公开(公告)号：US20050072596A1

公开(公告)日：2005-04-07

申请号：US10861455

申请日：2004-06-07

Applicant: Yung-Jen Lin

Inventor： Yung-Jen Lin

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K7/06

CPC classification number: H05K3/403 ,  H05K1/116 ,  H05K3/0052 ,  H05K3/42 ,  H05K2201/09463 ,  H05K2201/09663

Abstract: A printed circuit board for avoiding producing burrs, the printed circuit board includes a packaging substrate, at least one plated through hole, at least one first conductive portion, at least one non-conductive portion, at least one second conductive portion and at least one cut section. The plated through hole is formed on the packaging substrate. The first conductive portion and the second conductive portion respectively are adjacent to two sides of a peripheral of the plated through hole and separated by the non-conductive portion. Furthermore, the cut section is arranged on the non-conductive portion, thus the packaging substrate is cut without passing through the first conductive portion, and it will not cause the burrs on the first conductive portion.

Abstract translation: 一种用于避免产生毛刺的印刷电路板，印刷电路板包括封装基板，至少一个电镀通孔，至少一个第一导电部分，至少一个非导电部分，至少一个第二导电部分和至少一个第二导电部分 切割部分。 电镀通孔形成在封装基板上。 第一导电部分和第二导电部分分别与电镀通孔的周边的两侧相邻并且被非导电部分分开。 此外，切断部配置在非导电部分上，因此封装基板被切割而不穿过第一导电部分，并且不会在第一导电部分上引起毛刺。