Abstract:
A zero current detector for a DC-DC converter includes a first transistor having a drain, a gate, and a source for sensing the voltage of a first terminal of a power transistor; a second transistor having a drain, a gate, and a source for sensing the voltage of a second terminal of a power transistor; and a third transistor having a coupled gate and drain for receiving a reference current that is coupled to the gates of the first and second transistors and a source coupled to the source of the first transistor, wherein an output signal is provided by the drains of the first and second transistors. A load is coupled to the drains of the first and second transistors. The zero current detector also includes a fourth transistor having a current path coupled between the source of the second transistor and the second terminal of the power transistor and a gate for receiving a control signal.
Abstract:
A method of estimating a channel response of a channel is provided that includes transforming a frequency domain signal received via the channel into a time domain signal and searching the time domain signal for a location of minimum energy. The method also includes padding the time domain signal with zeroes at the location of minimum energy and transforming the padded time domain signal to a second frequency domain signal. The second frequency domain signal is used as an estimated channel response for the channel.
Abstract:
A method and apparatus for estimating a carrier frequency offset (CFO) in a Digital Radio Mondiale receiver is provided. Orthogonal frequency-division multiplexing (OFDM) demodulation is performed on a received DRM signal to produce OFDM symbols. A cell characteristic in corresponding cells in the OFDM symbols is compared and a carrier index of a frequency pilot cell in the cells is identified based upon the compared cell characteristic. The CFO is estimated based on the identified carrier index of the frequency pilot cell. The ratio of values of the cell characteristic in corresponding cells may be calculated and the frequency pilot cell identified by identifying cells for which the cell characteristic is most nearly equal. The CFO may be estimated by comparing the identified carrier index with an expected carrier index of a frequency pilot cell.
Abstract:
A circuit structure for performing current amplification. The circuit structure may be standardized as a current amplifier cell such that many types of applications requiring current amplification may be created. The basic amplifier cell, which may accept voltage or current sources as an input signal, produces two identical output signals which may be used for feedback or serve as input to additional amplifier stages. This simple structure may be extended to perform current amplification with variable gain or AC or DC voltage-to-current conversion through the use of appropriately selected resistive elements.
Abstract:
Embodiments of the present disclosure relate to a semiconductor package, a method of forming semiconductor package and a power module. For example, there is provided a semiconductor package. The semiconductor package may comprise a chip level having a first side and a second side opposite to the first side, wherein the chip level comprises a plurality of power transistors and each power transistor is provided with a source and a gate at the first side. Besides, the semiconductor package may also comprise a first conductive level positioned on the first side and comprising a gate connection portion electrically connected with the gate and a source connection portion electrically connected with the source. The semiconductor package further comprises a second conductive level comprising a gate lead-out portion electrically connected with the gate connection portion and a source lead-out portion electrically connected with the source connection portion, wherein the first conductive level is positioned between the second conductive level and the chip level. Embodiments of the present disclosure may enhance the working performance of the product by improving consistency of conductive paths from the gate and the source of each power transistor to corresponding points.
Abstract:
A semiconductor package is provided, including a package forming method and a power supply module. The semiconductor package may include a first chip comprising a first surface, and a second surface opposite the first surface. The semiconductor package may also include a chip interconnect component located on the second surface of the first chip. In addition, the semiconductor package may include a second chip located on the chip interconnect component, comprising a third surface in contact with the chip interconnect component, and a fourth surface opposite the third surface. The chip interconnect component comprises an electrically conductive frame, one side of the electrically conductive frame is electrically connected to the second surface of the first chip, and the other side of the electrically conductive frame is electrically connected to the third surface of the second chip. The chip interconnect component may further comprise an insulating material for filling a gap of the electrically conductive frame between the first chip and the second chip. By arranging at least two chip on both sides of a preformed chip interconnect component, embodiments of the present disclosure achieve a high density chip layout for a 3D structure.
Abstract:
A system and method for estimating sample clock frequency offset (εs) in a digital radio mondiale (DRM) system such as, for example, DRM receivers. The system and method includes using a relationship given by the following equation: ɛ s = linearfit ( angle ( P G m P G _ tr m P G m - cycle P G _ tr m - cycle ) , l ) × N 2 π × cycle × ( N + L ) wherein the PGm is the gain pilot received in the mth symbol and PG—trm is the gain pilot transmitted in the mth symbol, the PGm-cycle is the gain pilot received in (m-cycle)th symbol, the PG—trm-cycle is the second gain pilot transmitted in (m-cycle)th symbol, the l is the index of the sub-carrier associated with the gain pilot, the N is a factor of a sample point number of a useful symbol, the L is a sample point number of a guard interval, and the cycle is the interval of two symbols which are inserted gain pilots at the same sub-carriers (l).
Abstract:
A driver for a DC-to-DC converter that may utilize a flyback or buck-boost converter circuit. The driver includes a driver circuit and an interface circuit. The interface circuit has a sensor sensing an input voltage from a DC supply and generating a sensor signal to a driver selector. The driver selector compares the sensor signal to a comparison voltage to determine the type of converter circuit and then transmits a selector signal to a driver circuit where it is used to control one or more of the components of the driver circuit, such as the logic circuit which is used for driving the converter to regulate the converter output. The sensor includes a sense resistor along with a current-sense amplifier, which is adapted for connection to a high side or a low side of a power supply while still producing a substantially equivalent output voltage or sensor signal.
Abstract:
A compensated regulator includes a transconductance stage having a positive input for receiving a reference voltage, a negative input, and an output, an adjustable compensation block coupled between the output of the transconductance stage and ground, a feedback circuit having a first node coupled to the output of the compensated regulator, a second node coupled to the negative input of the transconductance stage, and a third node coupled to ground, and a driver stage having an input coupled to the output of the transconductance stage, a current output coupled to the output of the compensated regulator, and a sense output coupled to the adjustable compensation block.
Abstract:
A micro-controller is connected between a hardware-based adaptive differential pulse code modulation (ADPCM) decoder and a read only memory (ROM) storing both micro-controller programming instructions and ADPCM encoded source file data. A micro-controller architecture implements time multiplexed ROM addressing driven by a two phase clock signal. In an instruction phase, a program counter supplies ROM address(es) for retrieving micro-controller programming instructions. In a decoder phase, an address counter supplies ROM address(es) for retrieving portions of the ADPCM encoded source file data. ADPCM encoded source file data extracted from the ROM in the decoder phase of the clock signal is delivered to the decoder for processing during the subsequent instruction phase of the clock signal. The selection between program counter and address counter supplied addresses for application to the ROM is made by a two phase clock signal driven multiplexer.