公开(公告)号：US20190122845A1

公开(公告)日：2019-04-25

申请号：US16222017

申请日：2018-12-17

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Christian Rivero ,  Pascal Fornara ,  Antonio Di-Giacomo ,  Brice Arrazat

IPC: H01H61/02 ,  B81B3/00 ,  H01H1/58 ,  H01H9/02

CPC classification number: H01H61/02 ,  B81B3/0021 ,  B81B2201/031 ,  B81B2203/053 ,  H01H1/58 ,  H01H9/02

Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.

公开(公告)号：US09355802B2

公开(公告)日：2016-05-31

申请号：US14286331

申请日：2014-05-23

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Christian Rivero ,  Pascal Fornara ,  Antonio di-Giacomo ,  Brice Arrazat

IPC: H01H59/00 ,  H01L27/06 ,  H01L21/822 ,  H01H1/00 ,  H01L23/522

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01H1/0036 ,  H01H57/00 ,  H01H2001/0068 ,  H01H2001/0078 ,  H01H2059/0054 ,  H01L21/8221 ,  H01L23/522 ,  H01L27/0617 ,  H01L27/0688 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.

Abstract translation: 集成电路包括具有多个金属化级别的互连部件。 互连部件内的可电激活的开关装置具有包括由结构保持的梁的组件。 梁和结构位于相同的金属化水平内。 布置结构在梁上的固定位置，以便为梁定义位于这些固定位置之间的枢转点。 该结构在不存在电位差的情况下相对于光束和垂直于光束的平面基本对称。 在存在施加在结构的第一部分之间的第一电位差并且在存在施加在结构的第二部分之间的第二电位差的情况下在第二方向上枢转时，梁能够在第一方向上枢转。