SENSING DEVICES
    11.
    发明公开
    SENSING DEVICES 审中-公开

    公开(公告)号:US20230358601A1

    公开(公告)日:2023-11-09

    申请号:US18353059

    申请日:2023-07-14

    CPC classification number: G01H11/08

    Abstract: The present disclosure discloses a sensing device, comprising a sensor configured to convert a sound signal into an electrical signal, the sensor having a first resonant frequency; and a resonant system including a vibration pickup unit and configured to generate a vibration in response to a vibration of a housing of the sensing device. The vibration pickup unit may include at least an elastic diaphragm and a mass block. The elastic diaphragm may be connected to the housing the sensing device through a peripheral side of the elastic diaphragm. The mass block may be at least made of a polymer material. A first acoustic cavity may be defined between the elastic diaphragm and the sensor. When the housing of the sensing device generates a vibration in response to an external sound signal, the elastic diaphragm and the mass block may generate a vibration in response to the vibration of the housing of the sensing device. The elastic diaphragm may cause a sound pressure change in the first acoustic cavity during a vibration process, and the sensor may convert the external sound signal into an electrical signal based on the sound pressure change in the acoustic cavity. The resonant system may provide at least one second resonant frequency to the sensing device. The second resonant frequency may be lower than the first resonant frequency.

    BONE CONDUCTION MICROPHONES
    12.
    发明公开

    公开(公告)号:US20230247352A1

    公开(公告)日:2023-08-03

    申请号:US18169227

    申请日:2023-02-15

    CPC classification number: H04R1/46 H04R17/10 H04R17/025 H10N30/50 H10N30/308

    Abstract: The present disclosure is of a bone conduction microphone. The bone conduction microphone comprises of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, the vibration unit deforms in response to the vibration of the base structure, and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. A resonant frequency of the bone conduction microphone is within a range of 2.5 kHz-4.5 kHz.

    VIBRATION SENSOR
    14.
    发明公开
    VIBRATION SENSOR 审中-公开

    公开(公告)号:US20230199370A1

    公开(公告)日:2023-06-22

    申请号:US18168585

    申请日:2023-02-14

    CPC classification number: H04R1/2807 H04R1/04 H04R1/08

    Abstract: The present disclosure provides a vibration sensor. The vibration sensor may include a vibration receiver and an acoustic transducer. The vibration receiver may include a housing, a limiter and a vibration unit. The housing and the acoustic transducer may form an acoustic cavity. The vibration unit may be located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The housing may be configured to generate a vibration based on an external vibration signal. The vibration unit may change an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal. The vibration unit may include a mass element and an elastic element. A first side of the elastic element may be connected around a side wall of the mass element. A second side of the elastic element may be connected with the limiter.

    MICROPHONE
    15.
    发明申请

    公开(公告)号:US20230049593A1

    公开(公告)日:2023-02-16

    申请号:US17816013

    申请日:2022-07-29

    Abstract: The present disclosure provides a microphone, comprising a shell structure, a vibration pickup assembly, a vibration pickup assembly, wherein the vibration pickup assembly is accommodated in the shell structure and generates vibration in response to an external sound signal transmitted to the shell structure, and at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal, wherein the at least two acoustoelectric conversion elements have different frequency responses to the vibration of the vibration pickup assembly.

    VIBRATION SENSORS
    16.
    发明申请

    公开(公告)号:US20230046902A1

    公开(公告)日:2023-02-16

    申请号:US17814533

    申请日:2022-07-25

    Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

    TOUCH SENSOR DEVICES
    17.
    发明申请

    公开(公告)号:US20250085816A1

    公开(公告)日:2025-03-13

    申请号:US18955929

    申请日:2024-11-21

    Abstract: The embodiments of the present disclosure provide a touch sensor device. The touch sensor device comprises a housing, configured to provide a touch region; and at least one sensor, configured to be fixed near the touch region. The at least one sensor includes: a signal transmitting unit, configured to generate a vibration signal under the action of an excitation signal; a signal receiving unit, configured to receive the vibration signal and generate an output signal; and a processor, configured to recognize a touch operation performed on the touch region according to the output signal.

    BONE CONDUCTION MICROPHONE
    19.
    发明申请

    公开(公告)号:US20250030979A1

    公开(公告)日:2025-01-23

    申请号:US18908861

    申请日:2024-10-08

    Abstract: A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.

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