POLYAMIC ACID COMPOSITION, POLYIMIDE FILM, AND COPPER CLAD LAMINATE

    公开(公告)号:US20210017336A1

    公开(公告)日:2021-01-21

    申请号:US16561401

    申请日:2019-09-05

    Abstract: A polyamic acid composition is polymerized by dianhydride monomers and diamine monomers. A range of molar ratio of the dianhydride monomers to the diamine monomers is from 0.9 to 1.1. The diamine monomers have a combination of specific functional groups containing at least one nitrogen heterocycle structure, at least one liquid crystal structure, and at least one soft structure, wherein the diamine monomer containing nitrogen heterocycle structure has a molar weight percentage of 3% to 8% of a total molar weight of the diamine monomers, and the diamine monomers containing at least one liquid crystal structure and at least one soft structure have a molar weight percentage of 92% to 97% of the total molar weight of the diamine monomers. The disclosure further relates to a polyimide film, a copper clad laminate, and a printed circuit board.

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