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公开(公告)号：US20180284482A1
公开(公告)日：2018-10-04
申请号：US15525286
申请日：2015-11-03
Applicant: David T. Markus , Michael C. Hayes , Arthur Back
Inventor： David T. Markus , Michael C. Hayes , Arthur Back
Abstract: Methods and apparatus are provided for adaptively focusing a lens. In one approach, electromagnetic energy is employed to modify a shape or thickness of a lens such that its refractive power and focal length are modified. In one aspect, a lens embodying adaptive focus features requires low power, and can be adjusted quickly. One or a plurality of electromagnets can be employed to compress or separate end portions of an embedded haptic, the force from which acts to alter the shape of the haptic, thus modifying the refractive power and focal length of a lens.
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公开(公告)号：US08217269B2
公开(公告)日：2012-07-10
申请号：US13213001
申请日：2011-08-18
Applicant: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zum , David T. Markus
Inventor： Stephen C. Jacobsen , David P. Marceau , Shayne M. Zum , David T. Markus
CPC classification number: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
Abstract: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
Abstract translation: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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公开(公告)号：US07787939B2
公开(公告)日：2010-08-31
申请号：US10391490
申请日：2003-03-17
Applicant: Stephen C. Jacobsen , David T. Markus , Ralph W. Pensel
Inventor： Stephen C. Jacobsen , David T. Markus , Ralph W. Pensel
IPC: A61B6/00
CPC classification number: A61B1/05 , H04N2005/2255
Abstract: The present invention is drawn toward miniaturized imaging devices. In one embodiment, the device can include a utility guide having at least one aperture configured for supporting utilities, and an SSID carried by the utility guide. The SSID can include an imaging array on a top surface, and a conductive element on a side surface, wherein the imaging array is electrically coupled to the conductive element. Further, a lens can be optically coupled to the imaging array, and an umbilical, including a conductive line, can be carried by the at least one aperture. The conductive line can be electrically coupled to the conductive element on the side surface of the SSID. Alternatively, the device can include an SSID having, as an integral structure, an imaging array electrically coupled to a conductive pad, wherein the SSID further includes at least one utility aperture passing therethrough. Further, a lens can be optically coupled to the imaging array, and an umbilical, including a conductive line carried by the at least one aperture, can be configured such that the conductive line is directly electrically coupled to the conductive pad.
Abstract translation: 本发明涉及小型化成像装置。 在一个实施例中，设备可以包括具有配置用于支持实用程序的至少一个孔的实用指南，以及由该实用指南携带的SSID。 SSID可以包括顶表面上的成像阵列和侧表面上的导电元件，其中成像阵列电耦合到导电元件。 此外，透镜可以光耦合到成像阵列，并且包括导线的脐带可以被至少一个孔承载。 导电线可以电耦合到SSID的侧表面上的导电元件。 或者，该装置可以包括SSID，SSID具有电耦合到导电垫的成像阵列作为整体结构，其中SSID还包括通过其中的至少一个效用孔。 此外，透镜可以光学耦合到成像阵列，并且包括由至少一个孔承载的导电线的脐带可以被配置为使得导线直接电耦合到导电垫。
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公开(公告)号：US20100116869A1
公开(公告)日：2010-05-13
申请号：US12615202
申请日：2009-11-09
Applicant: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
Inventor： Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
IPC: B23K31/02
CPC classification number: H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
Abstract: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
Abstract translation: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。
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Patent Agency Ranking
公开(公告)号：US07680377B2
公开(公告)日：2010-03-16
申请号：US12070580
申请日：2008-02-19
Applicant: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
Inventor： Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
IPC: G02B6/04 , H01R12/00 , H01R13/648 , H01R12/24 , H01R33/945 , H01R33/00 , C03B37/15 , G02B6/36 , G02B6/38 , G02B6/40 , G02B6/44
CPC classification number: H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
Abstract: Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
Abstract translation: 公开了用于超高密度连接的技术。 在一个实施例中，超高密度连接器包括大致平行的细长圆柱形元件束，其中每个圆柱形元件基本上与至少一个相邻的圆柱形元件接触。 细长圆柱形元件的端部相对于彼此差异地设置以限定三维交叉配合表面。 细长圆柱形元件中的至少一个具有定位成切向地接合配合连接器的相应电接触件的导电触点。
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公开(公告)号：US07591780B2
公开(公告)日：2009-09-22
申请号：US10391513
申请日：2003-03-17
Applicant: Stephen C. Jacobsen , David T. Markus , David P. Marceau , Ralph W. Pensel
Inventor： Stephen C. Jacobsen , David T. Markus , David P. Marceau , Ralph W. Pensel
IPC: A61B1/05
CPC classification number: A61B1/05 , H04N2005/2255
Abstract: A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.
