公开(公告)号：US20240106488A1

公开(公告)日：2024-03-28

申请号：US18526774

申请日：2023-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongbeen YUN ,  Joongkwon KIM ,  Jongho PARK ,  Wonhyung HEO

IPC: H04B1/40

CPC classification number: H04B1/40

Abstract: According to various embodiments, an electronic device may include: an antenna, an antenna tuner, a transceiver, a power amplifier electrically connected to the antenna tuner and configured to perform power amplification according to an execution of impedance matching, and at least one processor operatively connected to the transceiver, the antenna tuner, and the power amplifier. The at least one processor may be configured to: configure a reference tuner code for the antenna tuner connected to the antenna in a signal path of the transceiver and identify a reflection coefficient of the antenna, calculate a tuner code of the antenna tuner based on whether the identified reflection coefficient of the antenna has been changed and an operation of at least one component of the antenna tuner, and perform the impedance matching of the antenna.

公开(公告)号：US20220399316A1

公开(公告)日：2022-12-15

申请号：US17677453

申请日：2022-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ju-Il CHOI ,  Gyuho KANG ,  Heewon KIM ,  Sechul PARK ,  Jongho PARK ,  Junyoung PARK

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48

Abstract: Disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. The semiconductor chip has third and fourth surfaces opposite to each other. The third surface of the semiconductor chip faces the first surface of the interposer substrate. The redistribution patterns are connected to the fourth surface of the semiconductor chip. The semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. Each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.

公开(公告)号：US20220231018A1

公开(公告)日：2022-07-21

申请号：US17712272

申请日：2022-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byounghoon LEE ,  Jongho PARK ,  Wandon KIM ,  Sangjin HYUN

IPC: H01L27/088 ,  H01L29/423 ,  H01L29/49 ,  H01L29/10 ,  H01L29/06

Abstract: A semiconductor device includes a plurality of semiconductor patterns that are sequentially stacked and spaced apart from each other on a substrate, and a gate electrode on the plurality of semiconductor patterns. The gate electrode includes a capping pattern and a work function pattern that are sequentially stacked on the plurality of semiconductor patterns. The capping pattern includes a first metal nitride layer including a first metal element, and a second metal nitride layer including a second metal element whose work function is greater than a work function of the first metal element. The first metal nitride layer is disposed between the second metal nitride layer and the plurality of semiconductor patterns. The first metal nitride layer is thinner than the second metal nitride layer.

公开(公告)号：US20220104148A1

公开(公告)日：2022-03-31

申请号：US17449345

申请日：2021-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngkwon LEE ,  Youngjun PARK ,  Hyungjoon YU ,  Hyoungjoo LEE ,  Jongho PARK

IPC: H04W52/32 ,  H04W52/36 ,  H04W52/24

Abstract: According to various embodiments, an electronic device may include: multiple antennas configured to support long-term evolution (LTE) communication and new radio (NR) communication; a memory configured to store association information between first multiple output powers used for the LTE communication and second multiple output powers used for the NR communication corresponding to the first multiple output powers respectively, and at least one processor, wherein the at least one processor is configured to: configure an LTE transmission power to be used for data transmission in a physical uplink shared channel (PUSCH) of the LTE communication, identify a first NR output power maximum value corresponding to the LTE transmission power based on the association information, identify a sounding reference signal (SRS) output power to be used for SRS transmission through at least one of the multiple antennas, and at least temporarily reduce the LTE transmission power based on the SRS output power being greater than the first NR output power maximum value.

公开(公告)号：US20210326553A1

公开(公告)日：2021-10-21

申请号：US17231253

申请日：2021-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunjang JIN ,  Jongho PARK ,  Jungwoo CHOE

IPC: G06K9/00 ,  G06F3/041 ,  G06F3/02 ,  G06K9/34

Abstract: An electronic device is provided. The electronic device includes a display, a fingerprint recognition sensor disposed under a first area of the display, at least one input detection sensor, and at least one processor electrically connected with the display, the fingerprint recognition sensor, and the at least one input detection sensor, wherein the at least one processor is configured to detect a designated event through the at least one input detection sensor, acquire background information through the fingerprint recognition sensor according to detection of the designated event, acquire fingerprint information of an object through the fingerprint recognition sensor in response to detecting the object on the first area of the display, and subtract the background information from the fingerprint information.

