公开(公告)号：US20110154658A1

公开(公告)日：2011-06-30

申请号：US12979334

申请日：2010-12-28

Applicant: Chih-Hong Chuang ,  Tzu-Wei Huang

Inventor： Chih-Hong Chuang ,  Tzu-Wei Huang

IPC: H05K3/00

CPC classification number: H05K3/427 ,  H05K3/0097 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

Abstract translation: 电路基板的制造方法包括以下步骤。 两个金属层的周边结合形成密封区域。 至少形成通过密封区域的通孔。 在两个金属层上形成两个绝缘层。 在两个绝缘层上形成两个导电层。 将两个绝缘层和两个导电层层压到彼此接合的两个金属层上，其中金属层嵌入在两个绝缘层之间，并且两个绝缘层填充到通孔中。 两个金属层的密封区域被分离以形成两个分开的电路基板。 因此，可以在以下步骤中操作较薄的衬底，例如图案化工艺或电镀工艺。 此外，该方法可以扩展为制造具有奇数层或偶数层的电路基板。

公开(公告)号：US20140113788A1

公开(公告)日：2014-04-24

申请号：US13707615

申请日：2012-12-07

Applicant: Tzu-Wei Huang

Inventor： Tzu-Wei Huang

IPC: B31B17/00

CPC classification number: H05K3/007 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/244 ,  H05K2201/10719 ,  H05K2201/10984 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0228 ,  H05K2203/304 ,  H01L2924/00

Abstract: A packaging process is provided. A package mother board having an upper surface, a lower surface, a device disposing area and a peripheral area surrounding the device disposing area is provided. Multiple semiconductor devices are disposed on the upper surface. The semiconductor devices are located in the device disposing area. A carrier having a center area and an edge area surrounding the center area is provided. An adhesive layer is formed between the peripheral area and the edge area. The center area of the carrier is disposed corresponding to the device disposing area of the package mother board. The edge area of the carrier is disposed corresponding to the peripheral area of the package mother board. The adhesive layer is in a state of semi-curing, and the package mother board is bonded to the carrier via the adhesive layer. A baking process is performed to completely cure the adhesive layer.

Abstract translation: 提供包装过程。 提供具有上表面，下表面，设备设置区域和围绕设备设置区域的周边区域的封装母板。 多个半导体器件设置在上表面上。 半导体器件位于器件配置区域中。 提供具有中心区域和围绕中心区域的边缘区域的载体。 在周边区域和边缘区域之间形成粘合剂层。 载体的中心区域对应于包装母板的装置设置区域设置。 载体的边缘区域对应于包装母板的周边区域设置。 粘合剂层处于半固化状态，并且包装母板通过粘合剂层结合到载体上。 进行烘烤处理以完全固化粘合剂层。

公开(公告)号：US20140096382A1

公开(公告)日：2014-04-10

申请号：US13794815

申请日：2013-03-12

Applicant: Tzu-Wei Huang

Inventor： Tzu-Wei Huang

IPC: H05K3/42

CPC classification number: H05K3/42 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided. A surface treatment is performed on the first and second copper foil layers so as to form a first and second roughened surfaces. A laser beam is irradiated on the first roughened surface so as to form at least one first blind hole extending from the first copper foil layer to the second surface. An etching process is performed on the second copper foil layer so as to form at least one second blind hole extending from the second copper foil layer to the second surface. A conductive layer fills up a through hole defined by the first and second blind holes and covers the first and second copper foil layers.

Abstract translation: 提供了一种基板结构的制造方法。 提供具有芯层的基材和位于芯层的第一和第二表面的第一和第二铜箔层。 对第一和​​第二铜箔层进行表面处理，以形成第一和第二粗糙表面。 激光束照射在第一粗糙表面上，以便形成从第一铜箔层延伸到第二表面的至少一个第一盲孔。 对第二铜箔层进行蚀刻处理，以形成从第二铜箔层延伸到第二表面的至少一个第二盲孔。 导电层填充由第一和第二盲孔限定的通孔并覆盖第一和第二铜箔层。

公开(公告)号：US08510936B2

公开(公告)日：2013-08-20

申请号：US12725641

申请日：2010-03-17

Applicant: Chih-Hong Chuang ,  Tzu-Wei Huang

Inventor： Chih-Hong Chuang ,  Tzu-Wei Huang

IPC: H05K3/30

CPC classification number: H05K3/0097 ,  H05K3/427 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49176

Abstract: A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.

Abstract translation: 提供一种封装载体的制造方法。 提供第一铜箔层，第一箔层上的第二铜箔层，第三箔层上的第三铜箔层和第四箔层。 第二铜箔层通过粘合剂凝胶部分地接合第四铜箔层，以形成周边区域被胶合并且有效区域不胶合的基板。 因此，较薄的基板可以在以下步骤中使用，例如图案化工艺或电镀工艺。 此外，衬底可以扩展为具有奇数层或偶数层的封装载体结构。

公开(公告)号：US20130131535A1

公开(公告)日：2013-05-23

申请号：US13301459

申请日：2011-11-21

Applicant: Kuang-Tien Sun ,  Tzu-Wei Huang ,  Min-Chi Chen ,  Hsu Sun ,  Chia-Lin Sun

Inventor： Kuang-Tien Sun ,  Tzu-Wei Huang ,  Min-Chi Chen ,  Hsu Sun ,  Chia-Lin Sun

IPC: A61B5/0476

CPC classification number: A61B5/04842 ,  G06F3/015

Abstract: A brainwave control system and method operable through time differential event-related potential includes a brainwave capturing unit attached to a user's head, a brainwave signal processing apparatus and a display unit to display at least two sets of stimuli. The brainwave signal processing apparatus includes a signal processor connected to the brainwave capturing unit and a central processor. The signal processor converts brainwave signals generated by the user after having received a set of short time interval stimuli to digital signals. The central processor performs analysis and generates identification results and executes control commands accordingly. Thus user can rapidly and accurately execute his requirements of operation control so as to achieve non-contact operation control with improved usability and practicality.

Abstract translation: 通过时间差分事件相关电位可操作的脑波控制系统和方法包括附着在用户头部的脑波捕获单元，脑波信号处理装置和显示器，以显示至少两组刺激。 脑波信号处理装置包括连接到脑波捕获单元和中央处理器的信号处理器。 信号处理器在将数据信号接收到一组短时间间隔刺激之后，转换由用户产生的脑波信号。 中央处理器执行分析并产生识别结果并相应地执行控制命令。 因此用户可以快速，准确地执行其操作控制要求，从而实现非接触式操作控制，提高了可用性和实用性。

公开(公告)号：US08251601B2

公开(公告)日：2012-08-28

申请号：US12974720

申请日：2010-12-21

Applicant: Tzu-Wei Huang ,  Wei-Ping Chen ,  Jui-Hung Chang ,  Chia-Hui Huang ,  Teng-Sheng Chen

Inventor： Tzu-Wei Huang ,  Wei-Ping Chen ,  Jui-Hung Chang ,  Chia-Hui Huang ,  Teng-Sheng Chen

IPC: G03B17/00

CPC classification number: H01L27/14618 ,  G03B17/02 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00

Abstract: The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.

Abstract translation: 本发明提供一种相机模块及其制造方法。 相机模块包括在其底表面上具有多个焊球的图像传感器装置芯片。 光学透镜设置在图像传感器装置芯片上。 金属板具有在图像传感器装置的底面上延伸的部分。 金属涂层围绕光学透镜的垂直表面和金属板的一部分的顶表面。 第一遮光层覆盖金属涂层的垂直表面。