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公开(公告)号：US09459469B2
公开(公告)日：2016-10-04
申请号：US14668957
申请日：2015-03-25
Applicant: David T. Markus , Michael C. Hayes
Inventor： David T. Markus , Michael C. Hayes
CPC classification number: G02C7/04 , A45C11/005 , G02C11/10
Abstract: The present invention will provide a vision correction device which makes use of wireless transmissions and/or wireless charging to transfer data between the vision correction device and an external device. More specifically, the present invention will incorporate radio frequency technology onto a contact lens, including passive and active embodiments, and may further include wireless charging capability. This is accomplished by positioning an extremely small RF device onto a contact lens, along with an antenna and/or battery, and using a fluid medium to enhance the signal to and from an external device.
Abstract translation: 本发明将提供一种使用无线传输和/或无线计费在视力矫正装置与外部装置之间传送数据的视力矫正装置。 更具体地，本发明将射频技术结合到隐形眼镜上，包括无源和主动实施例，并且还可以包括无线充电能力。 这通过将极小的射频设备与天线和/或电池一起定位在隐形眼镜上，并且使用流体介质来增强到外部设备的信号和从外部设备的信号来实现。
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公开(公告)号：US20100112865A1
公开(公告)日：2010-05-06
申请号：US12604295
申请日：2009-10-22
Applicant: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
Inventor： Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
IPC: H01R13/66
CPC classification number: H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
Abstract: Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.
Abstract translation: 公开了用于超高密度连接的技术。 在一个实施例中，超高密度连接器包括大致平行的细长圆柱形元件束，其中每个圆柱形元件基本上与至少一个相邻的圆柱形元件接触。 细长圆柱形元件的端部相对于彼此差异地设置以限定三维交叉配合表面。 细长圆柱形元件中的至少一个具有定位成切向地接合配合连接器的相应电接触件的导电触点。
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公开(公告)号：US07603153B2
公开(公告)日：2009-10-13
申请号：US11637508
申请日：2006-12-11
Applicant: Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
Inventor： Stephen C. Jacobsen , David P. Marceau , Shayne M. Zurn , David T. Markus
CPC classification number: H01R11/18 , A61B5/04001 , A61B5/6868 , A61B5/6877 , A61N1/0529 , A61N1/0551 , H01R2201/12 , Y10T29/49117
Abstract: A multi-element probe array suitable for sensing or stimulating is disclosed. In one embodiment, the multi-element probe array includes a plurality of microfibers extending longitudinally and oriented substantially parallel to form a bundle. Probe elements are defined by a first subset of the microfibers displaced in a forward direction alone the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements and communication elements are disposed on the probe elements.
Abstract translation: 公开了一种适用于感测或刺激的多元件探针阵列。 在一个实施例中，多元件探针阵列包括多个微纤维，其纵向延伸并且基本平行地定向以形成束。 探针元件由相对于由微纤维的第二子集限定的间隔元件的纵向轴线在向前方向上移位的微纤维的第一子集限定。 接口元件和通信元件设置在探针元件上。
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