公开(公告)号：US07573725B2

公开(公告)日：2009-08-11

申请号：US11620925

申请日：2007-01-08

Applicant: Joseph R. Nicolaisen

Inventor： Joseph R. Nicolaisen

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/4694 ,  H05K1/0366 ,  H05K1/162 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09309 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a printed circuit board having two or more cores coupled together using a prepreg sheet having selected regions of increased permittivity. In combining the cores with the prepreg sheet, the regions of increased permittivity are preferably aligned with power delivery planes defined between respective cores. By increasing the permittivity within the power delivery planes, the greater the reduction in area of the cores needed for power delivery and the greater the area retained on the cores for providing signal routing. As a result, a printed circuit board incorporating teachings of the present disclosure may support more advanced and complex information handling system implementations.

Abstract translation: 公开了一种用于提供具有优化的功率输送平面和信号路由区域的印刷电路板的系统，方法和装置。 一方面，本公开教导了具有两个或更多个芯的印刷电路板，其使用具有增加介电常数的选定区域的预浸料片连接在一起。 在将芯与预浸料片组合时，增加的介电常数的区域优选地与在各个芯之间限定的功率输送平面对准。 通过增加功率输送平面内的介电常数，功率输送所需的核心面积的减小越多，用于提供信号路由的核心上保留的区域越大。 结果，包含本公开的教导的印刷电路板可以支持更先进和复杂的信息处理系统实现。

公开(公告)号：US07572031B2

公开(公告)日：2009-08-11

申请号：US11669622

申请日：2007-01-31

Applicant: John C. Schultz ,  Andrew J Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

Inventor： John C. Schultz ,  Andrew J Ouderkirk ,  Joel S. Peiffer ,  Nelson B. O'Bryan ,  John A. Wheatley ,  Cameron T. Murray

IPC: F21V33/00

CPC classification number: H05K1/189 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09363 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.

Abstract translation: 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。

公开(公告)号：US20090181218A1

公开(公告)日：2009-07-16

申请号：US12318871

申请日：2009-01-09

Applicant: Jung-Ho Park ,  Jong-Taik Lee

Inventor： Jung-Ho Park ,  Jong-Taik Lee

IPC: B32B3/00 ,  B05D5/12

CPC classification number: B41M5/0041 ,  B41M3/001 ,  B41M3/006 ,  B41M5/0047 ,  B41M2205/12 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/245 ,  H05K3/38 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/013 ,  H05K2203/0783 ,  H05K2203/1476 ,  Y10T428/24802

Abstract: The present invention relates to a conductive pattern and a method for forming the conductive pattern, and more particularly, to a method for forming a conductive pattern, which comprises the steps of 1) preparing a substrate; 2) forming a first pattern by printing a first composition that includes an adhesion promoter and a solvent on the substrate; 3) forming a second pattern by printing a second composition that includes a conductive particle and a solvent on the first pattern; and 4) sintering the first pattern and the second pattern. The method for forming the conductive pattern according to the present invention may improve an adhesion property between a pattern and a substrate and may form a fine pattern having high resolution without formation of bank on a hydrophobic substrate.

Abstract translation: 导电图案及其形成方法技术领域本发明涉及导电图案及其形成方法，更具体地说，涉及形成导电图案的方法，其特征在于，包括以下步骤：1）制备基板; 2）通过在基材上印刷包含粘合促进剂和溶剂的第一组合物来形成第一图案; 3）通过在第一图案上印刷包括导电颗粒和溶剂的第二组合物形成第二图案; 和4）烧结第一图案和第二图案。 根据本发明的形成导电图案的方法可以改善图案和基底之间的粘附性，并且可以形成具有高分辨率的精细图案而不在疏水性基底上形成堤。

公开(公告)号：US07556405B2

公开(公告)日：2009-07-07

申请号：US11495043

申请日：2006-07-28

Applicant: Howard A. Kingsford ,  Kristel L. Ferry ,  William P. Clune ,  Mark A. Clarner ,  Bryan H. Blackmon

Inventor： Howard A. Kingsford ,  Kristel L. Ferry ,  William P. Clune ,  Mark A. Clarner ,  Bryan H. Blackmon

IPC: F21V29/00

CPC classification number: H05K3/0014 ,  B29C2043/465 ,  B29L2031/729 ,  F21S4/20 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/301 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10S362/80

Abstract: A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The mounting structure is a pin receptacle constructed to receive a pin of the light emitting diode device. An electrically conductive portion is carried by the resin base and positioned for electric connection to conductors of the device. Another flexible circuit carries discrete integrated circuit chips and a field of fastener elements extending from a surface of a resin strip carrying conductive traces interconnecting the chips.

