Abstract:
Disclosed herein is a common mode noise filter including: a plurality of insulation layers configuring a laminated body formed on a substrate; internal electrode coils included in the plurality of insulation layers; external electrode terminals connected to an end portion of the internal electrode coils; and a magnetic layer formed on a surface of the laminated body. According to the present invention, the common mode noise filter has the magnetic layer including the conductive metal on the uppermost layer thereof, such that the permeability of the ferrite composite may be increased and the ferrite powder may be effectively compensated for the eddy current loss of the internal electrode coil, thereby making it possible to improve the impedance characteristics of the common mode noise filter.
Abstract:
A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes disposed externally on the body, respectively including a first layer connected to the internal electrode and a second layer covering the first layer, wherein the first layer includes a metal particle including an element A and a Z-A-O phase formed in the metal particle, and here, the element Z is an alkali metal.
Abstract:
An electronic component includes a plurality of dielectric layers; and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with a corresponding dielectric layer interposed therebetween. One of the plurality of first internal electrodes includes a metal layer containing Ni and Sn, a first graphene layer disposed on a lower surface of the metal layer, and a second graphene layer disposed on an upper surface of the metal layer.
Abstract:
A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.
Abstract:
The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.
Abstract:
Disclosed herein is an electrostatic discharge protection material having more stable operation characteristic by mixing and dispersing inorganic particles and metal particles in a resin matrix and an electrostatic discharge protection device using the same.
Abstract:
Disclosed herein is a common mode filter including: a magnetic substrate; an electrode layer disposed on one surface of the magnetic substrate and formed of a coil electrode and an insulating resin enclosing the coil electrode; and an uneven layer disposed between the magnetic substrate and the electrode and formed of a groove and a projection, wherein a part of the insulating resin is depressed between the groove of the uneven layer, whereby an adhesion between the magnetic substrate and the insulating resin is increased.
Abstract:
Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability.
Abstract:
Disclosed herein is a common mode noise filter independently including ferrite powder having pores formed in a surface thereof or including at least two kinds of ferrite powder having different particle sizes as a magnetic layer.According to the present invention, the adhesive strength between the polymer binder and the ferrite powder that are included in the magnetic layer is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact.
Abstract:
Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.