公开(公告)号：US20180134837A1

公开(公告)日：2018-05-17

申请号：US15577607

申请日：2016-06-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koji Furukawa ,  Atsuhito Arai ,  Hiroaki Sakata

IPC: C08G59/10 ,  C08G59/06 ,  C08G59/50 ,  C08L63/00 ,  C08J5/24

CPC classification number: C08G59/10 ,  C08G59/06 ,  C08G59/50 ,  C08G59/504 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L2201/08 ,  C08L2205/025

Abstract: Provided is an epoxy resin composition including the following component [A]: a tri- or more functional binaphthalene epoxy resin represented by the following general formula (A-1) and component [B]: an aromatic amine compound, in which the glass transition temperature of a cured product, which is obtained by curing the epoxy resin composition at 180° C. for 2 hours, after immersing in boiling water at 1 atm for 48 hours is 180° C. or more. An epoxy resin composition and a prepreg which can form a fiber-reinforced composite material excellent in heat resistance under high humidity are provided.

公开(公告)号：US20180127571A1

公开(公告)日：2018-05-10

申请号：US15566996

申请日：2016-04-20

Applicant: NOK CORPORATION

Inventor： Kenichi KUNIEDA ,  Atsushi KOBAYASHI

IPC: C08L15/02 ,  C08L27/12 ,  C08K3/34 ,  C08K5/053 ,  C08K9/06 ,  C09K3/10

CPC classification number: C08L15/02 ,  C08K3/34 ,  C08K5/053 ,  C08K5/13 ,  C08K9/06 ,  C08K2003/2206 ,  C08K2003/2224 ,  C08L27/12 ,  C08L2201/08 ,  C09K3/1009

Abstract: A fluororubber composition that can provide a vulcanizate having excellent blister resistance, comprising 10 to 100 parts by weight of wollastonite surface-treated with a silane coupling agent and having an aspect ratio of 2 or more, and 0.5 to 10 parts by weight of a polyol-based crosslinking agent, based on 100 parts by weight of fluororubber comprising 60 to 100 wt. % of a solid fluororubber polymer and 40 to 0 wt. % of a liquid fluororubber polymer. It is preferable that 30 to 70 wt. % of wollastonite surface-treated with a silane coupling agent is replaced by wollastonite not surface-treated with a silane coupling agent, in terms of both ensuring of blister resistance and cost.

公开(公告)号：US20180127541A1

公开(公告)日：2018-05-10

申请号：US15575547

申请日：2016-05-25

Applicant: LOTTE ADVANCED MATERIALS CO., LTD.

Inventor： Jong Chan HUR ,  Jun Ho CHI ,  Woo Suk CHEI ,  O Sung KWON ,  Jung Jae LEE

IPC: C08G64/08 ,  C08G64/30 ,  C08L69/00 ,  C08K5/524

CPC classification number: C08G64/083 ,  C08G64/305 ,  C08G64/307 ,  C08K5/524 ,  C08L69/00 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2201/10

Abstract: A polycarbonate resin of the present invention comprises: a repeat unit represented by chemical formula 1 in the specification; a repeat unit represented by chemical formula 2; and a repeat unit represented by chemical formula 3. The polycarbonate resin has excellent flame retardancy, thermal resistance, transparency, impact resistance, etc.

公开(公告)号：US09944787B2

公开(公告)日：2018-04-17

申请号：US14388516

申请日：2013-03-25

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Chisato Saito ,  Daisuke Ueyama ,  Masanobu Sogame ,  Yoshinori Mabuchi ,  Yoshihiro Kato

IPC: C08L63/00 ,  B32B15/08 ,  B32B15/092 ,  C08J5/24 ,  B32B15/14 ,  C08L71/00 ,  C08K3/22 ,  C08L3/10 ,  C08L79/04

CPC classification number: C08L63/00 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K2003/221 ,  C08K2003/2224 ,  C08L3/10 ,  C08L71/00 ,  C08L79/04 ,  C08L2201/08 ,  C08L2203/20 ,  Y10T428/24893 ,  Y10T442/2475 ,  Y10T442/3455 ,  Y10T442/656

Abstract: The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.

