Abstract:
Disclosed is a method for manufacturing a solar cell, which includes the steps of: applying a first diffusing agent containing n-type impurities and a second diffusing agent containing p-type impurities onto a semiconductor substrate; forming a protective layer covering at least one of the first diffusing agent and the second diffusing agent; and diffusing at least one of the n-type impurities and the p-type impurities in a surface of the semiconductor substrate by heat treatment of the semiconductor substrate having the protective layer formed thereon.
Abstract:
A method of manufacturing a back junction solar cell comprises the steps of forming a first diffusion mask (9) on the back of a silicon substrate (1), printing a first etching paste (3a, 4a) on a part of the surface of the first diffusion mask (9), removing the portion of the first diffusion mask (9) where the first etching paste (3a, 4a) is printed by performing a first heating of the silicon substrate (1) to expose a part of the back of the silicon substrate (1), forming a first-conductivity-type impurity diffusion layer (6) on the exposed portion of the silicon substrate (1) by diffusing a first-conductivity-type impurity, removing the first diffusion mask (9), forming a second diffusion mask (9) on the back of the silicon substrate (1), printing a second etching paste (3b, 4b) on a part of the surface of the second diffusion mask (9), removing the portion of the second diffusion mask (9) where the second etching paste (3b, 4b) is printed by performing a second heating of the silicon substrate (1) to expose a part of the back of the silicon substrate (1), forming a second-conductivity-type impurity diffusion layer (5) on the exposed portion of the silicon substrate (1) by diffusing a second-conductivity-type impurity, and removing the second diffusion mask (9).
Abstract:
A solar cell includes a substrate, and a plurality of strip-shaped p type impurity diffusion regions and a plurality of strip-shaped n type impurity diffusion regions in one surface of the substrate adjacently. The p type impurity diffusion region has an area ratio of not less than 60%, an area ratio larger than 80%, in particular, to the surface of the substrate.
Abstract:
A semiconductor device and a method for manufacturing the semiconductor device are provided. A semiconductor substrate has a surface on which an abrasion trace is formed, and a dopant diffusion region includes a portion extending in the direction at an angle within the range of −5° to +5° with respect to the direction in which the abrasion trace extends
Abstract:
A solar battery module includes a wiring substrate having connection wiring on a front surface, a plurality of solar battery cells, a sealant sealing the plurality of solar battery cells mounted on the front surface of the wiring substrate, and a light-transmitting front surface protection material covering the plurality of solar battery cells sealed with the sealant. The plurality of solar battery cells each include a cell substrate and back surface electrodes disposed on a back surface of the cell substrate. The cell substrates are arranged on the front surface of the wiring substrate. The plurality of solar battery cells are mounted on the wiring substrate by electrically connecting the back surface electrodes with the connection wiring. A filler is disposed in at least a portion of a gap between the plurality of solar battery cells.
Abstract:
With screen printing, an N electrode electrically connected to an N+ layer is formed on a passivation film, and a P electrode contact electrically connected to a P+ layer is formed. Then, with screen printing, an insulating layer is formed to cover a surface of the N electrode and expose a surface of the P electrode contact. After that, with screen printing, a P electrode electrically connected to the P electrode contact is formed on the insulating layer.
Abstract:
A masking paste used as a mask for controlling diffusion when diffusing a p-type dopant and an n-type dopant into a semiconductor substrate and forming a high-concentration p-doped region and a high concentration n-doped region is provided that contains at least a solvent, a thickening agent, and SiO2 precursor and/or a TiO2 precursor. Further, a manufacturing method of a solar cell is provided in which the masking paste is pattern-formed on the semiconductor substrate and then the p-type dopant and the n-type dopant are diffused.
Abstract:
The present invention provides a method for manufacturing a solar cell, including: diffusing p type impurity into at least a portion of a first surface, which is one surface of a silicon substrate, to form a high concentration p type impurity diffusion layer; and etching one of the first surface of the silicon substrate and a second surface of the silicon substrate opposite to the first surface, using as a mask at least one of the high concentration p type impurity diffusion layer and a film formed on the high concentration p type impurity diffusion layer upon forming the high concentration p type impurity diffusion layer.
Abstract:
A solar cell (10) including a passivation film having a high effect for both a p region and an n region on a surface of a silicon substrate of the solar cell is provided. In the solar cell, a first passivation film made of a silicon nitride film is formed on a surface opposite to a light-receiving surface of the silicon substrate, and the first passivation film has a refractive index of not less than 2.6. Preferably, in the solar cell, a second passivation film including a silicon oxide film and/or an aluminum oxide film is formed between the silicon substrate and the first passivation film. Preferably, the solar cell is a back surface junction solar cell having a pn junction formed on the surface opposite to the light-receiving surface of the silicon substrate.
Abstract:
A masking paste used as a mask for controlling diffusion when diffusing a p-type dopant and an n-type dopant into a semiconductor substrate and forming a high-concentration p-doped region and a high concentration n-doped region is provided that contains at least a solvent, a thickening agent, and SiO2 precursor and/or a TiO2 precursor, Further, a manufacturing method of a solar cell is provided in which the masking paste is pattern-formed on the semiconductor substrate and then the p-type dopant and the n-type dopant are diffused.