公开(公告)号：US10354684B1

公开(公告)日：2019-07-16

申请号：US15973673

申请日：2018-05-08

Applicant: Seagate Technology LLC

Inventor： Declan Macken ,  Daniel W. Olson

IPC: G11B5/127 ,  G11B5/60 ,  G11B5/09

Abstract: A data storage device can employ one or more transducing heads that have a data reader and data writer each connected to a substrate of the transducing head. The substrate can be electrified with a predetermined surface charge by a charge circuit of the transducing head to maintain, or alter, a head-media spacing.

公开(公告)号：US09721603B2

公开(公告)日：2017-08-01

申请号：US15237878

申请日：2016-08-16

Applicant: Seagate Technology LLC

Inventor： Daniel W. Olson ,  Declan Macken ,  Andrea L. Geer

IPC: G11B5/60

CPC classification number: G11B5/6011 ,  G11B5/6035 ,  G11B5/607 ,  G11B5/6076

Abstract: An apparatus comprises circuitry configured to apply an AC signal having a frequency to one of a slider of a recording head and a magnetic recording medium. The applied AC signal causes an oscillation in an electrostatic force and clearance between the slider and the medium at the frequency of the AC signal. A thermal sensor is configured to generate a sensor signal at the AC signal frequency in response to sensing changes in temperature resulting from the oscillating clearance. A detector is coupled to the circuitry and the thermal sensor. The detector is configured to detect one or both of head-medium spacing changes and head-medium contact using a phase of a first harmonic or an amplitude of a second harmonic of the thermal sensor signal.

公开(公告)号：US20170178669A1

公开(公告)日：2017-06-22

申请号：US14973333

申请日：2015-12-17

Applicant: Seagate Technology LLC

Inventor： Daniel W. Olson ,  John M. Wolf ,  Declan Macken ,  Gavin L. Brinkley

IPC: G11B5/09

CPC classification number: G11B5/455 ,  G11B5/40 ,  G11B5/6094

Abstract: Electrostatic discharge protection can be afforded to a data recording head in accordance with various embodiments. A data recording head may consist of a circuit having a preamp ground connected to a ground substrate via a ground trace. The ground trace can consist of a first leg connected to the ground substrate and a second leg with an open connection extending from a dice line.