公开(公告)号：US09914831B2

公开(公告)日：2018-03-13

申请号：US15309696

申请日：2015-04-29

Applicant: BASF SE

Inventor： Maximillian Lehenmeier ,  Gabriel Skupin ,  Martin Bussmann

IPC: C08L67/02 ,  B65D43/00 ,  B65D75/36

CPC classification number: C08L67/02 ,  B65D43/00 ,  B65D75/36 ,  C08K3/013 ,  C08L67/04 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/03

Abstract: The present invention relates to an injection-molded item with HDT-B temperature of from 80 to 105° C. in accordance with DIN EN ISO 75-2:2004-09, comprising: i) from 47 to 59% by weight, based on the total weight of components i to iv, of a biodegradable aliphatic polyester; ii) from 3 to 14% by weight, based on the total weight of components i to iv, of an aliphatic-aromatic polyester; iii) from 15 to 24% by weight, based on the total weight of components i to iv, of polylactic acid; iv) from 10 to 35% by weight, based on the total weight of components i to iv, of at least one mineral filler; where the following applies to the compounded material comprising components i to iv: the ratio of component i to component iii in the compounded material is from 2.2 to 3.2, and the MVR of the compounded material is from 8 to 50 cm3/10 min in accordance with DIN EN 1133-1 of Mar. 1, 2012 (190° C., 2.16 kg).

公开(公告)号：US20180066136A1

公开(公告)日：2018-03-08

申请号：US15676187

申请日：2017-08-14

Applicant: Keki Hormusji GHARDA

Inventor： Keki Hormusji Gharda ,  Prakash D. Trivedi ,  Tushar R. Parida ,  Amitkumar Biradar

IPC: C08L79/04 ,  C08L101/12 ,  C08G73/10 ,  C08G73/18 ,  C08L61/16 ,  C08L71/00 ,  C08L79/08 ,  C08L81/04 ,  C08L81/06 ,  B29C43/00 ,  B29L7/00 ,  B29L23/00 ,  B29L31/06 ,  B29L31/00 ,  B29K79/00 ,  B29K471/00

CPC classification number: C08L79/04 ,  B29C43/003 ,  B29K2079/00 ,  B29K2471/00 ,  B29L2007/00 ,  B29L2023/00 ,  B29L2031/06 ,  B29L2031/7728 ,  C08G73/1046 ,  C08G73/18 ,  C08G2650/40 ,  C08L61/16 ,  C08L71/00 ,  C08L79/08 ,  C08L81/04 ,  C08L81/06 ,  C08L101/12 ,  C08L2201/08

Abstract: The present disclosure provides a polymeric composition resistant to temperatures comprising Poly 2,5rBenzimidazole having intrinsic viscosity (I.V.) between 1.0 and 2.5; and at least one binder having a glass transition temperature less than the glass transition temperature of Poly2,5-Benzimidazole and intrinsic viscosity ranging between 0.2 and 1.5. The present disclosure also provides a process for preparing the polymeric composition resistant to temperatures.

公开(公告)号：US20180057664A1

公开(公告)日：2018-03-01

申请号：US15250726

申请日：2016-08-29

Applicant: WEIR SLURRY GROUP, INC.

Inventor： Francisco A. Gozalo ,  Sanford W. Clark

IPC: C08L7/00 ,  B02C17/22

CPC classification number: C08L7/00 ,  B02C17/225 ,  B02C2210/02 ,  C08L9/00 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/06

Abstract: This disclosure relates to wear-resistant rubber compositions, such as those, for example, comprising at least one hydroxy-terminated polybutadiene, at least one natural rubber, at least one polymerization accelerant; at least one sulfur; and at least one polybutadiene, wherein the wear-resistant rubber composition may have an effective cross-linking density of at least about 30×10−5 moles/cm3.

