公开(公告)号：US20230261388A1

公开(公告)日：2023-08-17

申请号：US18155338

申请日：2023-01-17

Applicant: Wistron NeWeb Corp.

Inventor： Chun-Lin HUANG

IPC: H01Q19/10

CPC classification number: H01Q19/108 ,  H01Q19/106

Abstract: An antenna system includes a first antenna element, a second antenna element, a dielectric substrate, a first reflective plate, and a second reflective plate. The first antenna element and the second antenna element are disposed on the dielectric substrate. The first reflective plate is adjacent to the dielectric substrate. The second reflective plate is coupled to the first reflective plate. A first angle is formed between the first reflective plate and the second reflective plate. The antenna system provides a relative large HPBW (Half-Power Beamwidth).

公开(公告)号：US20210036723A1

公开(公告)日：2021-02-04

申请号：US16700029

申请日：2019-12-02

Applicant: Wistron NeWeb Corp.

Inventor： Chun-Lin HUANG

IPC: H04B1/00 ,  H04B1/18

Abstract: A communication system with a first input port and a second input port includes a first antenna, a second antenna, a first diplexer, a second diplexer, a third diplexer, a fourth diplexer, a first coupler, and a second coupler. The first diplexer has a common terminal coupled to the first input port. The second diplexer has a common terminal coupled to the second input port. The third diplexer has a common terminal coupled to the first antenna. The fourth diplexer has a common terminal coupled to the second antenna. Each of the first diplexer, the second diplexer, the third diplexer, and the fourth diplexer has a first terminal and a second terminal which are coupled between the first coupler and the second coupler.

公开(公告)号：US20210021054A1

公开(公告)日：2021-01-21

申请号：US16700041

申请日：2019-12-02

Applicant: Wistron NeWeb Corp.

Inventor： Chun-Lin HUANG

IPC: H01Q21/26 ,  H01Q9/16

Abstract: An antenna system includes a dielectric substrate, a first dipole antenna element, a second dipole antenna element, a first additional metal element, a second additional metal element, first conductive via elements, and second conductive via elements. The first dipole antenna element and the first additional metal element are disposed on a first surface of the dielectric substrate. The first dipole antenna element includes a first radiation element and a second radiation element. The second dipole antenna element and the second additional metal element are disposed on a second surface of the dielectric substrate. The second dipole antenna element includes a third radiation element and a fourth radiation element. The first additional metal element is coupled through the first conductive via elements to the third radiation element. The second additional metal element is coupled through the second conductive via elements to the first radiation element.