公开(公告)号：US07999335B2

公开(公告)日：2011-08-16

申请号：US12327341

申请日：2008-12-03

Applicant: Mayumi Mikami ,  Konami Izumi

Inventor： Mayumi Mikami ,  Konami Izumi

IPC: H01L29/84

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00166 ,  H01H1/58 ,  H01H2001/0052 ,  H01H2001/0057 ,  Y10T29/49155

Abstract: A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning, disconnection, and the like of the wiring formed over the sacrificial layer at a step portion generated due to the thickness of the sacrificial layer can be prevented. The wiring over the sacrificial layer is formed of the same conductive film as an upper driving electrode which is a movable electrode and is thus thin. However, the different wiring is formed over a structural layer, which is formed by a CVD method and has a rounded step, and has a thickness of 200 nm to 1 μm, whereby thinning, disconnection, and the like of the wiring can be further prevented.

Abstract translation: 在形成有表面微机械加工技术的微型机械（MEMS机构）中，提供了防止配线断线和断线的结构。 在牺牲层之上的布线（上辅助布线）在牺牲层上电连接到不同的布线（上连接布线），从而在生成的台阶部分上形成在牺牲层上的布线的变薄，断开等 由于可以防止牺牲层的厚度。 牺牲层上的布线由与作为可动电极的上驱动电极相同的导电膜形成，因此薄。 然而，不同的布线形成在通过CVD法形成并具有圆形台阶的结构层上，并且具有200nm至1μm的厚度，从而可以进一步布线的变薄，断开等 防止了

公开(公告)号：US07893798B2

公开(公告)日：2011-02-22

申请号：US11797924

申请日：2007-05-09

Applicant: John S. Foster ,  Kimberly L. Turner

Inventor： John S. Foster ,  Kimberly L. Turner

IPC: H01H51/22

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00333 ,  Y10T29/49105 ,  Y10T29/5317

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract translation: 用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。 可变形板可以具有位于可变形板的振动模式的节点线处的至少一个分流杆，使得当板在该振动模式下振动时，分流棒保持相对静止。 气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。 可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

公开(公告)号：US07872432B2

公开(公告)日：2011-01-18

申请号：US11378340

申请日：2006-03-20

Applicant: Alok Paranjpye ,  Jeffery F. Summers

Inventor： Alok Paranjpye ,  Jeffery F. Summers

IPC: H02N11/00

CPC classification number: B81B3/0024 ,  B81B2201/018 ,  B81B2201/0278 ,  H01H2037/008 ,  H01H2061/008 ,  Y10T29/49105 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/53248

Abstract: A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.

Abstract translation: 公开了一种MEMS热开关，其使用可滑动接合的系绳将热膨胀梁耦合到冷弯头梁，并且通过热束的膨胀来弯曲冷弯曲梁。 刚性接合的系绳将热的，扩张的梁和冷的弯曲梁的远端连接在一起，而可滑动地接合的系绳允许热的，膨胀的梁相对于冷的屈肌梁而伸长，而不加载可滑动地接合的系绳 具有很大的剪切力。 结果，系链的材料可以变得更硬，并且因此将热膨胀梁的弯曲力更有效地传递到凉爽的弯曲梁。

公开(公告)号：US20100155204A1

公开(公告)日：2010-06-24

申请号：US12717406

申请日：2010-03-04

Applicant: Rogier Receveur ,  Philippe Habets ,  Ralph B. Danzl ,  Richard P.M. Houben ,  Michael F. Mattes

Inventor： Rogier Receveur ,  Philippe Habets ,  Ralph B. Danzl ,  Richard P.M. Houben ,  Michael F. Mattes

IPC: H01H59/00 ,  H01H11/00

CPC classification number: H01H59/0009 ,  B81B3/0054 ,  B81B2201/018 ,  B81B2203/051 ,  H01H2001/0042 ,  H01H2001/0078 ,  Y10T29/49105

Abstract: A micro electromechanical (MEMS) switch suitable for use in medical devices is provided, along with methods of producing and using MEMS switches. In one aspect, a micro electromechanical switch including a moveable member configured to electrically cooperate with a receiving terminal is formed on a substrate. The moveable member and the receiving terminal each include an insulating layer proximate to the substrate and a conducting layer proximate to the insulating layer opposite the substrate. In various embodiments, the conducting layers of the moveable member and/or receiving terminal include a protruding region that extends outward from the substrate to switchably couple the conducting layers of the moveable member and the receiving terminal to thereby form a switch. The switch may be actuated using, for example, electrostatic energy.

