Abstract:
A light-emitting diode has a metal structure, a light-emitting chip, and a bowl structure. The metal structure has a platform and a heat sink. The platform has a top face, a first side, and a second side opposite to the first side. A first reflector and a second reflector respectively extend from the first side and the second side. The heat sink extends below the top face and has a drop from the bottom surfaces of the first reflector and the second reflector. The light-emitting chip is disposed on the top face. The bowl structure covers the outer surface of the metal structure and shields the bottom surfaces of the first reflector and the second reflector. A thermal dispassion surface of the heat sink is exposed from the bowl structure. An inner surface of bowl wall has a plurality of reflection structures to promote the light extraction efficiency.
Abstract:
A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.
Abstract:
A nail gun capable of preventing a trigger from being pulled in a nail-empty condition is provided. The nail gun includes a housing connected with a trigger, a muzzle, a nail driving member moveably mounted in the muzzle and a nail magazine communicated with the muzzle for accommodating nails and a nail pushing member for pushing the nails toward the muzzle, and a side of the nail pushing member has a locking portion; and a safety member moveably mounted to the muzzle for upward or downward movement. An end of the safety member has a stop portion. A position of the locking portion is corresponding to that of the stop portion for selectively stopping the upward or downward movement of the safety member.
Abstract:
A horizontal type display device includes a base unit, a first support unit, a display unit, a second support unit and a hinge unit. The base unit includes a base body. The first support unit includes a vertical support structure vertically disposed on the base body. The display unit includes a display screen disposed above the base body and beside the vertical support structure. The second support unit includes a horizontal support structure horizontally connected between the vertical support structure and the display screen. The horizontal support structure has a first end portion inserted and fixed in the vertical support structure. The hinge unit includes a hinge structure disposed inside the display screen and connected to a second end portion of the horizontal support structure. The view angle of the display screen can be adjustable through the hinge structure that is connected to the display screen.
Abstract:
An electronic device is provided. The electronic device includes a base, a battery module and an upper cover. The battery module is disposed in the base. The battery module includes a tray and at least one battery unit. The battery unit is disposed on the tray. The upper cover is connected to the base and covers the battery module.
Abstract:
A computer implemented system comprises: a tangible, non-transitory computer readable storage medium encoded with data representing an initial layout of an integrated circuit pattern layer having a plurality of polygons. A special-purpose computer is configured to perform the steps of: analyzing in the initial layout of an integrated circuit pattern layer having a plurality of polygons, so as to identify a plurality of multi-patterning conflict cycles in the initial layout; constructing in the computer a respective multi-patterning conflict cycle graph representing each identified multi-patterning conflict cycle; classifying each identified multi-patterning conflict cycle graph in the computer according to a number of other multi-patterning conflict cycle graphs which enclose that multi-patterning conflict cycle graph; and causing a display device to graphically display the plurality of multi-patterning conflict cycle graphs according to their respective classifications.
Abstract:
A kind of production method for carbon nanotube sponges which can control different hole sizes and densities, having uniform cell sizes. The formed carbon nanotube sponge has a soft, flexible and multi-holed structure. The carbon nanotubes pass through a hydrophilic acid process, mixing with different ratios of polymer materials PVA and are dispersed in the solvent. This mixed liquid is frozen under different controlled solidifying rates, forming different sized solid ice crystals having controllable particle sizes, and is vacuumized in the next step, which removes the frozen solvent through low pressure sublimation, the remains being the multi-holed carbon nanotube sponge structure. The size of the cells of the carbon nanotube sponge structure can be controlled through the freezing rate and the addition of polymers. The strength and stiffness can be controlled through the density of the carbon nanotubes and the addition of polymers.
Abstract:
An apparatus and method of controlling power converters is achieved that produces high light-load efficiency and reduced output voltage ripple while maintaining quiet operation that is free from audible noise. The inventive method includes a variable on-time control circuit that is applicable to a wide variety of switching mode converters, including, but not limited to, boost converters, buck converters, buck-boost converters, single-ended primary inductor (SEPIC) converters, and other converter topologies, both isolated and non-isolated.
Abstract:
A system and method for electrostatic discharge protection. The system includes a first transistor including a first drain, a second transistor including a second drain, and a resistor including a first terminal and a second terminal. The first terminal is coupled to the first drain and the second drain. Additionally, the system includes a third transistor coupled to the second terminal and a protected system. The third transistor includes a first gate, a first dielectric layer located between the first gate and a first substrate, a first source, and a third drain. The protected system includes a fourth transistor, and the fourth transistor includes a second gate, a second dielectric layer located between the second gate and a second substrate, a second source, and a fourth drain.
Abstract:
A method comprises determining a warpage of an integrated circuit (IC) package design. The IC package design includes a substrate having a top solder mask on a first major surface and a bottom solder mask on a second major surface opposite the first major surface. The first major surface has an IC die mounted over the top solder mask. The design is modified, including modifying an average thickness of one of the group consisting of the top solder mask and the bottom solder mask, so as to reduce the warpage. An IC package is fabricated according to the modified design.