公开(公告)号：US20220209779A1

公开(公告)日：2022-06-30

申请号：US17246300

申请日：2021-04-30

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Nikita Mahjabeen ,  Hassan Omar Ali ,  Meysam Moallem

IPC: H03L7/26 ,  H01P3/00 ,  H05K1/02 ,  G06F1/12 ,  H01Q1/22

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

公开(公告)号：US11210255B2

公开(公告)日：2021-12-28

申请号：US16709073

申请日：2019-12-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Mark Edward Wentroble ,  Suzanne Mary Vining ,  Hassan Omar Ali

IPC: G06F13/40 ,  G06F13/42

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

公开(公告)号：US20210302308A1

公开(公告)日：2021-09-30

申请号：US17120339

申请日：2020-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo Segovia Fernandez ,  Bichoy Bahr ,  Hassan Omar Ali ,  Benjamin Stassen Cook

IPC: G01N21/3504 ,  G01N21/61 ,  G01N21/27 ,  G01J5/08 ,  B81B3/00

Abstract: A differential nondispersive infrared (NDIR) sensor incorporates an infrared (IR) chopper and multiple multi-bit digital registers to store and compare parameter ratio values, as may be digitally calibrated to corresponding temperature values, from chopper clock cycle portions in which a plasmonic MEMS detector is irradiated by the IR chopper with such values from chopper clock cycle portions in which the IR detector is not irradiated by the IR chopper. The plasmonic MEMS detector is referenced to a reference MEMS device via a parameter-ratio engine. The reference device can include a broadband IR reflector or can have a lower-absorption metasurface pattern giving it a lower quality factor than the plasmonic detector. The resultant enhancements to accuracy and precision of the NDIR sensor enable it to be used as a sub-parts-per-million gas concentration sensor or gas detector having laboratory, commercial, in-home, and battlefield applications.

公开(公告)号：US10545904B1

公开(公告)日：2020-01-28

申请号：US16033873

申请日：2018-07-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Mark Edward Wentroble ,  Suzanne Mary Vining ,  Hassan Omar Ali

IPC: G06F13/40 ,  G06F13/42

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

公开(公告)号：US20190334220A1

公开(公告)日：2019-10-31

申请号：US16393809

申请日：2019-04-24

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Cook ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01Q13/00 ,  H01Q1/22 ,  H01P3/08 ,  H01P5/08 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498

Abstract: A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.

公开(公告)号：US12081225B2

公开(公告)日：2024-09-03

申请号：US18334312

申请日：2023-06-13

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Nikita Mahjabeen ,  Hassan Omar Ali ,  Meysam Moallem

IPC: H03L7/26 ,  G01N29/44 ,  G04F5/14 ,  G06F1/12 ,  H01P3/00 ,  H01P3/12 ,  H01P5/107 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q13/18 ,  H03L7/06 ,  H04B1/40 ,  H05K1/02

CPC classification number: H03L7/26 ,  G01N29/44 ,  G04F5/145 ,  G06F1/12 ,  H01P3/003 ,  H01P3/006 ,  H01P3/121 ,  H01P5/107 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q13/18 ,  H03L7/06 ,  H04B1/40 ,  H05K1/0243

Abstract: In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

公开(公告)号：US11762801B2

公开(公告)日：2023-09-19

申请号：US17530669

申请日：2021-11-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Mark Edward Wentroble ,  Suzanne Mary Vining ,  Hassan Omar Ali

IPC: G06F13/40 ,  G06F13/42

CPC classification number: G06F13/409 ,  G06F13/4282 ,  G06F2213/0042

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

公开(公告)号：US11677406B2

公开(公告)日：2023-06-13

申请号：US17246300

申请日：2021-04-30

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Nikita Mahjabeen ,  Hassan Omar Ali ,  Meysam Moallem

IPC: H03L7/26 ,  H01P3/00 ,  H01Q1/22 ,  G06F1/12 ,  H05K1/02 ,  H01Q1/38 ,  G04F5/14 ,  H04B1/40 ,  H01Q13/18 ,  H01P5/107 ,  G01N29/44 ,  H01P3/12

CPC classification number: H03L7/26 ,  G01N29/44 ,  G04F5/145 ,  G06F1/12 ,  H01P3/003 ,  H01P3/006 ,  H01P3/121 ,  H01P5/107 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q13/18 ,  H04B1/40 ,  H05K1/0243

Abstract: In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

公开(公告)号：US11387271B2

公开(公告)日：2022-07-12

申请号：US16716652

申请日：2019-12-17

Applicant: Texas Instruments Incorporated

Inventor： Scott Robert Summerfelt ,  Hassan Omar Ali ,  Benjamin Stassen Cook

IPC: H01L27/146

Abstract: In described examples an integrated circuit (IC) has multiple layers of dielectric material overlying at least a portion of a surface of a substrate. A trench is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor, the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.

公开(公告)号：US11011815B2

公开(公告)日：2021-05-18

申请号：US16393809

申请日：2019-04-24

Applicant: Texas Instruments Incorporated

Inventor： Hassan Omar Ali ,  Juan Alejandro Herbsommer ,  Benjamin Cook ,  Swaminathan Sankaran

IPC: H01P3/16 ,  H01Q1/22 ,  H01P3/08 ,  H01P5/08 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01Q13/00

Abstract: A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.