公开(公告)号：US09212053B2

公开(公告)日：2015-12-15

申请号：US14675349

申请日：2015-03-31

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Antonio Di-Giacomo

IPC: H01L21/00 ,  H01L21/4763 ,  B81C1/00 ,  H01L23/528 ,  H05K7/02

CPC classification number: B81C1/00246 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/098 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0714 ,  B81C2203/0735 ,  H01L23/528 ,  H01L2924/0002 ,  H05K7/02 ,  H01L2924/00

Abstract: An integrated circuit includes a number of metallization levels separated by an insulating region disposed over a substrate. A housing includes walls formed from metal portions produced in various metallization levels. A metal device is housed in the housing. An aperture is produced in at least one wall of the housing. An external mechanism outside of the housing is configured so as to form an obstacle to diffusion of a fluid out of the housing through the at least one aperture. At least one through-metallization passes through the external mechanism and penetrates into the housing through the aperture in order to make contact with at least one element of the metal device.

公开(公告)号：US20140266562A1

公开(公告)日：2014-09-18

申请号：US14289784

申请日：2014-05-29

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Antonio Di-Giacomo ,  Christian Rivero ,  Pascal Fornara

IPC: H01H1/00

CPC classification number: H01H1/0036 ,  H01H61/00 ,  H01H2001/0068 ,  H01H2037/008 ,  H01H2061/006 ,  H01H2061/008

Abstract: An integrated circuit, comprising an electrical-switching mechanical device in a housing having at least one first thermally deformable assembly including a beam held in at least two different locations by at least two arms secured to edges of the housing, the beam and the arms being metallic and situated within the same first metallization level and an electrically conductive body, wherein the said first thermally deformable assembly has at least one first configuration at a first temperature and a second configuration when at least one is at a second temperature different from the first temperature, wherein the beam is at a distance from the body in the first configuration and in contact with the said body and immobilized by the said body in the second configuration and establishing or prohibiting an electrical link passing through the body and through the beam.

Abstract translation: 一种集成电路，包括壳体中的电切换机械装置，其具有至少一个第一热变形组件，所述组件包括通过固定到所述壳体的边缘的至少两个臂固定在至少两个不同位置的梁，所述梁和所述臂是 金属并位于相同的第一金属化水平和导电体内，其中所述第一热变形组件在第一温度和第二构型具有至少一个第一构型，当至少一个处于与第一温度不同的第二温度时 ，其中所述梁在所述第一构造中与所述主体一定距离并且与所述主体接触并且以所述第二构造被所述主体固定，并且建立或禁止穿过所述主体并通过所述梁的电连杆。