公开(公告)号：US20150214168A1

公开(公告)日：2015-07-30

申请号：US14463049

申请日：2014-08-19

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cheng-An Chang ,  Sung-Huan Sun ,  Wen-Kai Liao ,  Chien-Hung Wu ,  Yi-Cheih Chen

IPC: H01L23/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/032 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/562 ,  H01L23/564 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/02165 ,  H01L2224/02235 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/10145 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/384 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09909 ,  H05K2203/041 ,  H01L2224/11 ,  H01L2924/014

Abstract: A substrate structure is provided, which includes: a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and having a plurality of openings for correspondingly exposing the conductive pads; and a plurality of ring bodies formed in the openings and corresponding in position to edges of the conductive pads. As such, a plurality of conductive elements can be subsequently formed inside the ring bodies so as to be prevented by the ring bodies from expanding outward during a reflow process, thereby protecting the insulating layer from being compressed by the conductive elements and preventing cracking of the insulating layer.

Abstract translation: 提供了一种衬底结构，其包括：具有多个导电焊盘的衬底本体; 绝缘层，其形成在所述基板主体上并且具有用于相应地暴露所述导电焊盘的多个开口; 以及形成在所述开口中并且对应于所述导电垫的边缘的位置的多个环体。 因此，可以随后在环体内部形成多个导电元件，以便在回流过程中由环体向外扩张，从而保护绝缘层免受导电元件的压缩，并防止 绝缘层。