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公开(公告)号：US12111864B2
公开(公告)日：2024-10-08
申请号：US17414802
申请日：2019-12-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jungho Park , Yunsu Lee , Jaehun Lee , Mirae Jeong , Jiyoung Kang , Sejin Kwak
IPC: G06F16/00 , G06F16/532 , G06F16/583 , G06F16/9032 , G06F16/951 , G06F16/9537 , G06N3/042 , G06N3/045 , G06N5/022 , G06N20/00 , G06V20/20 , H04L67/50 , G06Q30/0601
CPC classification number: G06F16/532 , G06F16/5846 , G06F16/5854 , G06F16/90332 , G06F16/951 , G06F16/9537 , G06N3/042 , G06N3/045 , G06N5/022 , G06V20/20 , H04L67/535 , G06Q30/0625
Abstract: An electronic device is disclosed. The electronic device comprises: a memory including at least one command; and a processor connected to the memory to control the electronic device, wherein by executing the at least one command, the processor obtains an image according to a user's interaction with the electronic device, obtains information about the user's intention according to information about an object obtained from the image and context information obtained during the interaction, and obtains information concerning the obtained object from a knowledge base stored in the memory, according to the information about the user's intention, wherein the knowledge base includes device information about a plurality of electronic devices used during the user's activity, object information about a plurality of objects obtained according to the activity, and intention information corresponding to correlative information, and the processor obtains, from the knowledge base, information concerning the obtained object according to the intention information corresponding to the obtained object.
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公开(公告)号：US11901276B2
公开(公告)日：2024-02-13
申请号：US18153601
申请日：2023-01-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeonho Jang , Jongyoun Kim , Jungho Park , Jaegwon Jang
IPC: H01L23/498 , H01L21/48 , H01L23/00
CPC classification number: H01L23/49816 , H01L21/4853 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L24/16 , H01L2224/16227
Abstract: A semiconductor package includes a semiconductor chip; a redistribution insulating layer including a first opening; an external connection bump including a first part in the first opening; a lower bump pad including a first surface in physical contact with the first part of the external connection bump and a second surface opposite to the first surface, wherein the first surface and the redistribution insulating layer partially overlap; and a redistribution pattern that electrically connects the lower bump pad to the semiconductor chip.
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公开(公告)号：US11874885B2
公开(公告)日：2024-01-16
申请号：US16928644
申请日：2020-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mirae Jeong , Hyonsok Lee , Jungho Park , Jaehun Lee , Taeho Hwang , Yunsu Lee , Jiyoung Kang
IPC: G06F16/9535 , G06F16/901 , G06N5/022
CPC classification number: G06F16/9535 , G06F16/9024 , G06N5/022
Abstract: A content recommendation is provided based on a knowledge graph using, for example, a processor and memory of a device. In some embodiments, sensors are used. The content recommendation efficiently makes user of the processor, memory and/or sensors. A knowledge graph is maintained at the device and another knowledge graph may be maintained at a server. The knowledge graph at the device is generated, for example, by obtaining log history information, generating a device knowledge graph, generating a pattern knowledge graph associated with a behavior pattern of a user, and/or updating the device knowledge graph by adding the pattern knowledge graph to the device knowledge graph. In some examples, the knowledge graph at the server is generated by a server, based on the pattern knowledge graph.
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公开(公告)号：US11145611B2
公开(公告)日：2021-10-12
申请号：US16795795
申请日：2020-02-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongyoun Kim , Jungho Park , Seokhyun Lee , Yeonho Jang , Jaegwon Jang
IPC: H01L23/498 , H01L25/065 , H01L23/00 , H01L21/768
Abstract: A semiconductor package includes a redistribution structure including a redistribution insulating layer and a redistribution pattern, a semiconductor chip provided on a first surface of the redistribution insulation layer and electrically connected to the redistribution pattern, and a lower electrode pad provided on a second surface opposite to the first surface of the redistribution insulating layer, the lower electrode pad including a first portion embedded in the redistribution insulating layer and a second portion protruding from the second surface of the redistribution insulating layer, wherein a thickness of the first portion of the lower electrode pad is greater than a thickness of the second portion of the lower electrode pad.
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公开(公告)号：US10224607B2
公开(公告)日：2019-03-05
申请号：US15217496
申请日：2016-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bomyoung Kim , Jungho Park , Byungman Lim , Young-Jun Cho
Abstract: An electronic device is provided that includes a housing, a first conductive member configured to form a part of the housing, or be partially disposed within the housing, wherein the first conductive member includes a first conductive protrusion disposed toward the inside of the housing, a second conductive member configured to form another part of the housing, wherein the second conductive member includes a portion disposed adjacent to a portion of the first conductive member and a second conductive protrusion disposed toward the inside of the housing, a non-conductive member disposed between the portion of the first conductive member and the portion of the second conductive member, a coupling structure that includes a conductor and is connected between the first conductive protrusion and the second conductive protrusion, and at least one communication circuit electrically connected to the second conductive member.