Abstract translation: 提供了适用于医疗设备的微机电（MEMS）开关，以及生产和使用MEMS开关的方法。 一方面，在基板上形成包括被配置为与接收端子电配合的可移动部件的微机电开关。 可移动构件和接收端子各自包括靠近衬底的绝缘层和靠近与衬底相对的绝缘层的导电层。 在各种实施例中，可移动构件和/或接收端子的导电层包括从基板向外延伸的可突出地连接可移动构件和接收端子的导电层从而形成开关的突出区域。 可以使用例如静电能来致动开关。

公开(公告)号：US20090200144A1

公开(公告)日：2009-08-13

申请号：US11814187

申请日：2006-10-11

Applicant: Yasuyuki Naito

Inventor： Yasuyuki Naito

IPC: H01H57/00

CPC classification number: H01H1/0036 ,  B81B3/0005 ,  B81B2201/018

Abstract: A microelectromechanical element of a hydrophobic surface structure with a long life and high reliability and an electromechanical switch using the microelectromechanical element are provided. The surface of an electrode has a composite surface structure of a first area made of a first material forming the electrode and a second area made of a second material at least having hydrophobicity. The surface structure is the composite surface structure of the electrode material and a monolayer, whereby physical compression of the monolayer is avoided. A structure wherein the monolayer is not formed on the propagation path of a radio frequency signal is adopted, so that an increase in an insertion loss and electric field damage are avoided.

Abstract translation: 提供了具有长寿命和高可靠性的疏水性表面结构的微电子机械元件和使用微机电元件的机电开关。 电极的表面具有由形成电极的第一材料制成的第一区域和至少具有疏水性的第二材料制成的第二区域的复合表面结构。 表面结构是电极材料和单层的复合表面结构，从而避免了单层的物理压缩。 采用其中在射频信号的传播路径上未形成单层的结构，从而避免了插入损耗和电场损伤的增加。

公开(公告)号：US20090184728A1

公开(公告)日：2009-07-23

申请号：US12174645

申请日：2008-07-17

Applicant: Kiyoto Nakamura ,  Hiroshi Arikawa ,  Yoshiaki Moro ,  Hirokazu Sampei

Inventor： Kiyoto Nakamura ,  Hiroshi Arikawa ,  Yoshiaki Moro ,  Hirokazu Sampei

IPC: G01R31/02 ,  B05D5/12 ,  B32B15/04 ,  G01R31/26 ,  H05K1/09

CPC classification number: B81C1/00674 ,  B81B3/0005 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0096 ,  G01R1/06761 ,  G01R3/00 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T428/12493

Abstract: Provided is a method for producing a contact device, including a step of forming a first conductive film; a step of forming a second conductive film containing a metal or an alloy of the metal on the first conductive film; a step of forming a third conductive film on the second conductive film; and a step of forming a surface layer on the third conductive film, the surface layer containing an oxidative product of the metal in the second conductive film, which metal has been diffused to be precipitated out from the surface of the third conductive film and oxidized.

Abstract translation: 提供一种接触装置的制造方法，包括形成第一导电膜的工序; 在第一导电膜上形成含有金属或金属合金的第二导电膜的步骤; 在第二导电膜上形成第三导电膜的步骤; 以及在所述第三导电膜上形成表面层的步骤，所述表面层含有所述金属在所述第二导电膜中的氧化产物，所述金属已被扩散以从所述第三导电膜的表面析出并被氧化。

公开(公告)号：US20090145629A1

公开(公告)日：2009-06-11

申请号：US12327341

申请日：2008-12-03

Applicant: Mayumi Mikami ,  Konami Izumi

Inventor： Mayumi Mikami ,  Konami Izumi

IPC: H05K1/09 ,  H05K1/00 ,  H05K3/10

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00166 ,  H01H1/58 ,  H01H2001/0052 ,  H01H2001/0057 ,  Y10T29/49155

Abstract: A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning, disconnection, and the like of the wiring formed over the sacrificial layer at a step portion generated due to the thickness of the sacrificial layer can be prevented. The wiring over the sacrificial layer is formed of the same conductive film as an upper driving electrode which is a movable electrode and is thus thin. However, the different wiring is formed over a structural layer, which is formed by a CVD method and has a rounded step, and has a thickness of 200 nm to 1 μm, whereby thinning, disconnection, and the like of the wiring can be further prevented.