公开(公告)号：US09907166B2

公开(公告)日：2018-02-27

申请号：US15501995

申请日：2016-02-19

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi Kobayashi ,  Kentaro Takano

IPC: B32B27/38 ,  C08G59/50 ,  H05K1/03 ,  B32B15/14 ,  B32B15/20 ,  B32B37/06 ,  B32B37/10 ,  D06M15/55 ,  H05K3/00 ,  C08J5/24 ,  C08G61/02 ,  C08L65/00 ,  C08L63/00 ,  D06M101/00

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B37/06 ,  B32B37/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2457/08 ,  C08G14/12 ,  C08G59/40 ,  C08G61/02 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/65 ,  C08G2261/74 ,  C08G2261/76 ,  C08J5/24 ,  C08J2361/14 ,  C08J2361/34 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2461/14 ,  C08J2461/34 ,  C08J2463/00 ,  C08J2465/00 ,  C08K3/36 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C08L65/00 ,  C08L2201/02 ,  C08L2201/08 ,  D06M15/55 ,  D06M2101/00 ,  H05K1/0366 ,  H05K3/007 ,  H05K2201/0209

Abstract: The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

公开(公告)号：US09896579B2

公开(公告)日：2018-02-20

申请号：US15322304

申请日：2015-07-06

Applicant: UMG ABS, LTD.

Inventor： Takashi Iwanaga ,  Kousaku Tao ,  Nobutaka Hase

IPC: C08L33/12 ,  C08L51/04 ,  C08L51/06 ,  C08F291/02

CPC classification number: C08L33/12 ,  C08F212/08 ,  C08F220/14 ,  C08F283/124 ,  C08F285/00 ,  C08F291/02 ,  C08L33/04 ,  C08L51/085 ,  C08L2201/08 ,  C08L2205/03 ,  C08L2207/04 ,  C08F220/44 ,  C08F222/40 ,  C08F2222/402 ,  C08L25/12 ,  C08L83/04 ,  C08L51/006

Abstract: A thermoplastic resin composition of the present invention contains a graft copolymer (B) obtained by polymerizing a vinyl-based monomer component (m1) in the presence of a composite rubber polymer (A) formed from a polyorganosiloxane (Aa) and a poly(meth)acrylate ester (Ab), and a (meth)acrylate ester resin (C) obtained by polymerizing a vinyl-based monomer component (m2), wherein the amount of the polyorganosiloxane (Aa) relative to the total mass (100% by mass) of the composite rubber polymer (A) is from 1 to 20% by mass, the volume average particle size of the composite rubber polymer (A) is from 0.05 to 0.15 μm, and relative to the total mass (100% by mass) of the vinyl-based monomer component (m2), the amount of the maleimide-based compound is from 1 to 30% by mass, and the amount of the aromatic vinyl compound is from 5.5 to 15% by mass.

公开(公告)号：US20180030264A1

公开(公告)日：2018-02-01

申请号：US15554858

申请日：2016-03-04

Applicant: Huntsman Advanced Materials Americas LLC

Inventor： Dong Wang ,  Bradley Rechichar ,  Derek S. Kincaid ,  Ronald C. Smith

IPC: C08L61/34 ,  C08G14/06 ,  C09D161/34 ,  C08J5/24 ,  C07D265/16 ,  C09J161/34

CPC classification number: C08L61/34 ,  C07D265/14 ,  C07D265/16 ,  C07D413/14 ,  C08G14/06 ,  C08G73/22 ,  C08J5/04 ,  C08J5/043 ,  C08J5/24 ,  C08J2361/34 ,  C08J2379/00 ,  C08J2461/06 ,  C08J2463/04 ,  C08K5/34 ,  C08L61/06 ,  C08L2201/08 ,  C09D161/06 ,  C09D161/34 ,  C09J161/06 ,  C09J161/34 ,  C09J2461/00 ,  C09J2463/00

Abstract: The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.