公开(公告)号：US20200187309A1

公开(公告)日：2020-06-11

申请号：US16364705

申请日：2019-03-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kilyoung LEE ,  Jinseok KWON ,  Jongho PARK ,  Jinhee CHO ,  Kumchul HWANG

IPC: H05B6/06 ,  H05B1/02 ,  H05B3/68

Abstract: A cooking apparatus is provided. The cooking apparatus includes heating coils, an input apparatus receiving input of output levels for each of the heating coils, inverters providing driving power to each of the heating coils separately, and a processor controlling the inverters based on the inputted output levels. The processor is configured to predict the power consumption of each of the heating coils based on the inputted output levels, and based on the sum of the predicted power consumption being greater than a predetermined power value, determine a subject heating coil based on the predicted power consumption for each heating coil and history information on power adjustment of the heating coils, and control an inverter corresponding to the subject heating coil such that the subject heating coil operates at a smaller output level than a current output level.

公开(公告)号：US20240429214A1

公开(公告)日：2024-12-26

申请号：US18820569

申请日：2024-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ju-Il CHOI ,  Gyuho KANG ,  Heewon KIM ,  Sechul PARK ,  Jongho PARK ,  Junyoung PARK

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: Disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. The semiconductor chip has third and fourth surfaces opposite to each other. The third surface of the semiconductor chip faces the first surface of the interposer substrate. The redistribution patterns are connected to the fourth surface of the semiconductor chip. The semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. Each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.

公开(公告)号：US20240203855A1

公开(公告)日：2024-06-20

申请号：US18356721

申请日：2023-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaemok JUNG ,  Un-Byoung KANG ,  Dowan KIM ,  Sung Keun PARK ,  Jongho PARK ,  Ju-Il CHOI

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/565 ,  H01L21/76811 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/08 ,  H01L24/32 ,  H01L2224/08055 ,  H01L2224/08155 ,  H01L2224/32146 ,  H01L2224/32235 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/182

Abstract: An embodiment provides a semiconductor package including: a first redistribution layer substrate; a semiconductor chip on the first redistribution layer substrate; a coupling member on the first redistribution layer substrate, wherein the coupling member is spaced apart from the semiconductor chip; an encapsulant on the first redistribution layer substrate, the semiconductor chip, and the coupling member; and a second redistribution layer substrate on the encapsulant, wherein the coupling member includes a vertical wire and a metal portion extending around the vertical wire, and wherein a first end of the coupling member is electrically connected to the first redistribution layer substrate, and a second end of the coupling member is electrically connected to the second redistribution layer substrate.

公开(公告)号：US20240098800A1

公开(公告)日：2024-03-21

申请号：US18469233

申请日：2023-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkwon LEE ,  Hyungjoon YU ,  Myungjin KANG ,  Jongho PARK ,  Jongphil LEE

IPC: H04W74/08 ,  H04W52/34 ,  H04W72/0453

CPC classification number: H04W74/0833 ,  H04W52/34 ,  H04W72/0453

Abstract: An example electronic device includes at least one sensor including a grip sensor, at least one antenna, a radio frequency (RF) circuit including at least one antenna tuning circuit connected to the at least one antenna, and at least one communication processor operatively connected to the RF circuit. The at least one communication processor is configured to, control the RF circuit to transmit a random access preamble signal based on first transmission power and a first tuning value, identify whether a random access response (RAR) signal is received via the RF circuit in response to the random access preamble signal, identify whether a set condition is satisfied, based on the RAR signal not being received, change a tuning value of the at least one antenna tuning circuit which corresponds to the grip sensor from the first tuning value to a second tuning value, based on the set condition being satisfied, and control the RF circuit to transmit the random access preamble signal based on the first transmission power or second transmission power and the second tuning value.

公开(公告)号：US20210120471A1

公开(公告)日：2021-04-22

申请号：US16630672

申请日：2018-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihyeon CHOI ,  Jongho PARK ,  Sangyeon WON ,  Hanseok KIM ,  Daewoo LEE

IPC: H04W36/00

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to various embodiments of the present disclosure, a device of a terminal in a wireless communication system can include at least one transceiver and at least one processor operationally coupled with at least one transceiver. At least one processor can receive configuration information from a first network node for a first radio access technology (RAT), measure a first quality for a first signal of the first RAT and a second quality for a second signal of a second RAT on the basis of the received configuration information, and determine, whether a handover to a second network for the second RAT is performed, on the basis of the measured first quality or the measured second quality. The configuration information can include parameters for the handover between the first RAT and the second RAT.