公开(公告)号：US20220075500A1

公开(公告)日：2022-03-10

申请号：US17321879

申请日：2021-05-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sol Ji CHANG ,  Gye Won LEE ,  Mun Sun JUNG ,  Hong Seok LEE ,  Jong Yun KIM ,  Chang Ju LEE ,  Hee Sun OH

IPC: G06F3/041 ,  G06F3/044

Abstract: A device with touch sensing includes a bracket, a pad disposed above one side of the bracket, the pad having a capacitance that varies as a touch is applied proximate to the device, and a sensing coil disposed below another side of the bracket that opposes the one side, with at least a portion of the sensing coil overlapping the pad.

公开(公告)号：US20210333886A1

公开(公告)日：2021-10-28

申请号：US16990204

申请日：2020-08-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Ju LEE ,  Gye Won LEE ,  Jong Yun KIM

IPC: G06F3/02

Abstract: A force sensing device includes: a sensor support portion; at least one force sensor disposed on a first surface side of the sensor support portion; a frame disposed on a second surface side of the sensor support portion and spaced apart from the sensor support portion; and a pressure applying member disposed between the sensor support portion and the frame, and configured to apply pressure to the sensor support portion.

公开(公告)号：US20210045225A1

公开(公告)日：2021-02-11

申请号：US16729661

申请日：2019-12-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Seok LEE ,  Gye Won LEE ,  Hee Sun OH ,  Jong Yun KIM ,  Seung Pil JUNG ,  Chang Ju LEE

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/28 ,  H05K3/46

Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

公开(公告)号：US20200258841A1

公开(公告)日：2020-08-13

申请号：US16423908

申请日：2019-05-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong Yun KIM ,  Chang Ju LEE ,  Gye Won LEE ,  Hee Sun OH ,  Hong Seok LEE

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/552 ,  H01L23/367 ,  H05K1/18

Abstract: An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.