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公开(公告)号:US20230223405A1
公开(公告)日:2023-07-13
申请号:US18122253
申请日:2023-03-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Minhee CHOI , Keunhwi CHO , Myunggil KANG , Seokhoon KIM , Dongwon KIM , Pankwi PARK , Dongsuk SHIN
IPC: H01L29/08 , H01L29/06 , H01L29/161 , H01L29/167 , H01L29/423 , H01L29/775 , H01L21/02 , H01L29/66
CPC classification number: H01L29/0847 , H01L29/0673 , H01L29/161 , H01L29/167 , H01L29/42392 , H01L29/775 , H01L21/02532 , H01L21/02579 , H01L21/0262 , H01L29/66439
Abstract: An integrated circuit device includes a fin-type active area along a first horizontal direction on a substrate, a device isolation layer on opposite sidewalls of the fin-type active area, a gate structure along a second horizontal direction crossing the first horizontal direction, the gate structure being on the fin-type active area and on the device isolation layer, and a source/drain area on the fin-type active area, the source/drain area being adjacent to the gate structure, and including an outer blocking layer, an inner blocking layer, and a main body layer sequentially stacked on the fin-type active area, and each of the outer blocking layer and the main body layer including a Si1-xGex layer, where x≠0, and the inner blocking layer including a Si layer.
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公开(公告)号:US20220384623A1
公开(公告)日:2022-12-01
申请号:US17886612
申请日:2022-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Myung Gil KANG , Dongwon KIM , Minyi KIM , Keun Hwi CHO
IPC: H01L29/732 , H01L21/8228 , H01L21/8238 , H01L29/06 , H01L29/66 , H01L29/735
Abstract: A semiconductor device including a well region in a substrate, an impurity region in the well region, a first active fin on the impurity region, a second active fin on the well region, and a connection pattern penetrating the second active fin and connected to the well region may be provided. The substrate and the impurity region include impurities having a first conductivity type. The well region includes impurities having a second conductivity type different from the first conductivity type. The first active fin includes a plurality of first semiconductor patterns that are spaced apart from each other in a direction perpendicular to a top surface of the substrate. The first semiconductor patterns and the impurity region include impurities having the first conductivity type.
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公开(公告)号:US20220320312A1
公开(公告)日:2022-10-06
申请号:US17568170
申请日:2022-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Beomjin PARK , Dongwon KIM , Bongseok SUH , Daewon KIM
IPC: H01L29/66 , H01L29/78 , H01L29/417 , H01L29/10
Abstract: A semiconductor device includes a first and second active regions extending in a first direction and having respective first and second widths in a second direction, the second width greater than the first width, a connection region connected to the first and second active regions and having a third width, between the first and second widths in the second direction, first and second gate structures respectively intersecting the first and second active regions and extending in the second direction, and a dummy structure intersecting at least a portion of the connection region, extending in the second direction, and between the first and second gate structures in the first direction. The dummy structure includes first and second pattern portions spaced apart from a side surface of the first gate structure by respective first and second distances in the first direction, the second distance greater than the first distance.
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公开(公告)号:US20220157853A1
公开(公告)日:2022-05-19
申请号:US17369236
申请日:2021-07-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Keun Hwi CHO , Sangdeok KWON , Dae Sin KIM , Dongwon KIM , Yonghee PARK , Hagju CHO
IPC: H01L27/118 , H01L27/092 , H01L27/02 , H01L21/8238
Abstract: A semiconductor device includes first and second active patterns respectively on the first and second active regions of a substrate, a gate electrode on the first and second channel patterns, active contacts electrically connected to at least one of the first and second source/drain patterns, a gate contact electrically connected to the gate electrode, a first metal layer on the active and gate contacts and including a first and second power line, and first and second gate cutting patterns below the first and second power lines. The first active pattern may include first channel pattern between a pair of first source/drain patterns. The second active pattern may include a second channel pattern between a pair of second source/drain patterns. The first and second gate cutting patterns may cover the outermost side surfaces of the first and second channel patterns, respectively.
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公开(公告)号:US20250144822A1
公开(公告)日:2025-05-08
申请号:US19013251
申请日:2025-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyeongsup BYEON , Inwook KOO , Dongwon KIM , Minyoung KIM , Yi JIN , Jongkyu KIM , Jinho SO , Byungjun AN , Yinghu XU , Beomsoo HWANG
Abstract: A gas supply system includes a loading/unloading stage including a cradle loader where a cradle loaded with a gas container is loaded, a test buffer chamber is configured to test the gas container, and a loading/unloading robot configured to transfer the gas container between the cradle and the test buffer chamber. A gas supply stage includes a storage queue configured to temporarily store the gas container, a gas supply cabinet where the gas container is mounted, and a transfer robot configured to transfer the gas container between the test buffer chamber and the storage queue and between the storage queue and the gas supply cabinet.
