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公开(公告)号：US10928674B1
公开(公告)日：2021-02-23
申请号：US16819253
申请日：2020-03-16
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Hsien-Ying Chou , Po-Lun Chen , Nai-Hau Shiue , Chun-Ta Chen , Ta-Jen Huang , Yi-Lin Sun
IPC: G02F1/13357 , H01L25/075 , H01L33/56 , H01L33/54
Abstract: A manufacturing method using a micro-miniature LED as a light source for backlight thickness reduction and light efficiency improvement comprising a plurality of spaced apart light emitting diode chips on a substrate. Colloid with uniformly distributed diffusion particles is coated to fill gaps between LED chips. A roller is applied to the surface of the colloid and a continuous geometric structure is formed with a cone structure in the horizontal-vertical (XY axis) direction. An ultraviolet curing device is used for optical UV curing of the continuous geometric structure to create a brightness enhancement layer.
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公开(公告)号：US20200371372A1
公开(公告)日：2020-11-26
申请号：US16527148
申请日：2019-07-31
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： PO-JUNG HUNAG , CHING-HAO LIAO
Abstract: An optical component includes a housing. The housing defines a receiving cavity and includes a bottom plate and a side plate connecting a peripheral portion of the bottom plate. The optical component further includes a collimating component and a diffractive optical element (DOE) in the receiving cavity. The collimating component is configured for collimating the light into collimated light. The DOE includes a diffractive portion configured for converting the collimated light into structured light and a bezel surrounding the diffractive portion. The optical component further includes a first adhesive layer and a second adhesive layer. The first adhesive layer is between the bezel and the collimating component and contacts the side plate. The second adhesive layer filling a silt between the side plate and the collimating component.
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23.发明申请公开(公告)号：US20200343418A1
公开(公告)日：2020-10-29
申请号：US16531286
申请日：2019-08-05
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： SYUN-LONG YE , WEN-HSIAO HUANG , TA-JEN HUANG
IPC: H01L33/50 , H01L33/58 , H01L25/075 , H01L33/52 , H01L33/62
Abstract: A light emitting element, used behind a display, comprises LED chips emitting blue light and separated red and green phosphor layers on the LED chip, the layers receiving the emitted blue light and respectively converting the same into precise colors for the display. A portion of the light directly from the LED chip is also combined with the converted light and passed on as lighting for the display. Partial absorption of green light by the red phosphor and red light by the green phosphor, occurring when the red and green phosphor layers are overlapped, is avoided. Light conversion efficiency of the green and red phosphor layers is thereby improved. A light emitting assembly, a display device, and a method for making the light emitting assembly are also disclosed.
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公开(公告)号：US10749057B2
公开(公告)日：2020-08-18
申请号：US16251380
申请日：2019-01-18
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Yu-Ju Chen
IPC: H01L31/0352 , G06K9/00 , G06K9/20 , H01L31/032 , H01L31/0328 , H01L31/113 , H01L31/167 , H01L33/30
Abstract: A device for sensing suspension operations or biometrics includes a light emitting module and a sensing layer. The light emitting module and the sensing layer are sequentially stacked. The light emitting module includes a plurality of light emitting elements emitting light near the infrared and the sensing layer includes a plurality of quantum dot thin film transistors. The quantum dot thin film transistor includes an active layer and quantum dots covering the active layer. The near-infrared light emitted by the plurality of light emitting elements is reflected by an animate object and received by the quantum dot thin film transistors. The sensing device can better sense suspension operations or biometrics. A method for the procedure is also disclosed.
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公开(公告)号：US10746595B2
公开(公告)日：2020-08-18
申请号：US15972253
申请日：2018-05-07
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Chun-Hung Chen , Jing-Bing Yu , Tai-Wu Lin , Yen-Chang Yao , Ya-Ting Chang , Pang-Chiang Chia , Yen-Heng Huang
Abstract: An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.
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Patent Agency Ranking
公开(公告)号：US20200098675A1
公开(公告)日：2020-03-26
申请号：US16239575
申请日：2019-01-04
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： CHIEN-WEN CHANG , TA-JEN HUANG , YIN-CHENG CHEN
IPC: H01L23/498 , H01L23/00
Abstract: A chip on film (COF) to automatically allow for a shifting in the positions of conductive pins connecting the chip and a display panel includes pins sequentially arranged along a first direction and spaced apart from each other. Each pin includes a first end and a second end, and each pin defines a virtual extension line extending from its first end to its second end. The virtual extension lines of at least some of the pins obliquely converge on a reference line that is perpendicular to the first direction. A display panel includes pins which are created and installed to match the pins of the COF. A display device and a method for designing, creating, and installing such pins are also provided.
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公开(公告)号：US20200076808A1
公开(公告)日：2020-03-05
申请号：US16186394
申请日：2018-11-09
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： HSIEN-YING CHOU , CHUN-MING CHEN , TZU-HSIANG LIN
Abstract: An electronic signing authorization method includes converting a signing request submitted by an end user into a predetermined format, verifying an identity of an authorizing user of an authorization layer according to a predetermined verification process, accepting input data of the authorizing user of the authorization layer when the identity of the authorizing user of the authorization layer is verified, and outputting an authorization command according to the input data when the input data includes authorization data. The predetermined format includes at least one of a text format, an audio format, or a video format. The authorization command corresponds to rejecting the signing request, not authorizing the signing request, or authorizing the signing request.
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公开(公告)号：US10558283B2
公开(公告)日：2020-02-11
申请号：US15980139
申请日：2018-05-15
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Yong Luo , Shang-Yu Huang
Abstract: A touch-control photosensitive structure for preventing red light leakage includes a metal substrate, an insulating layer, a photosensitive layer, a third metal layer and a transparent conductive layer. The insulating layer is disposed on the metal substrate. The photosensitive layer is disposed on the insulating layer. The photosensitive layer at least comprises red photosensitive blocks, green photosensitive blocks and blue photosensitive blocks, arranged alternately. A junction region is disposed at the junction of the photosensitive blocks in different colors. The third metal layer is disposed on the junction region. The third metal layer has a lower surface which a light absorption layer is disposed on. The light absorption layer absorbs a reflecting light otherwise reflecting off the metal substrate and the third metal layer and propagating therebetween. The transparent conductive layer is disposed on the third metal layer. The third metal layer reduces impedance of the transparent conductive layer efficiently and thereby renders public voltage stable. The light absorption layer absorbs the reflecting light and thereby prevents light leakage.
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29.发明授权公开(公告)号：US10534470B2
公开(公告)日：2020-01-14
申请号：US16014172
申请日：2018-06-21
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Chien-Hung Lin
Abstract: A force touch sensing structure which is immune to changes in sensitivity caused by external factors defines a force touch sensing area. The force touch sensing structure includes protrusions in the force touch sensing area, at least one image recognition camera, and a processor. A height of at least one protrusion varies when the force touch sensing area is force touched. The image recognition camera detects positions of the height-varied protrusions and the extent of the variations. The processor receives and processes signals from the at least one image recognition camera to obtain force touch position and touch force.
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公开(公告)号：US20190370519A1
公开(公告)日：2019-12-05
申请号：US16053785
申请日：2018-08-02
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Yu-Pi KUO , Chung-Wu LIU , Chun-Te CHANG , Sin-Cheng LIN , Wan-Heng LIN , Shih-Chieh HUANG
Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.
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