inventor： Chung-Yuan Chen ,  Hung-Wei Kuo ,  Ya-Chin Tu

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/52 ,  H01L33/44 ,  H05K1/18

Abstract: A light source module includes a LED die, a supporting base and an encapsulation layer. The LED die emits a light beam. The supporting base is electrically connected with the LED die, and supports the LED die. After a portion of the light beam is projected to and reflected by the supporting base, the portion of the light beam is projected to surroundings through the LED die. The encapsulation layer covers the LED die and a portion of the supporting base to protect the LED die. The encapsulation layer includes a light-adjusting element. A characteristic of the light beam is changed through the light-adjusting element.