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公开(公告)号：US11063370B2
公开(公告)日：2021-07-13
申请号：US17063918
申请日：2020-10-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US11050165B2
公开(公告)日：2021-06-29
申请号：US17062990
申请日：2020-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US12160047B2
公开(公告)日：2024-12-03
申请号：US18152311
申请日：2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon Park , Jungho Park , Kwanghyun Baek , Youngju Lee , Jungyub Lee , Juneseok Lee , Dohyuk Ha , Jinsu Heo
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号：US11355835B2
公开(公告)日：2022-06-07
申请号：US16961756
申请日：2019-01-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jungmin Park , Jungyub Lee , Seungtae Ko , Yoongeon Kim , Youngju Lee
Abstract: An example embodiment provides an antenna module including at least one antenna array including a first dielectric having a plate shape; a second dielectric disposed on a top of the first dielectric, wherein a top of the second dielectric is separated from the top of the first dielectric by a first distance; a first radiator disposed on the top surface of the second dielectric; and a feeder disposed on the first dielectric and on the second dielectric to supply an RF signal to the first radiator; and a feeder disposed on the first dielectric and the second dielectric and configured to supply a radio frequency (RF) signal to the first radiator.
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公开(公告)号：US11285705B2
公开(公告)日：2022-03-29
申请号：US16342756
申请日：2017-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junsig Kum , Hyunjin Kim , Yoongeon Kim , Taesik Yang , Youngju Lee , Jungyub Lee , Dohyuk Ha
Abstract: A window product according to various embodiments of the present invention comprises: a window; and a film made of at least one insulation material and bonded to one side of the window, wherein the permittivity of the insulation material constituting the film is lower than the permittivity of the window and is higher than the permittivity of air, and the film may be a film for reducing loss of radio wave transmissivity of the window when attached to the window. Other various embodiments are also possible.
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Patent Agency Ranking
公开(公告)号：US11075451B2
公开(公告)日：2021-07-27
申请号：US16462054
申请日：2017-11-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyuk Ha , Junsig Kum , Jungyub Lee , Youngju Lee
Abstract: An antenna device can include: an antenna substrate, on which an array antenna including at least one radiation element is arranged; and a cover spaced apart from the antenna substrate at at least a predetermined distance and further including at least one relay radiation element arranged to correspond to the at least one radiation element.
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公开(公告)号：US11063371B2
公开(公告)日：2021-07-13
申请号：US17063929
申请日：2020-10-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US10797405B1
公开(公告)日：2020-10-06
申请号：US16906476
申请日：2020-06-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun Baek , Seungtae Ko , Kijoon Kim , Juho Son , Sangho Lee , Youngju Lee , Jungyub Lee , Yonghun Cheon , Dohyuk Ha
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US12300898B2
公开(公告)日：2025-05-13
申请号：US18192910
申请日：2023-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon Park , Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Jungho Park , Youngju Lee , Jungyub Lee , Jinsu Heo
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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公开(公告)号：US12218407B2
公开(公告)日：2025-02-04
申请号：US17946688
申请日：2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok Lee , Youngsub Kim , Sanghoon Park , Jungho Park , Kwanghyun Baek , Youngju Lee , Jungyub Lee , Dohyuk Ha , Jinsu Heo
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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