公开(公告)号：US20250087562A1

公开(公告)日：2025-03-13

申请号：US18816740

申请日：2024-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Narae Shin ,  Jeongkyu Ha ,  Woonbae Kim ,  Yechung Chung

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A chip on film package includes a base film having a first surface and a second surface which are opposite to each other, at least one first conductive line disposed on the first surface and extending in a first direction, at least one second conductive line disposed on the second surface and extending in the first direction, a semiconductor chip disposed on the first surface and connected to the at least one first conductive line through a bump structure, a protective layer covering a part of the first surface and a part of the second surface, and a display panel disposed on the first surface and connected to the at least one first conductive line, wherein the at least one second conductive line is not disposed on the second surface between the semiconductor chip and the display panel.

公开(公告)号：US10776601B2

公开(公告)日：2020-09-15

申请号：US16027620

申请日：2018-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woonbae Kim ,  Jikho Song ,  Sungeun Jo ,  Ji-Yong Park ,  Jeong-Kyu Ha

IPC: G06K9/28 ,  G06K9/00 ,  G09G3/3208

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

公开(公告)号：US10282587B2

公开(公告)日：2019-05-07

申请号：US15395623

申请日：2016-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho Choi ,  Youngdoo Jung ,  Woonbae Kim ,  Jungwoo Kim ,  Ji-Yong Park ,  Kyoungsuk Yang ,  Jeong-Kyu Ha

IPC: G06K9/20 ,  G06K9/00

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.