公开(公告)号：US20080308964A1

公开(公告)日：2008-12-18

申请号：US12213053

申请日：2008-06-13

Applicant: Tsuyoshi Amatani ,  Mutsuyuki Kawaguchi ,  Satoshi Saitou ,  Masashi Deguchi

Inventor： Tsuyoshi Amatani ,  Mutsuyuki Kawaguchi ,  Satoshi Saitou ,  Masashi Deguchi

IPC: B28B11/04

CPC classification number: H05K3/389 ,  C23C26/00 ,  H05K2203/0766 ,  H05K2203/0786

Abstract: A method for forming a film of silane coupling agent on a metal surface is provided. The method includes: a step of applying a solution containing a silane coupling agent on the metal surface; a step of drying the metal surface coated with the solution at a temperature in the range of 25 to 150° C. and for a length of time of 5 minutes or less; and a step of water-rinsing the dried metal surface.

Abstract translation: 提供了一种在金属表面上形成硅烷偶联剂的膜的方法。 该方法包括：在金属表面上涂布含有硅烷偶联剂的溶液的工序; 在25〜150℃的温度范围内干燥涂有溶液的金属表面和5分钟以下的时间的步骤; 以及对干燥的金属表面进行水冲洗的步骤。

公开(公告)号：US07285229B2

公开(公告)日：2007-10-23

申请号：US10979267

申请日：2004-11-02

Applicant: Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

Inventor： Masayo Kuriyama ,  Ryo Ogushi ,  Daisaku Akiyama ,  Kaoru Urushibata

IPC: C09K13/00 ,  C09K13/04 ,  C03C25/68 ,  C23F1/00 ,  C25F3/00 ,  B44C1/22

CPC classification number: H05K3/26 ,  C23F1/28 ,  C23F1/30 ,  H05K3/181 ,  H05K2201/0761 ,  H05K2203/0789 ,  H05K2203/124

Abstract: An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C. a surfactant) into contact with a surface of the metal, and then bringing a second solution that includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source into contact with the surface of the metal. According to the etchant and the etching methods of the present invention, it is possible to etch at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium quickly and suppress excessive dissolution of copper.

Abstract translation: 本发明的蚀刻剂包括含有盐酸，硝酸和铜离子源的水溶液。 本发明的蚀刻方法包括使蚀刻剂与选自镍，铬，镍 - 铬合金和钯中的至少一种金属接触。 本发明的另一种蚀刻方法包括使包含至少含有以下组分A至C的水溶液的第一蚀刻剂（A.盐酸; B.至少一种选自以下（a）至（c）的化合物： （a）具有7个以下碳原子的含有硫原子和至少1个选自氨基，亚氨基，羧基，羰基和羟基的基团的化合物;（b）噻唑 ;和（c）噻唑化合物;和C.a表面活性剂）与金属的表面接触，然后使包含含有盐酸，硝酸和铜离子源的水溶液的第二溶液与 金属表面。 根据本发明的蚀刻剂和蚀刻方法，可以快速地蚀刻选自镍，铬，镍 - 铬合金和钯中的至少一种金属并抑制铜的过度溶解。

公开(公告)号：US06874675B2

公开(公告)日：2005-04-05

申请号：US10616194

申请日：2003-07-09

Applicant: Tetsuo Kida ,  Samuel Kenneth Liem

Inventor： Tetsuo Kida ,  Samuel Kenneth Liem

IPC: C23G1/00 ,  H05K3/26 ,  H05K3/34 ,  B23K1/20

CPC classification number: H05K3/26 ,  C23G1/00 ,  H05K3/3489 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/4913

Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.

Abstract translation: 印刷电路板的制造方法包括：用pH5以下的酸性电解水清洗与印刷电路板的铜电路的露出部分相对应的焊盘，以除去氧化物; 用pH不小于9的碱性电解水处理土地以防止氧化; 并将电子元件焊接到土地上。 预先用电解水处理要焊接的部分，从而以低成本改善焊接，而不会对环境产生不利影响。

公开(公告)号：US20050016961A1

公开(公告)日：2005-01-27

申请号：US10896465

申请日：2004-07-22

Applicant: Kenji Toda ,  Yukari Morinaga ,  Takahiro Teshima ,  Ai Kuroda

Inventor： Kenji Toda ,  Yukari Morinaga ,  Takahiro Teshima ,  Ai Kuroda

IPC: C23F1/18 ,  H05K3/06 ,  C23F1/00

CPC classification number: C23F1/18 ,  H05K3/067 ,  H05K2203/124

Abstract: An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.

Abstract translation: 铜和铜合金的蚀刻剂包括含有以铜离子浓度计的14至155g /升铜离子源的水溶液; 7〜180g / l盐酸; 和0.1至50g / l的唑，唑类仅包括驻留在环中的杂原子的氮原子。 通过蚀刻铜或铜合金制造布线的方法包括以下步骤：使用上述蚀刻剂蚀刻未被抗蚀剂覆盖的电绝缘构件上的铜层的一部分，以形成 接线。 由此，可以形成具有减小的底切的精密且致密的布线图案。

公开(公告)号：US20250054293A1

公开(公告)日：2025-02-13

申请号：US18718680

申请日：2022-11-29

Applicant: MEC COMPANY LTD.

