公开(公告)号：US10850462B2

公开(公告)日：2020-12-01

申请号：US16150804

申请日：2018-10-03

Applicant: VisEra Technologies Company Limited

Inventor： Sheng-Chuan Cheng ,  Hao-Min Chen ,  Chi-Han Lin ,  Han-Lin Wu

IPC: G02B3/00 ,  G02B9/00 ,  B29D11/00 ,  G02B27/09 ,  H01L51/00 ,  H01L21/027

Abstract: A method for fabricating an optical element is provided. A substrate is provided. A plurality of metal grids are formed on the substrate. An organic layer is formed on the substrate and the metal grids. The organic layer is etched to form a first patterned organic layer including a plurality of first protrusion portions and a plurality of first trenches surrounded by the first protrusion portions. The first patterned organic layer is etched to form a second patterned organic layer including a plurality of second protrusion portions and a plurality of second trenches surrounded by the second protrusion portions. Each second protrusion portion covers one metal grid. There is a distance between the center axis of one second protrusion portion of the second patterned organic layer and the center axis of one metal grid covered by the one second protrusion portion of the second patterned organic layer.

公开(公告)号：US10462431B2

公开(公告)日：2019-10-29

申请号：US14683792

申请日：2015-04-10

Applicant: VisEra Technologies Company Limited

Inventor： Tzu-Wei Huang ,  Chi-Han Lin

IPC: H01L27/146 ,  H04N9/04

Abstract: An image sensor is provided. The image sensor includes a semiconductor substrate containing a plurality of photoelectric conversion elements. A color filter array is disposed above the semiconductor substrate. The color filter array includes a first color filter, a second color filter and a third color filter. The image sensor further includes an isolated partition disposed in the color filter array to surround one of the first, second and third color filters. The isolated partition has a refractive index that is lower than the refractive indexes of the first, second and third color filters.

公开(公告)号：US10170511B1

公开(公告)日：2019-01-01

申请号：US15616390

申请日：2017-06-07

Applicant: VisEra Technologies Company Limited

Inventor： Tzu-Wei Huang ,  Chi-Han Lin

IPC: H04N5/335 ,  H01L27/146

Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.

公开(公告)号：US09679933B2

公开(公告)日：2017-06-13

申请号：US14507315

申请日：2014-10-06

Applicant: VisEra Technologies Company Limited

Inventor： Tzu-Wei Huang ,  Wei-Ko Wang ,  Chi-Han Lin

IPC: H01L27/00 ,  H01L27/146 ,  G02B5/22

CPC classification number: H01L27/14621 ,  G02B5/201 ,  G02B5/22 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14649 ,  H01L27/14652 ,  H01L27/14685

Abstract: An image sensor is provided. The image sensor includes a red (R) pixel, a green (G) pixel, a blue (B) pixel and an infrared (IR) pixel, and R, G and B filters respectively disposed at the R, G and B pixels. The image sensor also includes an IR pass filter disposed at the IR pixel and an IR filter stacked with the R, G and B filters, wherein the IR filter cuts off at least IR light with a specific wavelength. Furthermore, a method of forming an image sensor is also provided.