公开(公告)号：US20220392873A1

公开(公告)日：2022-12-08

申请号：US17387731

申请日：2021-07-28

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Min Lin ,  Hung-Jen Hsu ,  Dun-Nian Yaung

IPC: H01L25/065 ,  H01L23/538 ,  G02B6/43 ,  G02B6/42 ,  H01L23/522 ,  H01L21/48

Abstract: Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.

公开(公告)号：US11069731B2

公开(公告)日：2021-07-20

申请号：US16721288

申请日：2019-12-19

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Min Lin ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Chun-Ming Su ,  Tzu-Hsuan Hsu

IPC: H01L27/146 ,  H04N9/04

Abstract: According to one example, a device includes a semiconductor substrate. The device further includes a plurality of color filters disposed above the semiconductor substrate. The device further includes a plurality of micro-lenses disposed above the set of color filters. The device further includes a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses. The structure and the color filters are level at respective top surfaces and bottom surfaces thereof.

公开(公告)号：US10522586B2

公开(公告)日：2019-12-31

申请号：US15964526

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Min Lin ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Chun-Ming Su ,  Tzu-Hsuan Hsu

IPC: H01L21/00 ,  H01L27/146 ,  H04N9/04

Abstract: According to one example, a device includes a semiconductor substrate. The device further includes a plurality of color filters disposed above the semiconductor substrate. The device further includes a plurality of micro-lenses disposed above the set of color filters, each micro-lens of the plurality of micro-lenses being configured to direct light radiation. The device further includes a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses. The structure and the color filters are level at respective top surfaces and bottom surfaces thereof.

公开(公告)号：US20180247971A1

公开(公告)日：2018-08-30

申请号：US15964526

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Min Lin ,  Ching-Chun Wang ,  Dun-Nian Yaung ,  Chun-Ming Su ,  Tzu-Hsuan Hsu

IPC: H01L27/146 ,  H04N9/04

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H04N9/045

Abstract: According to one example, a device includes a semiconductor substrate. The device further includes a plurality of color filters disposed above the semiconductor substrate. The device further includes a plurality of micro-lenses disposed above the set of color filters, each micro-lens of the plurality of micro-lenses being configured to direct light radiation. The device further includes a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses. The structure and the color filters are level at respective top surfaces and bottom surfaces thereof.

公开(公告)号：US09473753B2

公开(公告)日：2016-10-18

申请号：US13692104

申请日：2012-12-03

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chin-Min Lin ,  Dun-Nian Yaung ,  Ching-Chun Wang ,  Tzu-Hsuan Hsu ,  Chun-Ming Su

IPC: H01L31/0232 ,  H04N9/04 ,  H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H04N9/045

Abstract: An image sensor device includes a semiconductor substrate having a front surface and a back surface; an array of pixels formed on the front surface of the semiconductor substrate, each pixel being adapted for sensing light radiation; an array of color filters formed over the plurality of pixels, each color filter being adapted for allowing a wavelength of light radiation to reach at least one of the plurality of pixels; and an array of micro-lens formed over the array of color filters, each micro-lens being adapted for directing light radiation to at least one of the color filters in the array. The array of color filters includes structure adapted for blocking light radiation that is traveling towards a region between adjacent micro-lens.

Abstract translation: 图像传感器装置包括具有前表面和后表面的半导体衬底; 形成在所述半导体衬底的前表面上的像素阵列，每个像素适于感测光辐射; 形成在所述多个像素上的滤色器阵列，每个滤色器适于允许光辐射的波长到达所述多个像素中的至少一个像素; 以及形成在滤色器阵列上的微透镜阵列，每个微透镜适于将光辐射引导到阵列中的至少一个滤色器。 滤色器阵列包括适于阻挡朝向相邻微透镜之间的区域传播的光辐射的结构。