公开(公告)号：US11058012B2

公开(公告)日：2021-07-06

申请号：US16544936

申请日：2019-08-20

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen Lin

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K3/46

Abstract: A circuit board structure includes a circuit layer structure, an electronic component, and a stopper. The circuit layer structure includes a plurality of dielectric layers and circuits in the dielectric layers. The electronic component is disposed in the circuit layer structure; the electronic component includes a chip and a conductive bump; the chip has a first surface and a second surface that are oppositely disposed, and the first surface of the chip contacts one of the dielectric layers; the conductive bump is on the second surface of the chip and is electrically connected to the chip. The stopper is within the circuit layer structure and abuts against the conductive bump. A method for fabricating a circuit board structure is also provided herein.