Abstract translation: 柔性电路具有卷成型热塑性树脂基片，其具有整体模制的安装结构，其被定位成在发光位置接收发光二极管器件。 安装结构是构造成接收发光二极管器件的引脚的引脚插座。 导电部分由树脂基底承载并且定位成与装置的导体电连接。 另一个柔性电路承载分离的集成电路芯片和从承载导电迹线的树脂带的表面延伸的紧固件元件的领域，互连芯片。

公开(公告)号：US20090170993A1

公开(公告)日：2009-07-02

申请号：US12344484

申请日：2008-12-27

Applicant: Shur-Fen Liu ,  Meng-Huei Chen ,  Man-Chun Yu

Inventor： Shur-Fen Liu ,  Meng-Huei Chen ,  Man-Chun Yu

IPC: C08K3/22

CPC classification number: C08K3/22 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0209 ,  C08L21/00

Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.

Abstract translation: 提供了用于制造柔性基底的柔性低介电损耗组合物。 该组合物包括：具有30nm至2μm特定尺寸的SrTiO 3和/或Ba（Sr）TiO 3陶瓷颗粒，其量为组合物重量的20-80％; 至少一种柔性大分子的量为组合物重量的1.0-50％，其中大分子具有羟基，羧基，烯丙基，氨基或链脂族环氧基的官能团; 和热固性有机树脂。

公开(公告)号：US07553891B2

公开(公告)日：2009-06-30

申请号：US11202216

申请日：2005-08-12

Applicant: Takuro Hoshio ,  Hitoshi Okazaki ,  Masayuki Okoshi ,  Michiaki Yasuno

Inventor： Takuro Hoshio ,  Hitoshi Okazaki ,  Masayuki Okoshi ,  Michiaki Yasuno

IPC: C08K5/00

CPC classification number: H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0224 ,  Y10T428/31511

Abstract: A flame-retardant epoxy resin composition, as well as an electronic device, a laminated circuit board, a multilayered circuit board and a printed circuit board employing the flame-retardant epoxy resin composition are disclosed. The flame-retardant epoxy resin composition contains: an epoxy resin; an epoxy resin curing agent; and flame-retardant particles containing a metal hydrate. The flame-retardant particles are provided with a coating layer on the surfaces thereof and have a volume average particle diameter in a range from 1 to 500 nm.

Abstract translation: 公开了一种阻燃环氧树脂组合物，以及电子器件，层压电路板，多层电路板和采用阻燃环氧树脂组合物的印刷电路板。 阻燃性环氧树脂组合物含有：环氧树脂; 环氧树脂固化剂; 和含有金属水合物的阻燃颗粒。 阻燃颗粒在其表面上设置有涂层，体积平均粒径在1〜500nm的范围内。

公开(公告)号：US20090159847A1

公开(公告)日：2009-06-25

申请号：US12390749

申请日：2009-02-23

Applicant: Akiyoshi Kawaguchi ,  Yoshiaki Ishii ,  Hideyuki Tsutsumi ,  Tomohiro Tanaka

Inventor： Akiyoshi Kawaguchi ,  Yoshiaki Ishii ,  Hideyuki Tsutsumi ,  Tomohiro Tanaka

IPC: C09K19/54 ,  C08K3/34 ,  C08K3/10 ,  C08K3/22 ,  C08K3/36

CPC classification number: C08K7/00 ,  C08K3/01 ,  C08K2201/016 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T428/24994

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-6.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 μm or below, thickness b: 1.0 μm or below, and aspect ratio (a/b): 20 or above.

