公开(公告)号：US20240313189A1

公开(公告)日：2024-09-19

申请号：US18674482

申请日：2024-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gunwoo KIM ,  Seongho SON ,  Jongsung LEE ,  Changjoon LEE ,  Seonghwan SHIN ,  Tackmo LEE ,  Soonmin HONG

IPC: H01L33/64 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/644 ,  H01L25/167 ,  H01L27/124

Abstract: A display apparatus includes: a display module array including a plurality of display modules arranged in a matrix, wherein each display module of the plurality of display modules includes: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface of the substrate; a metal plate adhered to the rear surface of the substrate and configured to dissipate heat generated by the substrate; a front cover covering the mounting surface; a first conductive layer on the mounting surface; and a second conductive layer between the front cover and the first conductive layer.

公开(公告)号：US20200350476A1

公开(公告)日：2020-11-05

申请号：US16863069

申请日：2020-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Seongho SON ,  Jongsung LEE ,  Youngki JUNG

IPC: H01L33/62 ,  G02B1/14 ,  H01L25/075 ,  G09F9/302 ,  G09G3/32

Abstract: A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.