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公开(公告)号：US20220159826A1
公开(公告)日：2022-05-19
申请号：US17440474
申请日：2020-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin YUN , Dongyeon KIM , Seongjin PARK , Sehyun PARK , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: Disclosed is an electronic device comprising: a housing comprising a first plate, a second plate, and a side member, the side member having a first part comprising a first surface, a second surface, a through-hole formed from the first surface to the second surface in a first direction in which same penetrates the side member, and a nonconductive material; a display; a printed circuit board comprising a third surface, a fourth surface, a first conductive layer, a second conductive layer, a feeding line, a conductive pattern, a conductive via, a third conductive layer disposed between the first conductive layer and the second conductive layer, a fourth conductive layer disposed between the first conductive layer and the third conductive layer, multiple first side vias formed so as to electrically connect the first conductive layer and the third conductive layer and to be spaced apart from the conductive via by a first distance in a second direction, which is perpendicular to the first direction, and in which same face away from the through-hole and the slit, and multiple second side vias formed so as to electrically connect the third conductive layer and the fourth conductive layer and to be spaced apart from the conductive via by a second distance, which is different from the first distance, in the second direction; and at least one wireless communication circuit. Various other embodiments recognizable from the specification are also possible.
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公开(公告)号：US20220069442A1
公开(公告)日：2022-03-03
申请号：US17423724
申请日：2020-01-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon KIM , Seongjin PARK , Sehyun PARK , Sumin YUN , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: Disclosed is an electronic device including: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a first portion comprising a conductive material, wherein the first portion of the side member includes a plurality of through-holes aligned in a first direction substantially parallel to the first plate and a non-conductive material inside the through-holes; a structure disposed inside the space to face the through-holes and including at least one conductive path; and a wireless communication circuit electrically connected to the conductive path. Various other embodiments inferred from the specification are also possible.
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公开(公告)号：US20200266523A1
公开(公告)日：2020-08-20
申请号：US16791377
申请日：2020-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin PARK , Dongyeon KIM , Sehyun PARK , Sumin YUN , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: An electronic device is provided, which includes an antenna structure disposed inside housing and including a first surface facing a first direction and a second surface facing a direction opposite to the first direction. When viewed from above the first surface, the antenna structure may include a first region including a periphery extending in a second direction perpendicular to the first direction and including at least one ground layer, a second region contacting the periphery, a first dipole antenna extending in the second direction and spaced from the periphery, within the second region when viewed from above the first surface, a second dipole antenna extending in the second direction between the periphery and the first dipole antenna, and at least one conductive pattern interposed between the periphery and the second dipole antenna.
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公开(公告)号：US20200243948A1
公开(公告)日：2020-07-30
申请号：US16750541
申请日：2020-01-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon KIM , Ahmed HUSSAIN , Seongjin PARK , Sehyun PARK , Sumin YUN , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: An electronic device is provided. The electronic device includes a housing, a display exposed through at least part of the first plate, an antenna structure body disposed inside the housing and including a first surface facing the non-conductive portion and a second surface facing away from the first surface, a spacer structure coupled to the first surface or integrally formed with the antenna structure body to protrude from the first surface without overlapping with the conductive pattern when viewed from above the first surface, and a wireless communication circuit electrically connected to the conductive pattern and configured to transmit or receive a signal. At least part of the first plate, the second plate, or the side member includes a non-conductive portion. The antenna structure body includes at least one conductive pattern disposed between the first surface and the second surface or on the first surface.
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公开(公告)号：US20200163204A1
公开(公告)日：2020-05-21
申请号：US16686687
申请日：2019-11-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon KIM , Seongjin PARK , Sehyun PARK , Myunghun JEONG , Jehun JONG , Jaehoon JO , Yoonjung KIM , Gyubok PARK
Abstract: An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.
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Patent Agency Ranking
公开(公告)号：US20200021015A1
公开(公告)日：2020-01-16
申请号：US16510209
申请日：2019-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin YUN , Sehyun PARK , Myunghun JEONG , Jehun JONG , Jaehoon JO , Jinwoo JUNG , Jaebong CHUN
Abstract: An electronic device capable of radiating signals toward a plurality of planes is provided, and includes a housing including a first plate and a second plate facing away from the first plate, and an antenna structure positioned in the housing. The antenna structure includes a first printed circuit board (PCB) that includes a first surface facing a first direction, a second PCB that includes a second surface facing a second direction different from the first direction, a flexible PCB (FPCB) that is extended between a first periphery of the first PCB and a second periphery of the second PCB, a first conductive pattern that is formed in the first PCB or on the first surface, a second conductive pattern that is formed in the second PCB or on the second surface, and a wireless communication circuit that is mounted on the first PCB and/or the second PCB.
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公开(公告)号：US20230122983A1
公开(公告)日：2023-04-20
申请号：US18082136
申请日：2022-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon KIM , Seongjin PARK , Sehyun PARK , Myunghun JEONG , Jehun JONG , Jaehoon JO , Yoonjung KIM , Gyubok PARK
Abstract: An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.
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公开(公告)号：US20210320419A1
公开(公告)日：2021-10-14
申请号：US17269798
申请日：2019-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Myunghun JEONG , Sehyun PARK , Sumin YUN , Jehun JONG , Jaehoon JO , Jinwoo JUNG , Jaebong CHUN
Abstract: According to various embodiments, an electronic device may include a housing, an antenna structure disposed inside the housing and including a first face, a second face facing away from the first face, a first conductive helical pattern which extends between the first face and the second face and is constructed inside the antenna structure, and a second conductive helical pattern which extends between the first face and the second face, overlaps with at least in part with the first conductive helical pattern when viewed from above the first face, and is constructed inside the antenna structure, and at least one wireless communication circuit electrically coupled to a first point of the first conductive helical pattern and a second point of the second conductive helical pattern. The first point may be disposed to be spaced apart from the second point when viewed from above the first face. The at least one wireless communication circuit may be configured to provide the first point with a first signal having a frequency between 3 GHz and 100 GHz, and provide the second point with a second signal having a first phase difference with the first signal and having the frequency. Various other embodiments may also be possible.
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公开(公告)号：US20210320414A1
公开(公告)日：2021-10-14
申请号：US17265672
申请日：2019-08-27
Inventor： Yeonwoo KIM , Wonbin HONG , Wonpyo KWON , Sehyun PARK , Sumin YUN
Abstract: According to an embodiment disclosed in this specification, an electronic device may include housing and an antenna module disposed on one surface of the housing. The antenna module may include a printed circuit board, a first antenna array disposed one surface of the printed circuit board, a second antenna array disposed on another surface of the printed circuit board and at least partially overlapping with the first antenna array when viewed from one surface of the housing, and a radio frequency integrated circuit (RFIC) electrically connected to the first antenna array and the second antenna array and configured to feed the first antenna array and the second antenna array.
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公开(公告)号：US20210075091A1
公开(公告)日：2021-03-11
申请号：US17099615
申请日：2020-11-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Hyuck LEE , Sehyun PARK , Jae-Bong CHUN
Abstract: According to various embodiments, an electronic device includes a housing including a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.
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