ASSEMBLY AND METHOD FOR TRANSFER MOLDING
    11.
    发明申请
    ASSEMBLY AND METHOD FOR TRANSFER MOLDING 审中-公开
    组装和转移成型方法

    公开(公告)号:US20160229730A1

    公开(公告)日:2016-08-11

    申请号:US15029322

    申请日:2014-10-14

    Inventor: David C. Jarmon

    Abstract: One exemplary embodiment of this disclosure relates to a transfer molding assembly. The assembly includes a die having a molding cavity interconnected with a reservoir. The assembly further includes a heater operable to heat the die, and a load plate configured to move under its own weight to transfer material from the reservoir into the molding cavity.

    Abstract translation: 本公开的一个示例性实施例涉及传递模制组件。 组件包括具有与储存器互连的模腔的模具。 组件还包括可操作以加热模具的加热器和构造成在其自重下移动以将材料从储存器转移到模制腔中的负载板。

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