公开(公告)号：US6137634A

公开(公告)日：2000-10-24

申请号：US241622

申请日：1999-02-01

Applicant: Zong-Fu Li

Inventor： Zong-Fu Li

IPC: G01J5/08 ,  G02B3/00 ,  H01L27/146 ,  G02B27/10

CPC classification number: H01L27/14627 ,  G01J1/04 ,  G01J1/0411 ,  G02B3/0018 ,  G02B3/0056 ,  G01J1/0209

Abstract: A method of forming a microlens including, in one aspect, depositing a substantially non-photo-imageable microlens material over an area of a chip, a portion of which contains an array of photosensitive circuits, and patterning the microlens material over the array of photosensitive circuits to define a microlens over each photosensitive circuit.

公开(公告)号：US20060141674A1

公开(公告)日：2006-06-29

申请号：US11360147

申请日：2006-02-22

Applicant: Zong-Fu Li ,  Kabul Sengupta ,  Deborah Thompson

Inventor： Zong-Fu Li ,  Kabul Sengupta ,  Deborah Thompson

IPC: H01L21/56

CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

公开(公告)号：US07026707B2

公开(公告)日：2006-04-11

申请号：US10777373

申请日：2004-02-11

Applicant: Zong-Fu Li ,  Kabul Sengupta ,  Deborah L. Thompson

Inventor： Zong-Fu Li ,  Kabul Sengupta ,  Deborah L. Thompson

IPC: H01L23/02

CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

Abstract translation: 集成电路（IC）封装包括模具化合物，模具和窗户。 模具化合物具有嵌入其中的框架。 框架具有顶表面，底表面和顶部到底部开口。 模具附接到模具化合物，其中嵌入的框架位于模具的周边的下方。 窗口附着在模具上并位于模具上方，以使光线到达模具。

公开(公告)号：US06771314B1

公开(公告)日：2004-08-03

申请号：US09052867

申请日：1998-03-31

Applicant: Edward J. Bawolek ,  Zong-Fu Li

Inventor： Edward J. Bawolek ,  Zong-Fu Li

IPC: H04N5335

CPC classification number: H04N9/045

Abstract: A color imaging device comprised of a plurality of light selective elements. The light selective elements include a first light selective element selective to light having a wavelength corresponding to the Orange region of the spectrum, a second light selective element selective to light having a wavelength corresponding to the Green region of the spectrum, and a third light selective element sensitive to light having a wavelength corresponding to the Blue region of the spectrum.

Abstract translation: 一种由多个光选择元件组成的彩色成像装置。 光选择元件包括对具有对应于光谱的橙色区域的波长的光选择性的第一光选择性元件，对具有对应于光谱的绿色区域的波长的光选择性的第二光选择性元件和第三光选择性 对具有对应于光谱的蓝色区域的波长的光敏感的元件。

公开(公告)号：US6020582A

公开(公告)日：2000-02-01

申请号：US52205

申请日：1998-03-31

Applicant: Edward J. Bawolek ,  Kabul Sengupta ,  Zong-Fu Li ,  Curtis Corum

Inventor： Edward J. Bawolek ,  Kabul Sengupta ,  Zong-Fu Li ,  Curtis Corum

IPC: H01L31/0203 ,  H01J5/02

CPC classification number: H01L31/0203

Abstract: An image sensing device including a package having opposing side portions, an imaging sensor having a top side portion, and a light selective element coupled to the opposing side portions and overlying the top side portion of the imaging sensor.

Abstract translation: 一种图像感测装置，包括具有相对侧部的封装，具有顶侧部分的成像传感器和耦合到相对侧部并且覆盖成像传感器的顶侧部分的光选择元件。

公开(公告)号：US07223631B2

公开(公告)日：2007-05-29

申请号：US11360147

申请日：2006-02-22

Applicant: Zong-Fu Li ,  Kabul Sengupta ,  Deborah L. Thompson

Inventor： Zong-Fu Li ,  Kabul Sengupta ,  Deborah L. Thompson

IPC: H01L21/44

CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

Abstract translation: 集成电路（IC）封装包括模具化合物，模具和窗户。 模具化合物具有嵌入其中的框架。 框架具有顶表面，底表面和顶部到底部开口。 模具附接到模具化合物，其中嵌入的框架位于模具的周边的下方。 窗口附着在模具上并位于模具上方，以使光线到达模具。

公开(公告)号：US06692993B2

公开(公告)日：2004-02-17

申请号：US09546225

申请日：2000-04-10

Applicant: Zong-Fu Li ,  Kabul Sengupta ,  Deborah L. Thompson

Inventor： Zong-Fu Li ,  Kabul Sengupta ,  Deborah L. Thompson

IPC: H01L2144

CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.

Abstract translation: 集成电路（IC）封装包括模具化合物，模具和窗户。 模具化合物具有嵌入其中的框架。 该框架的热膨胀系数小于模塑料。 IC封装能够通过大容量回流工艺连接到电路板。

公开(公告)号：US06623666B1

公开(公告)日：2003-09-23

申请号：US09660805

申请日：2000-09-13

Applicant: Edward J. Bawolek ,  Kabul Sengupta ,  Zong-Fu Li

Inventor： Edward J. Bawolek ,  Kabul Sengupta ,  Zong-Fu Li

IPC: B29D1100

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.

公开(公告)号：US06587147B1

公开(公告)日：2003-07-01

申请号：US09644291

申请日：2000-08-22

Applicant: Zong-Fu Li

Inventor： Zong-Fu Li

IPC: H04N314

CPC classification number: H01L27/14627 ,  G01J1/0209 ,  G01J1/04 ,  G01J1/0411 ,  G02B3/0018 ,  G02B3/0056

Abstract: A method of forming a microlens including, in one aspect, depositing a substantially non-photo-imageable microlens material over an area of a chip, a portion of which contains an array of photosensitive circuits, and patterning the microlens material over the array of photosensitive circuits to define a microlens over each photosensitive circuit.

Abstract translation: 一种形成微透镜的方法，其一方面包括在芯片的一个区域上沉积基本上非可光致成像的微透镜材料，其中一部分包含一组感光电路，并且在感光体阵列上图案化微透镜材料 在每个感光电路上限定微透镜的电路。

公开(公告)号：US06525944B1

公开(公告)日：2003-02-25

申请号：US09676105

申请日：2000-09-29

Applicant: Zong-Fu Li

Inventor： Zong-Fu Li

IPC: H05K702

CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02327 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H05K1/02 ,  H05K1/18 ,  H01L2924/00014

Abstract: An apparatus and method for enabling interaction between electronic circuitry and optical signals with a package for enclosing the electronic circuitry having contacts and a window for the passage of optical signals disposed about a face of the package that becomes substantially inaccessible when the package is used.

Abstract translation: 一种用于实现电子电路和光信号之间的交互的装置和方法，所述封装用于封装具有触点的电子电路，以及用于在使用封装时基本上不可访问的围绕封装的表面设置的光信号通过的窗口。