公开(公告)号：US09908902B2

公开(公告)日：2018-03-06

申请号：US15015905

申请日：2016-02-04

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C07K7/08 ,  C08K9/06 ,  C07F7/08 ,  H05K1/03 ,  C07F7/18 ,  C07F7/10 ,  C08K5/5419 ,  C08K5/5465 ,  C08K3/00

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

公开(公告)号：US09872382B2

公开(公告)日：2018-01-16

申请号：US14793341

申请日：2015-07-07

Applicant: Elite Electronic Material (Zhong Shan) Co., Ltd.

Inventor： Changyuan Li ,  Chen-Yu Hsieh ,  Hao Chen ,  Lianhui Cai ,  Xiangnan Li

IPC: B32B15/08 ,  B32B15/20 ,  B32B27/04 ,  B32B27/18 ,  C08K5/5397 ,  C09D4/00 ,  C09D171/12 ,  H05K1/03 ,  C08K5/5313 ,  C08K5/54 ,  C09D133/14 ,  B32B5/02 ,  B32B15/04 ,  B32B15/14 ,  B32B27/28 ,  B32B27/36 ,  C03C25/32 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0373 ,  B32B5/022 ,  B32B5/024 ,  B32B15/046 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/281 ,  B32B27/36 ,  B32B2255/02 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/20 ,  B32B2307/30 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2457/08 ,  C03C25/32 ,  C08K5/5313 ,  C08K5/5397 ,  C08K5/5406 ,  C09D4/00 ,  C09D133/14 ,  C09D171/12 ,  H05K1/024 ,  H05K1/0326 ,  H05K3/4688 ,  H05K2201/012 ,  H05K2201/0195

Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I). In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a composite material having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and a laminate and printed circuit board having the properties of high glass transition temperature, low dielectric properties, halogen-free flame retardancy, low thermal expansion coefficient of the laminate, etc., can be made from the composite material.

公开(公告)号：US20170292018A1

公开(公告)日：2017-10-12

申请号：US15511324

申请日：2014-12-10

Applicant: ZHUHAI EPOXY BASE ELECTRONIC MATERIAL CO., LTD.

Inventor： YONGGUANG WU ,  Renzong Lin ,  Huangming Song

IPC: C08L63/00 ,  C08G59/06 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  H05K3/46 ,  C08J5/24 ,  C08J5/04 ,  C08J5/10 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  C08G59/30 ,  C08G59/68

CPC classification number: C08L63/00 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B37/15 ,  B32B2038/168 ,  B32B2305/076 ,  B32B2305/18 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/063 ,  C08G59/304 ,  C08G59/5046 ,  C08G59/56 ,  C08G59/621 ,  C08G59/686 ,  C08G59/688 ,  C08J5/043 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08J2363/10 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L63/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0353 ,  H05K3/4611 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

公开(公告)号：US09771479B2

公开(公告)日：2017-09-26

申请号：US15027353

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: B32B15/04 ,  C08L79/04 ,  C08K3/00 ,  C08K5/49 ,  C08L25/10 ,  C08L71/12 ,  C09D179/04 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B15/098 ,  B32B15/20 ,  C08G14/06 ,  C08G14/12 ,  C09J161/34 ,  B32B5/02 ,  B32B5/26 ,  B32B7/10 ,  B32B15/14 ,  B32B15/18 ,  B32B15/08

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/10 ,  B32B15/098 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  C08G14/06 ,  C08G14/12 ,  C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/49 ,  C08K5/5399 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L71/126 ,  C08L79/085 ,  C09D179/04 ,  C09J161/34 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

公开(公告)号：US09738832B2

公开(公告)日：2017-08-22

申请号：US15142067

申请日：2016-04-29

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Timothy C. Mauldin

IPC: C09K21/14 ,  C08G79/04 ,  C08K3/00 ,  C08K5/00 ,  C08K7/00 ,  H01R13/527 ,  H05K1/03 ,  C08G81/00

CPC classification number: C09K21/14 ,  C08G79/04 ,  C08G81/00 ,  C08K3/00 ,  C08K5/00 ,  C08K7/00 ,  H01R13/527 ,  H05K1/0373 ,  H05K2201/012

Abstract: A flame retardant block copolymer is prepared from renewable content. In an exemplary synthetic method, a bio-derived flame retardant block copolymer is prepared by a ring opening polymerization of a biobased cyclic ester and a phosphorus-containing polymer. In some embodiments, the biobased cyclic ester is lactide. In some embodiments, the phosphorus-containing polymer is a hydroxyl-telechelic flame retardant biopolymer prepared by a polycondensation reaction of a biobased diol (e.g., isosorbide) and a phosphorus-containing monomer (e.g., phenylphosphonic dichloride). In other embodiments, the phosphorus-containing polymer is synthesized from a dioxaphospholane monomer.