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Patent Agency Ranking
公开(公告)号：US20170047638A1
公开(公告)日：2017-02-16
申请号：US15217496
申请日：2016-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bomyoung KIM , Jungho Park , Byungman Lim , Young-Jun Cho
Abstract: An electronic device is provided that includes a housing, a first conductive member configured to form a part of the housing, or be partially disposed within the housing, wherein the first conductive member includes a first conductive protrusion disposed toward the inside of the housing, a second conductive member configured to form another part of the housing, wherein the second conductive member includes a portion disposed adjacent to a portion of the first conductive member and a second conductive protrusion disposed toward the inside of the housing, a non-conductive member disposed between the portion of the first conductive member and the portion of the second conductive member, a coupling structure that includes a conductor and is connected between the first conductive protrusion and the second conductive protrusion, and at least one communication circuit electrically connected to the second conductive member.
Abstract translation: 提供一种电子设备，其包括壳体，被配置为形成壳体的一部分的第一导电构件或部分地设置在壳体内，其中第一导电构件包括朝向壳体内部设置的第一导电突起， 第二导电构件，其被配置为形成所述壳体的另一部分，其中所述第二导电构件包括邻近所述第一导电构件的一部分设置的部分和朝向所述壳体的内部设置的第二导电突起， 所述第一导电构件的所述部分和所述第二导电构件的所述部分，包括导体并且连接在所述第一导电突起和所述第二导电突起之间的耦合结构，以及至少一个电连接到所述第二导电构件 。
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公开(公告)号：US20240235059A9
公开(公告)日：2024-07-11
申请号：US18399837
申请日：2023-12-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Juneseok LEE , Jinsu Heo , Youngsub Kim , Jungho Park , Kwanghyun Baek , Youngju Lee , Kyoungho Jeong , Dohyuk Ha
CPC classification number: H01Q21/065 , H01Q1/243 , H01Q9/0414 , H01Q9/045
Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
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公开(公告)号：US20240136734A1
公开(公告)日：2024-04-25
申请号：US18399837
申请日：2023-12-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Juneseok LEE , Jinsu Heo , Youngsub Kim , Jungho Park , Kwanghyun Baek , Youngju Lee , Kyoungho Jeong , Dohyuk Ha
CPC classification number: H01Q21/065 , H01Q1/243 , H01Q9/0414 , H01Q9/045
Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.
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公开(公告)号：US20210407940A1
公开(公告)日：2021-12-30
申请号：US17474614
申请日：2021-09-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongyoun Kim , Jungho Park , Seokhyun Lee , Yeonho Jang , Jaegwon Jang
IPC: H01L23/00 , H01L23/498 , H01L21/768 , H01L25/065
Abstract: A semiconductor package includes a redistribution structure including a redistribution insulating layer and a redistribution pattern, a semiconductor chip provided on a first surface of the redistribution insulation layer and electrically connected to the redistribution pattern, and a lower electrode pad provided on a second surface opposite to the first surface of the redistribution insulating layer, the lower electrode pad including a first portion embedded in the redistribution insulating layer and a second portion protruding from the second surface of the redistribution insulating layer, wherein a thickness of the first portion of the lower electrode pad is greater than a thickness of the second portion of the lower electrode pad.
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公开(公告)号：US20210089598A1
公开(公告)日：2021-03-25
申请号：US16928644
申请日：2020-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Mirae Jeong , Hyonsok Lee , Jungho Park , Jaehun Lee , Taeho Hwang , Yunsu Lee , Jiyoung Kang
IPC: G06F16/9535 , G06N5/02 , G06F16/901
Abstract: A content recommendation is provided based on a knowledge graph using, for example, a processor and memory of a device. In some embodiments, sensors are used. The content recommendation efficiently makes user of the processor, memory and/or sensors. A knowledge graph is maintained at the device and another knowledge graph may be maintained at a server. The knowledge graph at the device is generated, for example, by obtaining log history information, generating a device knowledge graph, generating a pattern knowledge graph associated with a behavior pattern of a user, and/or updating the device knowledge graph by adding the pattern knowledge graph to the device knowledge graph. In some examples, the knowledge graph at the server is generated by a server, based on the pattern knowledge graph.
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