Abstract translation: 在形成有表面微机械加工技术的微型机械（MEMS机构）中，提供了防止配线断线和断线的结构。 在牺牲层之上的布线（上辅助布线）在牺牲层上电连接到不同的布线（上连接布线），从而在生成的台阶部分上形成在牺牲层上的布线的变薄，断开等 由于可以防止牺牲层的厚度。 牺牲层上的布线由与作为可动电极的上驱动电极相同的导电膜形成，因此薄。 然而，不同的布线形成在通过CVD法形成并具有圆形台阶的结构层上，并且具有200nm至1μm的厚度，由此可以进一步布线的变薄，断开等 防止了

公开(公告)号：US20090085426A1

公开(公告)日：2009-04-02

申请号：US12239302

申请日：2008-09-26

Applicant: Robert C. Davis ,  Richard R. Vanfleet ,  David N. Hutchison

Inventor： Robert C. Davis ,  Richard R. Vanfleet ,  David N. Hutchison

IPC: H02N1/00

CPC classification number: H01J5/18 ,  B81B2201/018 ,  B81B2203/0109 ,  B81C1/00031 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B32/168 ,  C01B2202/20 ,  C01B2202/34 ,  C01B2202/36

Abstract: A carbon nanotube MEMS assembly comprises a plurality of carbon nanotubes oriented into a patterned frame, the patterned frame defining at least two components of a MEMS device. An interstitial material at least partially binds adjacent carbon nanotubes one to another. At least one component of the frame is fixed and at least one component of the frame is movable relative to the fixed component.

Abstract translation: 碳纳米管MEMS组件包括定向成图案化框架的多个碳纳米管，所述图案化框架限定MEMS装置的至少两个部件。 间隙材料至少部分地相邻地邻接碳纳米管。 框架的至少一个部件是固定的，并且框架的至少一个部件相对于固定部件是可移动的。

公开(公告)号：US07381583B1

公开(公告)日：2008-06-03

申请号：US10901315

申请日：2004-07-27

Applicant: John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

Inventor： John L. Ebel ,  Rebecca Cortez ,  Richard E. Strawser ,  Kevin D. Leedy

IPC: H01L21/00

CPC classification number: B81C1/00333 ,  B81B2201/018 ,  B81C2203/0154 ,  H01H59/0009

Abstract: A capacitance coupled, transmission line-fed, radio frequency MEMS switch and its fabrication process using photoresist and other low temperature processing steps are described. The achieved switch is disposed in a low cost dielectric housing free of undesired electrical effects on the switch and on the transmission line(s) coupling the switch to an electrical circuit. The dielectric housing is provided with an array of sealable apertures useful for wet, but hydrofluoric acid-free, removal of switch fabrication employed materials and also useful during processing for controlling the operating atmosphere surrounding the switch—e.g. at a pressure above the high vacuum level for enhanced switch damping during operation. Alternative arrangements for sealing an array of dielectric housing apertures are included. Processing details including plan and profile drawing views, specific equipment and materials identifications, temperatures and times are also disclosed.

Abstract translation: 描述了电容耦合，传输线馈电，射频MEMS开关及其使用光致抗蚀剂和其它低温处理步骤的制造工艺。 所实现的开关设置在低成本的绝缘壳体中，在开关上以及将开关耦合到电路的传输线上不受不利影响。 绝缘壳体设置有可用于湿的但不含氢氟酸的可密封的孔阵列，其除去开关制造所采用的材料，并且在用于控制开关周围的操作气氛的处理期间也是有用的。 在高真空水平以上的压力下，用于在运行期间增强开关阻尼。 包括用于密封绝缘壳体孔阵列的替代布置。 还披露了包括计划和剖面图，特定设备和材料标识，温度和时间在内的处理细节。

公开(公告)号：US07364930B2

公开(公告)日：2008-04-29

申请号：US11172892

申请日：2005-07-05

Applicant: Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

Inventor： Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/018 ,  B81B2201/047 ,  B81C99/008 ,  B81C99/0085 ,  B81C2201/034 ,  C03B11/082 ,  C03B23/0252 ,  C03B23/203 ,  C03B2215/41 ,  C03B2215/412

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract translation: 这里提出的是一种结构玻璃型材料的表面和该方法的变型的方法，包括以下步骤：提供半导体衬底，形成半导体衬底的至少一个表面的凹槽的形成 提供玻璃型材料的基板，将半导体基板与玻璃型基板接合，半导体基板的结构化表面以至少部分重叠的关系连接到玻璃类型表面的表面，并且加热 通过退火以使得玻璃类材料流入半导体衬底的结构化表面的凹槽中的方式被粘合的衬底。 该方法的变型特别适用于制造微光学透镜和微机械部件，例如微型继电器或微型阀。