Abstract translation: 一种树脂组合物，其特征在于含有（A）熔融温度为300℃以上的合成树脂和（B）加入到树脂中的具有以下特性的板状无机填料; 水分散体的pH：5.5-6.0，提取碱的量：30ppm以下，K 4​​0ppm以下，最大直径a：50μm以下，厚度b：1.0μm以下，纵横比（a / b ）：20以上。

公开(公告)号：US20090142582A1

公开(公告)日：2009-06-04

申请号：US12324006

申请日：2008-11-26

Applicant: Beom Joon CHO ,  Jong Myeon LEE

Inventor： Beom Joon CHO ,  Jong Myeon LEE

IPC: C03B29/00 ,  B32B18/00

CPC classification number: B32B18/00 ,  C04B38/0022 ,  C04B2111/00844 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/721 ,  C04B2235/9615 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2203/308 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/252 ,  C04B35/10 ,  C04B38/0054 ,  C04B38/0675 ,  C04B38/068

Abstract: There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Abstract translation: 提供了一种约束绿色，其包括第一约束层，其具有设置在陶瓷层叠体的顶表面和底表面中的一个上的表面，第一约束层包含第一无机粉末; 以及第二约束层，其设置在所述第一约束层的顶部并且包含第二无机粉末和飞灰。 约束生片用于确保陶瓷层压体的收缩较小，并改善脱脂特性。

公开(公告)号：US20090141504A1

公开(公告)日：2009-06-04

申请号：US12323984

申请日：2008-11-26

Applicant: Shigeru USHIKI ,  Yoshikazu Daigo

Inventor： Shigeru USHIKI ,  Yoshikazu Daigo

IPC: F21V7/00 ,  C08L71/10 ,  C08L43/02 ,  H05K1/00

CPC classification number: F21V7/22 ,  C08G65/18 ,  C08L63/00 ,  C08L71/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.

Abstract translation: 白硬化树脂组合物包括通过氯法生产的硬化树脂和金红石型氧化钛。

公开(公告)号：US07531112B2

公开(公告)日：2009-05-12

申请号：US10875323

申请日：2004-06-25

Applicant: Hyo Soon Shin ,  Jin Ho Kim ,  Jeong Joo Kim ,  Min Ji Ko

Inventor： Hyo Soon Shin ,  Jin Ho Kim ,  Jeong Joo Kim ,  Min Ji Ko

IPC: H01B1/00

CPC classification number: H05K1/162 ,  C08L101/12 ,  H01G4/206 ,  H05K2201/0209 ,  Y10T428/257

Abstract: Disclosed is a composition for forming a dielectric, which is applied to an embedded capacitor with a high dielectric constant, a capacitor produced using the composition, and a PCB provided with the capacitor. The composition includes 40 to 99 vol % of thermoplastic or thermosetting resin, and 1 to 60 vol % of semiconductive filler. Alternatively, the composition includes 40 to 95 vol % of thermoplastic or thermosetting resin, and 5 to 60 vol % of semiconductive ferroelectric substance. Furthermore, the present invention provides the capacitor, produced using the composition, and the PCB provided with the capacitor. Therefore, the dielectric, which is produced using the composition including the semiconductive filler or semiconductive ferroelectric substance, is advantageous in that the dielectric constant is high and a dielectric loss is low. The dielectric is usefully applied to produce an embedded capacitor with the high dielectric constant and the PCB provided with the embedded capacitor.

Abstract translation: 公开了一种用于形成电介质的组合物，其被应用于具有高介电常数的嵌入式电容器，使用该组合物制造的电容器和设置有电容器的PCB。 该组合物包含40至99体积％的热塑性或热固性树脂和1至60体积％的半导体填料。 或者，该组合物包含40〜95体积％的热塑性或热固性树脂和5〜60体积％的半导体铁电体。 此外，本发明提供使用该组合物制造的电容器和设置有电容器的PCB。 因此，使用包含半导体填料或半导体铁电体的组合物制造的电介质的优点在于介电常数高，介电损耗低。 电介质有效地应用于制造具有高介电常数的嵌入式电容器和设置有嵌入式电容器的PCB。