公开(公告)号：US09738774B2

公开(公告)日：2017-08-22

申请号：US15040100

申请日：2016-02-10

Applicant: ICL-IP America Inc.

Inventor： Andrew M. Piotrowski ,  Mayank P. Singh ,  Kali A. Suryadevara ,  Mariya Kozytska ,  Yossi Zilberman

IPC: B32B9/04 ,  C08K5/5313 ,  C07F9/6571 ,  C08J5/24 ,  C08G59/40 ,  B32B15/20 ,  H05K1/03 ,  B32B37/10 ,  C08G59/62 ,  C08G59/68 ,  C08L63/04 ,  B32B5/26 ,  B32B7/12 ,  B32B15/08 ,  B32B27/06 ,  B32B37/06

CPC classification number: C08K5/5313 ,  B32B5/26 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B37/06 ,  B32B37/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2309/125 ,  B32B2311/12 ,  B32B2457/08 ,  C07F9/657172 ,  C07F9/657181 ,  C08G59/4071 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/04 ,  C08K3/08 ,  C08K2003/085 ,  C08L63/04 ,  H05K1/0373 ,  H05K2201/012

Abstract: There is provided herein a curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermoplastic and/or thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.

公开(公告)号：US20170218273A1

公开(公告)日：2017-08-03

申请号：US15514676

申请日：2015-09-30

Applicant: KOLON INDUSTRIES, INC.

Inventor： Sung Kyu KANG ,  Guang Chun HUANG

IPC: C09K21/14 ,  C08F8/40 ,  H05K1/03 ,  C09K21/12

CPC classification number: C09K21/14 ,  C08F8/40 ,  C08G59/066 ,  C08G59/304 ,  C09K21/12 ,  H05K1/0326 ,  H05K2201/012

Abstract: This invention relates to a flame-retardant epoxy resin, to a method of preparing the same, and to a flame-retardant epoxy resin composition including the same, and more specifically to a flame-retardant epoxy resin, which satisfies properties while improving flame retardancy by increasing the phosphorus content, to a method of preparing the same, and to a flame-retardant epoxy resin composition including the same.

公开(公告)号：US09650512B2

公开(公告)日：2017-05-16

申请号：US13964070

申请日：2013-08-10

Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD

Inventor： Rong-Tao Wang ,  Li-Chih Yu ,  Yu-Te Lin ,  Yi-Jen Chen ,  Wenjun Tian ,  Ziqian Ma ,  Wenfeng Lu

IPC: B32B27/38 ,  C08L63/04 ,  C08G59/40 ,  C08G59/62 ,  C08K5/00 ,  H05K1/03 ,  H05K3/02

CPC classification number: C08L63/04 ,  C08G59/4064 ,  C08G59/621 ,  C08K5/0066 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

公开(公告)号：US09637598B2

公开(公告)日：2017-05-02

申请号：US14766433

申请日：2014-02-03

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroaki Fujiwara ,  Yuki Kitai ,  Hirosuke Saito

IPC: C08L61/04 ,  C08G73/22 ,  C08J5/24 ,  H01L23/29 ,  H01L23/14 ,  C08G73/02 ,  C08K5/378 ,  C08L79/04 ,  H05K1/03 ,  B32B15/14 ,  C08L63/00 ,  C08G14/06 ,  C08L61/34 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04

CPC classification number: C08K5/378 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2581/00 ,  C08G14/06 ,  C08G59/686 ,  C08G59/687 ,  C08G73/0233 ,  C08G73/22 ,  C08J5/24 ,  C08J2379/02 ,  C08J2379/04 ,  C08K5/3445 ,  C08L61/04 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C08L79/04 ,  C08L2203/20 ,  H01L23/145 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0129 ,  H01L2924/00

Abstract: A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.

公开(公告)号：US09603244B2

公开(公告)日：2017-03-21

申请号：US12443260

申请日：2007-09-10

Applicant: Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

Inventor： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

IPC: B32B15/08 ,  C08G59/40 ,  H05K1/03 ,  C08G59/50 ,  C08G73/12 ,  C08L63/00 ,  C08L79/08 ,  B32B15/092 ,  B32B15/14 ,  C08L25/08

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4021 ,  C08G59/4042 ,  C08G59/506 ,  C08G59/5086 ,  C08G73/12 ,  C08G73/124 ,  C08J5/24 ,  C08J2363/04 ,  C08J2363/08 ,  C08J2423/22 ,  C08J2425/08 ,  C08L25/08 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/31678 ,  C08L2666/04

Abstract: The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.