公开(公告)号：US20090289273A1

公开(公告)日：2009-11-26

申请号：US12471255

申请日：2009-05-22

Applicant: Chia-Lun Tsai ,  Ching-Yu Ni ,  Wen-Cheng Chien ,  Shang-Yi Wu ,  Cheng-Te Chou

Inventor： Chia-Lun Tsai ,  Ching-Yu Ni ,  Wen-Cheng Chien ,  Shang-Yi Wu ,  Cheng-Te Chou

IPC: H01L33/00

CPC classification number: H01L33/385 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device package structure is described. The light emitting device package structure includes a substrate serving as a carrier supporting a light emitting device chip. The substrate and the light emitting device chip have a chip side and a substrate side separately. A first electrode layer is disposed on a first surface of the light emitting device chip and a second electrode layer is disposed on a second surface of the light emitting device chip, in which the first surface and the second surface are not coplanar. A first conductive trace is electrically connected to the first electrode layer and a second conductive trace is electrically connected to the second electrode layer. At least the first conductive trace or the second conductive trace is formed along the chip side and the substrate side simultaneously.

Abstract translation: 描述了发光器件封装结构。 发光器件封装结构包括用作支撑发光器件芯片的载体的衬底。 基板和发光元件芯片分别具有芯片侧和基板侧。 第一电极层设置在发光器件芯片的第一表面上，并且第二电极层设置在发光器件芯片的第二表面上，其中第一表面和第二表面不是共面的。 第一导电迹线电连接到第一电极层，并且第二导电迹线电连接到第二电极层。 至少第一导电迹线或第二导电迹线同时沿着芯片侧和衬底侧形成。

公开(公告)号：US20060286719A1

公开(公告)日：2006-12-21

申请号：US11467053

申请日：2006-08-24

Applicant: Ching-Yu Ni ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan

Inventor： Ching-Yu Ni ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan

IPC: H01L21/00

CPC classification number: H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Described are semiconductor package devices with improved reliability and methods of manufacturing thereof. In one embodiment, a package device is disclosed that includes a chip having an active surface and a coupling surface opposite the active surface, where the chip has one or more integrated circuits and bumps. The device also includes a thermal spreader thermally coupled to the coupling surface of the chip for dissipating heat generated by the chip, and a thermal interface material located between the thermal spreader and the coupling surface of the chip for improving the heat dissipation. In addition, the device also includes a boundary material located between the thermal spreader and the coupling surface of the chip, where the boundary material is configured to surround a perimeter of the thermal interface material to maintain the thermal interface material between the thermal spreader and the coupling surface of the chip.

Abstract translation: 描述了具有改进的可靠性的半导体封装器件及其制造方法。 在一个实施例中，公开了一种封装器件，其包括具有有源表面和与有源表面相对的耦合表面的芯片，其中芯片具有一个或多个集成电路和凸块。 该装置还包括热耦合到芯片的耦合表面的散热器，用于散发由芯片产生的热量，以及位于散热器和芯片的耦合表面之间的热界面材料，用于改善散热。 此外，该装置还包括位于散热器和芯片的耦合表面之间的边界材料，其中边界材料构造成围绕热界面材料的周边，以将热界面材料保持在散热器和 耦合表面的芯片。

公开(公告)号：US07135769B2

公开(公告)日：2006-11-14

申请号：US10907327

申请日：2005-03-29

Applicant: Ching-Yu Ni ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan

Inventor： Ching-Yu Ni ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan

IPC: H01L23/34

CPC classification number: H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Described are semiconductor package devices with improved reliability and methods of manufacturing thereof. In one embodiment, a package device is disclosed that includes a chip having an active surface and a coupling surface opposite the active surface, where the chip has one or more integrated circuits and bumps. The device also includes a thermal spreader thermally coupled to the coupling surface of the chip for dissipating heat generated by the chip, and a thermal interface material located between the thermal spreader and the coupling surface of the chip for improving the heat dissipation. In addition, the device also includes a boundary material located between the thermal spreader and the coupling surface of the chip, where the boundary material is configured to surround a perimeter of the thermal interface material to maintain the thermal interface material between the thermal spreader and the coupling surface of the chip.

公开(公告)号：US20060220225A1

公开(公告)日：2006-10-05

申请号：US10907327

申请日：2005-03-29

Applicant: Ching-Yu Ni ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan

Inventor： Ching-Yu Ni ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan

IPC: H01L23/34

CPC classification number: H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Described are semiconductor package devices with improved reliability and methods of manufacturing thereof. In one embodiment, a package device is disclosed that includes a chip having an active surface and a coupling surface opposite the active surface, where the chip has one or more integrated circuits and bumps. The device also includes a thermal spreader thermally coupled to the coupling surface of the chip for dissipating heat generated by the chip, and a thermal interface material located between the thermal spreader and the coupling surface of the chip for improving the heat dissipation. In addition, the device also includes a boundary material located between the thermal spreader and the coupling surface of the chip, where the boundary material is configured to surround a perimeter of the thermal interface material to maintain the thermal interface material between the thermal spreader and the coupling surface of the chip.

Abstract translation: 描述了具有改进的可靠性的半导体封装器件及其制造方法。 在一个实施例中，公开了一种封装器件，其包括具有有源表面和与有源表面相对的耦合表面的芯片，其中芯片具有一个或多个集成电路和凸块。 该装置还包括热耦合到芯片的耦合表面的散热器，用于散发由芯片产生的热量，以及位于散热器和芯片的耦合表面之间的热界面材料，用于改善散热。 此外，该装置还包括位于散热器和芯片的耦合表面之间的边界材料，其中边界材料构造成围绕热界面材料的周边，以将热界面材料保持在散热器和 耦合表面的芯片。