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公开(公告)号:US20240355883A1
公开(公告)日:2024-10-24
申请号:US18385537
申请日:2023-10-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyumin YOO , Myung Gil KANG , Dongwon KIM , Jongsu KIM , Beomjin PARK , Byeonghee SON
IPC: H01L29/08 , H01L21/8238 , H01L27/092 , H01L29/775 , H01L29/786
CPC classification number: H01L29/0847 , H01L21/823814 , H01L27/092 , H01L29/775 , H01L29/78696 , H01L29/0653
Abstract: A semiconductor device includes a substrate including an active pattern; a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns, which are stacked to be spaced apart from each other; a source/drain pattern connected to the plurality of semiconductor patterns; a gate electrode on the plurality of semiconductor patterns; and a blocking layer between the source/drain pattern and the active pattern, wherein the source/drain pattern includes a protruding side surface protruding toward the semiconductor patterns, the blocking layer includes silicon-germanium (SiGe), and a germanium concentration of the blocking layer is higher than a germanium concentration of the source/drain pattern.
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公开(公告)号:US20240178293A1
公开(公告)日:2024-05-30
申请号:US18228824
申请日:2023-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyumin YOO , Beomjin PARK , Myung Gil KANG , Dongwon KIM , Younggwon KIM
IPC: H01L29/423 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/417 , H01L29/775 , H01L29/786
CPC classification number: H01L29/42392 , H01L27/092 , H01L29/0673 , H01L29/0847 , H01L29/41733 , H01L29/41783 , H01L29/775 , H01L29/78696 , H01L29/7848
Abstract: Disclosed is a semiconductor device comprising a substrate including an active pattern, a channel pattern on the active pattern and including semiconductor patterns spaced apart from and vertically stacked on each other, a source/drain pattern connected to the semiconductor patterns having a p-type, a gate electrode on the semiconductor patterns and including inner electrodes between neighboring semiconductor patterns and an outer electrode on an uppermost semiconductor pattern, and a gate dielectric layer between the gate electrode and the semiconductor patterns and including an inner gate dielectric layer adjacent to the inner electrode and an outer gate dielectric layer that extends from bottom to lateral surfaces of the outer electrode. The outer electrode and the outer gate dielectric layer have an inverted T shape.
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公开(公告)号:US20240153954A1
公开(公告)日:2024-05-09
申请号:US18414039
申请日:2024-01-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minhee CHOI , Keunhwi CHO , Myunggil KANG , Seokhoon KIM , Dongwon KIM , Pankwi PARK , Dongsuk SHIN
IPC: H01L27/092 , H01L21/02 , H01L29/06 , H01L29/08 , H01L29/161 , H01L29/167 , H01L29/423 , H01L29/66 , H01L29/775 , H01L29/78
CPC classification number: H01L27/0924 , H01L21/02532 , H01L21/02579 , H01L21/0262 , H01L29/0673 , H01L29/0847 , H01L29/161 , H01L29/167 , H01L29/42392 , H01L29/66439 , H01L29/66795 , H01L29/775 , H01L29/7851
Abstract: An integrated circuit device includes a fin-type active area along a first horizontal direction on a substrate, a device isolation layer on opposite sidewalls of the fin-type active area, a gate structure along a second horizontal direction crossing the first horizontal direction, the gate structure being on the fin-type active area and on the device isolation layer, and a source/drain area on the fin-type active area, the source/drain area being adjacent to the gate structure, and including an outer blocking layer, an inner blocking layer, and a main body layer sequentially stacked on the fin-type active area, and each of the outer blocking layer and the main body layer including a Si1-xGex layer, where x≠0, and the inner blocking layer including a Si layer.
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公开(公告)号:US20200235222A1
公开(公告)日:2020-07-23
申请号:US16836138
申请日:2020-03-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changwoo NOH , Munhyeon KIM , Hansu OH , Sungman WHANG , Dongwon KIM
IPC: H01L29/66 , H01L29/78 , H01L21/311 , H01L29/786 , H01L29/423
Abstract: Semiconductor devices and methods of fabricating the same are provided. The method includes forming on a substrate an active pattern that protrudes from the substrate and extends in one direction; forming on the active pattern a sacrificial gate structure that extends in a direction intersecting the active pattern; forming on a side surface of the sacrificial gate structure a first spacer including a first portion at a lower level than a top surface of the active pattern and a second portion on the first portion, and reducing a thickness of the second portion of the first spacer.
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公开(公告)号:US20180246508A1
公开(公告)日:2018-08-30
申请号:US15908558
申请日:2018-02-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hoon CHOI , Sung-Dae CHO , Nara CHO , Dongwon KIM , Dongjin PARK , Sang-Min SHIN
IPC: G05D1/00
CPC classification number: G05D1/0022 , B60R25/24 , G08C17/02
Abstract: Various embodiments of the present disclosure relate to an apparatus and a method for communicating with another electronic device in an electronic device. The electronic device includes: a first communication module configured to support low frequency communication; a second communication module configured to support cellular communication; at least one sensor; at least one processor; and a memory electrically connected with the processor, wherein, when being executed, the memory may store instructions that cause the at least one processor to detect a motion of the electronic device based on the at least one sensor, and to transmit a signal for controlling an activation state regarding the low-frequency communication with another electronic device to the another electronic device via the second communication module, based on motion information of the electronic device. Other embodiments are possible.
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