Inventor： Masako AKAGI

IPC: G06V10/98 ,  G06T7/00 ,  G06V10/77 ,  G06V10/82

Abstract: The physical property value prediction method include: inputting a plurality of prediction target images for each of which a measured value of the physical property value is known into a machine-learned prediction model, and outputting a predicted value and a feature map of each of the plurality of prediction target images; identifying, on a basis of prediction results from images almost identical in measured physical property value among the plurality of prediction target images, a poor prediction image and a good prediction image; and extracting a feature group representing a factor in poor prediction on a basis of a difference between a frequency distribution of a plurality of features constituting the feature map of the poor prediction image and a frequency distribution of a plurality of features constituting the feature map of the good prediction image.

公开(公告)号：US20240270763A1

公开(公告)日：2024-08-15

申请号：US18411521

申请日：2024-01-12

Applicant: MEC COMPANY LTD.

Inventor： Koki MORIKAWA ,  Yuki Ogino ,  Jun Nishimine

IPC: C07F7/18 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  C07D251/54 ,  C08J5/12

CPC classification number: C07F7/1804 ,  B32B5/02 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  C07D251/54 ,  C08J5/12 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  C08J2363/00

Abstract: Provided is a chemical compound represented by the general formula (A), in which each of substituents Q1 to Q6 is bonded to a nitrogen atom of melamine backbone. In the general formula (A), at least one of Q1 to Q6 is X, and at least one of Q1 to Q6 is Y. R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R2 is a hydrogen atom, or a monovalent hydrocarbon group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 25 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. Each of R51 and R52 is a divalent organic group, and a is an integer of 1 to 3.

公开(公告)号：US11230644B1

公开(公告)日：2022-01-25

申请号：US17188460

申请日：2021-03-01

Applicant: MEC COMPANY LTD.

Inventor： Koki Morikawa ,  Masahiro Hayashizaki ,  Motohiro Nakano ,  Masataka Araki

IPC: C09D1/00 ,  B32B37/12 ,  B32B15/08 ,  B32B15/20

Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.

公开(公告)号：US20200325583A1

公开(公告)日：2020-10-15

申请号：US16753986

申请日：2018-10-11

Applicant: MEC COMPANY., LTD.

Inventor： Kenji Nisie ,  Yuki Oka ,  Tomoko Ichihashi ,  Takuto Fujii

IPC: C23C22/52 ,  B05D1/26 ,  B05D7/14 ,  B05D3/12 ,  C09D11/30

Abstract: An object is to provide, for example, a method for manufacturing a film-forming substrate that can sufficiently improve both bleeding of a resin composition and adhesion between the resin composition and a metal substrate surface. For example, provided is a method for manufacturing a film-forming substrate having a film of a resin composition formed on a metal substrate surface, the method including: an etching step of etching a metal substrate surface with a micro-etching agent; a surface treatment step of bringing the etched metal substrate surface into contact with a surface treatment agent to perform a surface treatment such that a contact angle of water on the surface is 50° or more and 150° or less; and a film forming step of forming a film of a resin composition on the surface-treated metal substrate surface by an inkjet method.

公开(公告)号：US09932678B2

公开(公告)日：2018-04-03

申请号：US15224825

申请日：2016-08-01

Applicant: MEC COMPANY LTD.

Inventor： Masayo Kurii ,  Kiyoto Tai ,  Mami Nakamura

IPC: C09G1/04 ,  C09K13/00 ,  C23F1/18 ,  H05K3/38 ,  H05K3/02 ,  C23F1/34 ,  H05K3/00

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

公开(公告)号：US20120260821A1

公开(公告)日：2012-10-18

申请号：US13446962

申请日：2012-04-13

Applicant: Yoichi SENGOKU ,  Masami TSUTAE ,  Kiyoto TAI ,  Keisuke JOKO ,  Tsuyoshi AMATANI

Inventor： Yoichi SENGOKU ,  Masami TSUTAE ,  Kiyoto TAI ,  Keisuke JOKO ,  Tsuyoshi AMATANI

IPC: C09J9/00

CPC classification number: C23C22/52 ,  C23C18/1689 ,  C23C22/68 ,  H05K3/0079 ,  H05K3/108 ,  H05K2203/124

Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

Abstract translation: 本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，具有酸解离常数的倒数的对数的酸 在25℃下为3〜8，其盐在25℃下的pH为4以上7以下，可以稳定地形成用于提高铜与感光性树脂之间的粘合性的涂层，即使在 连续或反复使用; 以及形成用于将铜结合到感光性树脂上的涂层的方法，其包括使铜的表面与涂覆液形成液体组合物接触以形成涂层。